JP3115597U - 面実装用トランス - Google Patents
面実装用トランス Download PDFInfo
- Publication number
- JP3115597U JP3115597U JP2005006431U JP2005006431U JP3115597U JP 3115597 U JP3115597 U JP 3115597U JP 2005006431 U JP2005006431 U JP 2005006431U JP 2005006431 U JP2005006431 U JP 2005006431U JP 3115597 U JP3115597 U JP 3115597U
- Authority
- JP
- Japan
- Prior art keywords
- transformer
- winding
- wiring pattern
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004804 winding Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 239000002184 metal Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F2017/067—Core with two or more holes to lead through conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
【解決手段】フェライトコアに巻線が巻装されて構成されたトランス本体10と、前記トランス本体を載置するのに必要な大きさを有する絶縁基板21の少なくとも一面に配線パターンが形成され、かつ前記絶縁基板の周囲に巻線の端部を接続するための接続用端子22が形成された台座20とをそなえた面実装用トランス。
【選択図】図1
Description
フェライトコアに巻線が巻装されて構成されたトランス本体と、
前記トランス本体を載置するのに必要な大きさを有する絶縁基板の少なくとも一面に配線パターンが形成され、かつ前記絶縁基板の周囲に前記巻線の端部を接続するための接続用端子が形成された台座と
をそなえた面実装用トランス、
を提供するものである。
巻線12の端部が台座20の部品載置部21の周縁に設けられた接続端子22に巻き付けられ、半田仕上げされている。
11 フェライトコア
12 巻線
20 台座
21 部品載置部
22 接続端子
30 プリント配線板
40 金属板
Claims (5)
- フェライトコアに巻線が巻装されて構成されたトランス本体と、
前記トランス本体を載置するのに必要な大きさを有する絶縁基板の少なくとも一面に配線パターンが形成され、かつ前記絶縁基板の周囲に前記巻線の端部を接続するための接続用端子が形成された台座と
をそなえた面実装用トランス。 - 請求項1記載の面実装用トランスにおいて、
前記絶縁基板は、両面に配線パターンを有することを特徴とする面実装用トランス。 - 請求項1記載の面実装用トランスにおいて、
前記巻線の端部は、前記接続用端子に半田付けされたことを特徴とする面実装用トランス。 - 請求項1記載の面実装用トランスにおいて、
前記接続用端子は、前記配線パターンを用いたものであることを特徴とする面実装用トランス。 - 請求項1記載の面実装用トランスにおいて、
前記配線パターンを前記絶縁基板の両面に設け、
前記配線パターンの一方をアースパターンとし、他方の配線パターンは面積を調整可能としたことを特徴とする面実装用トランス。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005006431U JP3115597U (ja) | 2005-08-09 | 2005-08-09 | 面実装用トランス |
US11/435,786 US20070035372A1 (en) | 2005-08-09 | 2006-05-18 | Surface mount transformer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005006431U JP3115597U (ja) | 2005-08-09 | 2005-08-09 | 面実装用トランス |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3115597U true JP3115597U (ja) | 2005-11-10 |
Family
ID=37742019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005006431U Expired - Fee Related JP3115597U (ja) | 2005-08-09 | 2005-08-09 | 面実装用トランス |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070035372A1 (ja) |
JP (1) | JP3115597U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146732A (ja) * | 2008-02-29 | 2011-07-28 | Tdk Corp | バルントランス |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140082355A (ko) * | 2012-12-24 | 2014-07-02 | 삼성전기주식회사 | 인덕터 및 그 제조방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142422A (ja) * | 1985-12-17 | 1987-06-25 | Matsushita Electric Ind Co Ltd | フイルタ装置 |
US5162822A (en) * | 1988-10-31 | 1992-11-10 | Hitachi, Ltd. | Saw filter chip mounted on a substrate with shielded conductors on opposite surfaces |
KR100325526B1 (ko) * | 1998-10-26 | 2002-04-17 | 윤종용 | 잉크 분사 장치의 제조 방법 |
EP1202455A3 (en) * | 2000-10-31 | 2004-09-15 | Agilent Technologies, Inc. (a Delaware corporation) | A packaging methodology for duplexers using fbars |
JP2006013054A (ja) * | 2004-06-24 | 2006-01-12 | Citizen Electronics Co Ltd | Smd型コイルパッケージの製造方法 |
-
2005
- 2005-08-09 JP JP2005006431U patent/JP3115597U/ja not_active Expired - Fee Related
-
2006
- 2006-05-18 US US11/435,786 patent/US20070035372A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146732A (ja) * | 2008-02-29 | 2011-07-28 | Tdk Corp | バルントランス |
Also Published As
Publication number | Publication date |
---|---|
US20070035372A1 (en) | 2007-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20050116875A1 (en) | Antenna device suitable for miniaturization | |
EP1694104B1 (en) | Surface-mounting type electronic circuit unit | |
JP2004159288A (ja) | アンテナ装置、プリント配線板、プリント基板、通信アダプタおよび携帯型電子機器 | |
JP3814271B2 (ja) | アンテナ装置 | |
JP3218900U (ja) | フィルタコネクタ | |
US7098531B2 (en) | Jumper chip component and mounting structure therefor | |
JP3115597U (ja) | 面実装用トランス | |
JP2008084964A (ja) | 高周波ユニットの製造方法、及び高周波ユニット | |
US6784780B2 (en) | Coupling adjusting structure for double-tuned circuit | |
JPWO2019215922A1 (ja) | コネクタ | |
US6906603B2 (en) | High-frequency module for commonality of circuit board | |
JP3068724B2 (ja) | トロイダル巻線部品の表面実装用マウント | |
JP2004159287A (ja) | アンテナ装置、プリント基板、通信アダプタおよび携帯型電子機器 | |
JP4103466B2 (ja) | 高周波コネクタの表面実装方法及び高周波コネクタ実装プリント基板並びにプリント基板 | |
JP3794874B2 (ja) | 送受信ユニット | |
JPH08162846A (ja) | プリントアンテナ | |
JP3928152B2 (ja) | プリント配線板 | |
JPS6210056B2 (ja) | ||
JP2003347818A (ja) | 無線通信機用内蔵アンテナ | |
JP3936562B2 (ja) | 複同調回路の結合調整構造 | |
JP2008135808A (ja) | アンテナと、このアンテナを用いたアンテナ装置、およびこのアンテナ装置の製造方法 | |
JP4043242B2 (ja) | 面実装型の電子回路ユニット | |
JP4160948B2 (ja) | アンテナ装置 | |
JP4397134B2 (ja) | 複同調回路の結合調整構造 | |
KR200274707Y1 (ko) | 인쇄회로기판의 표면실장 구조 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080928 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090928 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090928 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100928 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110928 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110928 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120928 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130928 Year of fee payment: 8 |
|
LAPS | Cancellation because of no payment of annual fees |