FR2890658B1 - Composition de polissage mecano chimique, procede de preparation et utilisation - Google Patents
Composition de polissage mecano chimique, procede de preparation et utilisationInfo
- Publication number
- FR2890658B1 FR2890658B1 FR0509241A FR0509241A FR2890658B1 FR 2890658 B1 FR2890658 B1 FR 2890658B1 FR 0509241 A FR0509241 A FR 0509241A FR 0509241 A FR0509241 A FR 0509241A FR 2890658 B1 FR2890658 B1 FR 2890658B1
- Authority
- FR
- France
- Prior art keywords
- mecano
- chemical
- preparation
- polishing composition
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0509241A FR2890658B1 (fr) | 2005-09-09 | 2005-09-09 | Composition de polissage mecano chimique, procede de preparation et utilisation |
PCT/FR2006/002058 WO2007028898A1 (fr) | 2005-09-09 | 2006-09-06 | Composition de polissage mecano chimique, procede de preparation et utilisation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0509241A FR2890658B1 (fr) | 2005-09-09 | 2005-09-09 | Composition de polissage mecano chimique, procede de preparation et utilisation |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2890658A1 FR2890658A1 (fr) | 2007-03-16 |
FR2890658B1 true FR2890658B1 (fr) | 2012-04-13 |
Family
ID=36581804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0509241A Expired - Fee Related FR2890658B1 (fr) | 2005-09-09 | 2005-09-09 | Composition de polissage mecano chimique, procede de preparation et utilisation |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2890658B1 (fr) |
WO (1) | WO2007028898A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2947481B1 (fr) | 2009-07-03 | 2011-08-26 | Commissariat Energie Atomique | Procede de collage cuivre-cuivre simplifie |
CN111537318A (zh) * | 2020-03-31 | 2020-08-14 | 先导薄膜材料(广东)有限公司 | 一种铜镓合金的金相显示方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630433B2 (en) * | 1999-07-19 | 2003-10-07 | Honeywell International Inc. | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
US6355075B1 (en) * | 2000-02-11 | 2002-03-12 | Fujimi Incorporated | Polishing composition |
US20040162011A1 (en) * | 2002-08-02 | 2004-08-19 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device |
-
2005
- 2005-09-09 FR FR0509241A patent/FR2890658B1/fr not_active Expired - Fee Related
-
2006
- 2006-09-06 WO PCT/FR2006/002058 patent/WO2007028898A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2007028898A1 (fr) | 2007-03-15 |
FR2890658A1 (fr) | 2007-03-16 |
WO2007028898B1 (fr) | 2007-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160531 |