DE68914779D1 - Akustische Oberflächenwellenfilteranordnung. - Google Patents

Akustische Oberflächenwellenfilteranordnung.

Info

Publication number
DE68914779D1
DE68914779D1 DE68914779T DE68914779T DE68914779D1 DE 68914779 D1 DE68914779 D1 DE 68914779D1 DE 68914779 T DE68914779 T DE 68914779T DE 68914779 T DE68914779 T DE 68914779T DE 68914779 D1 DE68914779 D1 DE 68914779D1
Authority
DE
Germany
Prior art keywords
wave filter
surface wave
filter arrangement
acoustic surface
acoustic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68914779T
Other languages
English (en)
Other versions
DE68914779T2 (de
Inventor
Satoshi Wakamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE68914779D1 publication Critical patent/DE68914779D1/de
Application granted granted Critical
Publication of DE68914779T2 publication Critical patent/DE68914779T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE68914779T 1988-10-31 1989-10-30 Akustische Oberflächenwellenfilteranordnung. Expired - Fee Related DE68914779T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27296488 1988-10-31

Publications (2)

Publication Number Publication Date
DE68914779D1 true DE68914779D1 (de) 1994-05-26
DE68914779T2 DE68914779T2 (de) 1994-12-01

Family

ID=17521243

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68914779T Expired - Fee Related DE68914779T2 (de) 1988-10-31 1989-10-30 Akustische Oberflächenwellenfilteranordnung.

Country Status (3)

Country Link
US (1) US5162822A (de)
EP (1) EP0367181B1 (de)
DE (1) DE68914779T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202652A (en) * 1989-10-13 1993-04-13 Hitachi, Ltd. Surface acoustic wave filter device formed on a plurality of piezoelectric substrates
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
JPH0590872A (ja) * 1991-09-27 1993-04-09 Sumitomo Electric Ind Ltd 表面弾性波素子
US5237235A (en) * 1991-09-30 1993-08-17 Motorola, Inc. Surface acoustic wave device package
USRE40036E1 (en) * 1991-10-28 2008-01-29 Fujitsu Limited Surface acoustic wave filter
US5313177A (en) * 1992-04-06 1994-05-17 Motorola, Inc. Method and apparatus for an acoustic wave filter
US5867074A (en) * 1994-03-02 1999-02-02 Seiko Epson Corporation Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit
JPH07297675A (ja) * 1994-04-26 1995-11-10 Fujitsu Ltd 弾性表面波共振器
FI952093A0 (fi) 1994-05-02 1995-05-02 Siemens Matsushita Components Kapsling foer med akustiska ytvaogefunktionerande byggelement
WO1996015587A1 (fr) 1994-11-10 1996-05-23 Fujitsu Limited Filtre a ondes acoustiques
JPH08288790A (ja) * 1995-04-10 1996-11-01 Fujitsu Ltd 素子用基板、圧電振動装置及び弾性表面波装置
JP3306272B2 (ja) * 1995-10-20 2002-07-24 富士通株式会社 弾性表面波装置
EP0794616B1 (de) * 1996-03-08 2003-01-29 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
JP3239064B2 (ja) * 1996-05-28 2001-12-17 富士通株式会社 弾性表面波装置
JP3711846B2 (ja) * 2000-07-27 2005-11-02 株式会社村田製作所 高周波モジュール及びそれを用いた移動体通信装置
JP3386043B2 (ja) * 2000-08-09 2003-03-10 株式会社村田製作所 弾性表面波デバイス
EP1202455A3 (de) * 2000-10-31 2004-09-15 Agilent Technologies, Inc. (a Delaware corporation) Verfahren zum Verpacken von Duplexern unter Gebrauch von akustischen Dünnfilmvolumenresonatoren
WO2002039583A1 (en) 2000-11-09 2002-05-16 Koninklijke Philips Electronics N.V. Electronic device, semiconductor device comprising such a device and method of manufacturing such a device
JP4747409B2 (ja) * 2000-11-09 2011-08-17 ソニー株式会社 受信装置
TWI292628B (en) * 2001-03-29 2008-01-11 Furukawa Electric Co Ltd Optical fiber module lead frame and optical fiber module
US20030080832A1 (en) * 2001-05-30 2003-05-01 Enshasy Hesham M. Single chip scale package
US7280008B2 (en) * 2002-01-24 2007-10-09 Mitsubishi Materials Corporation Printed-circuit board, electronic part having shield structure, and radio communication apparatus
US6924716B2 (en) * 2003-07-10 2005-08-02 Motorola, Inc. Method and apparatus for reduction of electromagnetic feed through in a SAW filter
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US7432783B2 (en) * 2004-04-30 2008-10-07 Sanyo Electric Co., Ltd. Filter device substrate and filter device
JP4587732B2 (ja) * 2004-07-28 2010-11-24 京セラ株式会社 弾性表面波装置
EP1867980A4 (de) * 2005-04-06 2014-03-05 Murata Manufacturing Co Oberflächenwellensensorvorrichtung
JP3115597U (ja) * 2005-08-09 2005-11-10 Ｕｒｏ電子工業株式会社 面実装用トランス
US8493744B2 (en) * 2007-04-03 2013-07-23 Tdk Corporation Surface mount devices with minimum lead inductance and methods of manufacturing the same
JP5458300B2 (ja) * 2009-02-09 2014-04-02 公立大学法人横浜市立大学 微細構造物の蒸着装置及び方法
JP2012217136A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイスの製造方法、およびこの方法で製造した圧電デバイス
WO2023145483A1 (ja) * 2022-01-26 2023-08-03 株式会社大真空 圧電振動子及び圧電振動デバイス

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885173A (en) * 1973-10-09 1975-05-20 Magnavox Co Apparatus and method for coupling an acoustical surface wave device to an electronic circuit
JPS582484B2 (ja) * 1976-02-26 1983-01-17 ソニー株式会社 表面波装置
JPS53125861U (de) * 1977-03-17 1978-10-06
JPS5852369B2 (ja) * 1979-09-10 1983-11-22 株式会社東芝 表面波フイルタ素子用回路基板
JPS5694815A (en) * 1979-12-28 1981-07-31 Matsushita Electric Ind Co Ltd Elastic surface wave device
JPS56132807A (en) * 1980-03-24 1981-10-17 Hitachi Ltd Surface wave circuit equipment
JPS5733817A (en) * 1980-08-07 1982-02-24 Clarion Co Ltd Saw element mount structure
JPS5758907A (en) * 1980-09-29 1982-04-09 Hitachi Ltd Hydraulic cylinder for rolling mill
JPS57202114A (en) * 1981-06-05 1982-12-10 Hitachi Ltd Band pass filter
JPS5925524A (ja) * 1982-07-31 1984-02-09 株式会社正興電機製作所 Ｖ／ｆ方式デイジタル保護継電器
JPS60127813A (ja) * 1983-12-14 1985-07-08 Matsushita Electric Ind Co Ltd 表面波フイルタ
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
JPS60256217A (ja) * 1984-06-01 1985-12-17 Matsushita Electric Ind Co Ltd 表面波フイルタ
JPS6192014A (ja) * 1984-10-11 1986-05-10 Matsushita Electric Ind Co Ltd 表面波デバイスの製造方法
US4845397A (en) * 1984-12-19 1989-07-04 Tektronix, Inc. Constraining mount system for surface acoustic wave devices
JPS61245709A (ja) * 1985-04-24 1986-11-01 Matsushita Electric Ind Co Ltd 表面波フイルタの製造方法
JPS62142422A (ja) * 1985-12-17 1987-06-25 Matsushita Electric Ind Co Ltd フイルタ装置
JPS63102410A (ja) * 1986-10-17 1988-05-07 Matsushita Electric Ind Co Ltd 表面波フイルタ製造法
JPS63111713A (ja) * 1986-10-29 1988-05-17 Matsushita Electric Ind Co Ltd 表面波フイルタ

Also Published As

Publication number Publication date
EP0367181B1 (de) 1994-04-20
DE68914779T2 (de) 1994-12-01
EP0367181A2 (de) 1990-05-09
US5162822A (en) 1992-11-10
EP0367181A3 (en) 1990-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee