KR890017555A - 광 반도체장치 - Google Patents

광 반도체장치

Info

Publication number
KR890017555A
KR890017555A KR1019890006330A KR890006330A KR890017555A KR 890017555 A KR890017555 A KR 890017555A KR 1019890006330 A KR1019890006330 A KR 1019890006330A KR 890006330 A KR890006330 A KR 890006330A KR 890017555 A KR890017555 A KR 890017555A
Authority
KR
South Korea
Prior art keywords
semiconductor device
optical semiconductor
optical
semiconductor
Prior art date
Application number
KR1019890006330A
Other languages
English (en)
Other versions
KR930000330B1 (ko
Inventor
타케시 세끼구찌
노부오 시가
케이고 아가
Original Assignee
스미도모덴기고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63118946A external-priority patent/JP2582120B2/ja
Priority claimed from JP63118947A external-priority patent/JP2737151B2/ja
Application filed by 스미도모덴기고오교오 가부시기가이샤 filed Critical 스미도모덴기고오교오 가부시기가이샤
Publication of KR890017555A publication Critical patent/KR890017555A/ko
Application granted granted Critical
Publication of KR930000330B1 publication Critical patent/KR930000330B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
KR1019890006330A 1988-05-16 1989-05-11 광 반도체장치 KR930000330B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63-118947 1988-05-16
JP63-118946 1988-05-16
JP63118946A JP2582120B2 (ja) 1988-05-16 1988-05-16 光半導体装置
JP63118947A JP2737151B2 (ja) 1988-05-16 1988-05-16 光半導体装置

Publications (2)

Publication Number Publication Date
KR890017555A true KR890017555A (ko) 1989-12-16
KR930000330B1 KR930000330B1 (ko) 1993-01-15

Family

ID=26456773

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890006330A KR930000330B1 (ko) 1988-05-16 1989-05-11 광 반도체장치

Country Status (4)

Country Link
EP (1) EP0342594B1 (ko)
KR (1) KR930000330B1 (ko)
CA (1) CA1303712C (ko)
DE (1) DE68917367T2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783080B2 (ja) * 1990-01-18 1995-09-06 株式会社東芝 半導体装置用部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2322465A1 (fr) * 1975-08-29 1977-03-25 Doloise Metallurgique Dispositif de raccordement pour composants munis de fiches
JPS60165749A (ja) * 1984-02-08 1985-08-28 Fujitsu Ltd Ｌｓｉモジユ−ル用接続ピン

Also Published As

Publication number Publication date
CA1303712C (en) 1992-06-16
KR930000330B1 (ko) 1993-01-15
DE68917367D1 (de) 1994-09-15
EP0342594A3 (en) 1990-06-13
EP0342594A2 (en) 1989-11-23
DE68917367T2 (de) 1995-04-27
EP0342594B1 (en) 1994-08-10

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19960112

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee