DE60325809D1 - Verwendung einer wässrigen Dispersion zum chemisch-mechanischen Polieren und Verfahren zur Herstellung einer Halbleiteranordnung - Google Patents

Verwendung einer wässrigen Dispersion zum chemisch-mechanischen Polieren und Verfahren zur Herstellung einer Halbleiteranordnung

Info

Publication number
DE60325809D1
DE60325809D1 DE60325809T DE60325809T DE60325809D1 DE 60325809 D1 DE60325809 D1 DE 60325809D1 DE 60325809 T DE60325809 T DE 60325809T DE 60325809 T DE60325809 T DE 60325809T DE 60325809 D1 DE60325809 D1 DE 60325809D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor device
aqueous dispersion
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60325809T
Other languages
English (en)
Inventor
Tomohisa Konno
Masayuki Motonari
Masayuki Hattori
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60325809D1 publication Critical patent/DE60325809D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60325809T 2002-08-02 2003-07-31 Verwendung einer wässrigen Dispersion zum chemisch-mechanischen Polieren und Verfahren zur Herstellung einer Halbleiteranordnung Expired - Lifetime DE60325809D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002225906 2002-08-02

Publications (1)

Publication Number Publication Date
DE60325809D1 true DE60325809D1 (de) 2009-03-05

Family

ID=30112992

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60325809T Expired - Lifetime DE60325809D1 (de) 2002-08-02 2003-07-31 Verwendung einer wässrigen Dispersion zum chemisch-mechanischen Polieren und Verfahren zur Herstellung einer Halbleiteranordnung

Country Status (6)

Country Link
US (1) US20040162011A1 (de)
EP (1) EP1386949B1 (de)
KR (1) KR100682420B1 (de)
CN (1) CN1290961C (de)
DE (1) DE60325809D1 (de)
TW (1) TWI280902B (de)

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JP2004253775A (ja) * 2003-01-31 2004-09-09 Nec Electronics Corp 化学機械的研磨方法
TWI292931B (en) * 2003-05-12 2008-01-21 Jsr Corp Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
TWI291987B (en) * 2003-07-04 2008-01-01 Jsr Corp Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US20050028450A1 (en) * 2003-08-07 2005-02-10 Wen-Qing Xu CMP slurry
US7128227B2 (en) 2003-09-22 2006-10-31 Polytop Corporation Dispensing closure with stop wall for positive alignment on container
EP1670047B1 (de) * 2003-09-30 2010-04-07 Fujimi Incorporated Polierzusammensetzung und polierverfahren
US7514363B2 (en) * 2003-10-23 2009-04-07 Dupont Air Products Nanomaterials Llc Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
US7247566B2 (en) * 2003-10-23 2007-07-24 Dupont Air Products Nanomaterials Llc CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
JP2006100538A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 研磨用組成物及びそれを用いた研磨方法
KR100623963B1 (ko) * 2005-01-12 2006-09-19 제일모직주식회사 금속배선 연마용 슬러리 조성물 및 이를 이용한 금속배선연마 방법
DE602006002900D1 (de) * 2005-03-09 2008-11-13 Jsr Corp Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren
US7311856B2 (en) 2005-03-30 2007-12-25 Cabot Microelectronics Corporation Polymeric inhibitors for enhanced planarization
CN1865385B (zh) * 2005-05-17 2011-01-05 安集微电子（上海）有限公司 抛光浆料
US20060276041A1 (en) * 2005-05-17 2006-12-07 Jsr Corporation Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
US20080171441A1 (en) * 2005-06-28 2008-07-17 Asahi Glass Co., Ltd. Polishing compound and method for producing semiconductor integrated circuit device
CN102863943B (zh) 2005-08-30 2015-03-25 花王株式会社 硬盘用基板用研磨液组合物、基板的研磨方法和制造方法
FR2890658B1 (fr) * 2005-09-09 2012-04-13 Kemesys Composition de polissage mecano chimique, procede de preparation et utilisation
EP1936673A4 (de) * 2005-10-12 2011-01-05 Hitachi Chemical Co Ltd Polierlösung für cmp und polierverfahren
KR100786949B1 (ko) * 2005-12-08 2007-12-17 주식회사 엘지화학 연마 선택도 조절 보조제 및 이를 함유한 ｃｍｐ 슬러리
WO2007069588A1 (ja) * 2005-12-12 2007-06-21 Dic Corporation 水性塗料組成物、有機無機複合塗膜及びその製造方法
CN101184817B (zh) * 2006-03-31 2011-04-06 卡伯特微电子公司 用于提高平坦化的聚合物抑制剂
JP5403924B2 (ja) * 2008-02-29 2014-01-29 富士フイルム株式会社 金属用研磨液、および化学的機械的研磨方法
CN101906359A (zh) * 2009-06-08 2010-12-08 安集微电子科技(上海)有限公司 一种化学机械抛光清洗液
CN102741985B (zh) * 2010-02-01 2015-12-16 Jsr株式会社 化学机械研磨用水系分散体及利用其的化学机械研磨方法
JP5877940B2 (ja) * 2010-04-08 2016-03-08 株式会社フジミインコーポレーテッド 銅及びシリコンが表面に露出したウェーハの研磨方法
CN101974297A (zh) * 2010-11-12 2011-02-16 大连三达奥克化学股份有限公司 核/壳型复合纳米磨料铜化学机械抛光液
JPWO2013021946A1 (ja) * 2011-08-09 2015-03-05 株式会社フジミインコーポレーテッド 化合物半導体研磨用組成物
WO2016024177A1 (en) 2014-08-11 2016-02-18 Basf Se Chemical-mechanical polishing composition comprising organic/inorganic composite particles
US20170183537A1 (en) * 2014-08-26 2017-06-29 K.C. Tech Co., Ltd Polishing slurry composition
CN107109133B (zh) * 2014-12-22 2021-04-13 巴斯夫欧洲公司 化学机械抛光(cmp)组合物在抛光包含钴和/或钴合金的基材中的用途
JP7019038B2 (ja) * 2018-06-05 2022-02-14 帝人株式会社 複合粒子及びその製造方法
CN113122146B (zh) * 2019-12-31 2024-04-12 安集微电子（上海）有限公司 一种化学机械抛光液及其使用方法
KR102410845B1 (ko) * 2021-01-08 2022-06-22 에스케이씨솔믹스 주식회사 반도체 공정용 조성물 및 이를 이용한 반도체 소자 제조방법

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US5942015A (en) * 1997-09-16 1999-08-24 3M Innovative Properties Company Abrasive slurries and abrasive articles comprising multiple abrasive particle grades
JP4505891B2 (ja) * 1999-09-06 2010-07-21 Ｊｓｒ株式会社 半導体装置の製造に用いる化学機械研磨用水系分散体
JP4075247B2 (ja) * 1999-09-30 2008-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体
KR100444239B1 (ko) * 1999-11-22 2004-08-11 제이에스알 가부시끼가이샤 복합화 입자의 제조 방법, 이 방법에 의해 제조되는복합화 입자 및 이 복합화 입자를 함유하는 화학 기계연마용 수계 분산체, 및 화학 기계 연마용 수계 분산체의제조 방법
TW572980B (en) * 2000-01-12 2004-01-21 Jsr Corp Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
TWI296006B (de) * 2000-02-09 2008-04-21 Jsr Corp
JP2001269859A (ja) * 2000-03-27 2001-10-02 Jsr Corp 化学機械研磨用水系分散体
JP4078787B2 (ja) * 2000-03-31 2008-04-23 Ｊｓｒ株式会社 化学機械研磨用水系分散体
US6416685B1 (en) * 2000-04-11 2002-07-09 Honeywell International Inc. Chemical mechanical planarization of low dielectric constant materials
JP3837277B2 (ja) * 2000-06-30 2006-10-25 株式会社東芝 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法
JP3993369B2 (ja) * 2000-07-14 2007-10-17 株式会社東芝 半導体装置の製造方法
US6645624B2 (en) * 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
JP4187497B2 (ja) * 2002-01-25 2008-11-26 Ｊｓｒ株式会社 半導体基板の化学機械研磨方法
US20030168627A1 (en) * 2002-02-22 2003-09-11 Singh Rajiv K. Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
US6896591B2 (en) * 2003-02-11 2005-05-24 Cabot Microelectronics Corporation Mixed-abrasive polishing composition and method for using the same

Also Published As

Publication number Publication date
TWI280902B (en) 2007-05-11
EP1386949A3 (de) 2004-04-07
KR20040012588A (ko) 2004-02-11
CN1290961C (zh) 2006-12-20
US20040162011A1 (en) 2004-08-19
EP1386949B1 (de) 2009-01-14
EP1386949A2 (de) 2004-02-04
TW200403131A (en) 2004-03-01
CN1495244A (zh) 2004-05-12
KR100682420B1 (ko) 2007-02-15

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