DE60316669D1 - Mit säure abbaubare harzzusammensetzungen mit ketenaldehyd-copolymer - Google Patents

Mit säure abbaubare harzzusammensetzungen mit ketenaldehyd-copolymer

Info

Publication number
DE60316669D1
DE60316669D1 DE60316669T DE60316669T DE60316669D1 DE 60316669 D1 DE60316669 D1 DE 60316669D1 DE 60316669 T DE60316669 T DE 60316669T DE 60316669 T DE60316669 T DE 60316669T DE 60316669 D1 DE60316669 D1 DE 60316669D1
Authority
DE
Germany
Prior art keywords
acid
polymer
hydrocarbon
dehyde
compositions containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316669T
Other languages
English (en)
Other versions
DE60316669T2 (de
Inventor
Takeshi Endo
Fumio Sanda
Atsushi Sudo
Hideo Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Soda Co Ltd
Original Assignee
Nippon Soda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Soda Co Ltd filed Critical Nippon Soda Co Ltd
Publication of DE60316669D1 publication Critical patent/DE60316669D1/de
Application granted granted Critical
Publication of DE60316669T2 publication Critical patent/DE60316669T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/005—Polyesters prepared from ketenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0033—Additives activating the degradation of the macromolecular compound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
DE60316669T 2002-02-15 2003-02-14 Mit säure abbaubare harzzusammensetzungen mit ketenaldehyd-copolymer Expired - Lifetime DE60316669T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002038044 2002-02-15
JP2002038044 2002-02-15
JP2002055276 2002-03-01
JP2002055276 2002-03-01
PCT/JP2003/001536 WO2003069412A1 (fr) 2002-02-15 2003-02-14 Compositions de resine degradables sous l'effet d'acide et a base de copolymere cetene-aldehyde

Publications (2)

Publication Number Publication Date
DE60316669D1 true DE60316669D1 (de) 2007-11-15
DE60316669T2 DE60316669T2 (de) 2008-07-17

Family

ID=27736509

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60332060T Expired - Lifetime DE60332060D1 (de) 2002-02-15 2003-02-14 Harz mit Ketenaldehyd-Copolymer
DE60316669T Expired - Lifetime DE60316669T2 (de) 2002-02-15 2003-02-14 Mit säure abbaubare harzzusammensetzungen mit ketenaldehyd-copolymer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60332060T Expired - Lifetime DE60332060D1 (de) 2002-02-15 2003-02-14 Harz mit Ketenaldehyd-Copolymer

Country Status (8)

Country Link
US (1) US7105272B2 (de)
EP (2) EP1482361B1 (de)
JP (1) JP3935881B2 (de)
KR (1) KR100679446B1 (de)
CN (2) CN101186678B (de)
AT (2) ATE374960T1 (de)
DE (2) DE60332060D1 (de)
WO (1) WO2003069412A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4553687B2 (ja) * 2004-05-25 2010-09-29 日本曹達株式会社 ケテン、アルデヒド共重合体及びそれを含有する樹脂組成物
KR100906598B1 (ko) * 2004-12-03 2009-07-09 도오꾜오까고오교 가부시끼가이샤 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
US7927778B2 (en) * 2004-12-29 2011-04-19 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
US7951522B2 (en) * 2004-12-29 2011-05-31 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
JP2006206648A (ja) * 2005-01-25 2006-08-10 Nippon Soda Co Ltd 樹脂組成物
JP4768993B2 (ja) * 2005-01-25 2011-09-07 日本曹達株式会社 ケテン、アルデヒド共重合体からなる熱分解性ブロックコポリマー
JP4919603B2 (ja) * 2005-01-25 2012-04-18 日本曹達株式会社 ケテン、アルデヒド共重合体を含有する熱分解性樹脂
JP2006206651A (ja) * 2005-01-25 2006-08-10 Nippon Soda Co Ltd ケテン、アルデヒド共重合体を含有する分解性樹脂組成物
JP5138157B2 (ja) * 2005-05-17 2013-02-06 東京応化工業株式会社 ポジ型レジスト組成物およびレジストパターン形成方法
JP4732038B2 (ja) 2005-07-05 2011-07-27 東京応化工業株式会社 化合物、ポジ型レジスト組成物およびレジストパターン形成方法
KR100789494B1 (ko) * 2006-05-29 2007-12-28 유춘임 압축공기의 유·수(油·水)분리 장치
US8088566B2 (en) 2007-03-26 2012-01-03 Fujifilm Corporation Surface-treating agent for pattern formation and pattern-forming method using the surface-treating agent
GB0811856D0 (en) 2008-06-27 2008-07-30 Ucl Business Plc Magnetic microbubbles, methods of preparing them and their uses
KR101781517B1 (ko) 2010-09-30 2017-09-26 삼성디스플레이 주식회사 블록 공중합체 및 이를 이용한 패턴 형성 방법
JP5933339B2 (ja) * 2012-05-23 2016-06-08 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP6648452B2 (ja) * 2015-09-14 2020-02-14 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
WO2021131845A1 (ja) * 2019-12-27 2021-07-01 Jsr株式会社 感放射線性樹脂組成物及びパターン形成方法
CN111804287B (zh) * 2020-07-20 2022-04-08 兰州大学 一种芴酮型螯合树脂及其制备方法和应用
CN113307959A (zh) * 2021-06-02 2021-08-27 徐州工程学院 一种海水可降解丁二酸丁二醇共聚酯及制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3854364T2 (de) 1987-05-28 1996-04-25 Nippon Paint Co Ltd Positiv arbeitende lichtempfindliche Harzzusammensetzung.
GB8912388D0 (en) * 1989-05-30 1989-07-12 Ici Plc 3-hydroxybutyrate polymer composition
DE4102170A1 (de) 1991-01-25 1992-08-06 Danubia Petrochem Deutschland Mischung aus vorwiegend einem polyhydroxyalkanoat und einer verbindung, die mindestens zwei reaktive gruppen wie saeure- und/oder alkoholgruppen enthaelt und ein durch schmelzen der mischung hergestelltes polymerisat
KR100189468B1 (ko) * 1991-04-09 1999-06-01 양갑석 폴리-베타-하이드록시알카노에이트(pha)공중합체및그제조방법,이를생산하는미생물과pha공중합체의고분자블렌드
JP2816777B2 (ja) * 1991-08-03 1998-10-27 鐘淵化学工業株式会社 共重合体及びその製造方法
EP0545859A1 (de) * 1991-11-26 1993-06-09 Ciba-Geigy Ag Strahlungsempfindliche Zusammensetzungen
JP3243334B2 (ja) * 1993-06-10 2002-01-07 テルモ株式会社 ヒドロキシアルカノエート重合体組成物
DE4344125A1 (de) * 1993-12-23 1995-06-29 Basf Lacke & Farben Strahlenhärtbare Schutzlackierung, insbesondere für metallisierte Oberflächen
DE4444669A1 (de) * 1994-12-15 1996-06-20 Hoechst Ag Strahlungsempfindliches Gemisch
TW363986B (en) * 1997-05-12 1999-07-11 Ind Tech Res Inst A process for producing polyparahydroxy styrene derivatives
FR2781485B1 (fr) * 1998-07-21 2003-08-08 Denis Barritault Polymeres biocompatibles leur procede de preparation et les compositions les contenant
US6303266B1 (en) * 1998-09-24 2001-10-16 Kabushiki Kaisha Toshiba Resin useful for resist, resist composition and pattern forming process using the same
JP3520967B2 (ja) * 1998-09-29 2004-04-19 ダイセル化学工業株式会社 ポリエステル及びソルビン酸の製造法
JP4031593B2 (ja) * 1999-04-13 2008-01-09 太陽インキ製造株式会社 ポジ型感光性樹脂組成物
JP3738823B2 (ja) 2000-08-18 2006-01-25 信越化学工業株式会社 高分子化合物、化学増幅レジスト材料及びパターン形成方法
US6946233B2 (en) * 2001-07-24 2005-09-20 Shin-Etsu Chemical Co., Ltd. Polymer, resist material and patterning method

Also Published As

Publication number Publication date
KR100679446B1 (ko) 2007-02-06
ATE374960T1 (de) 2007-10-15
CN101186678A (zh) 2008-05-28
EP1482361A4 (de) 2005-08-31
EP1720063B1 (de) 2010-04-07
CN101186678B (zh) 2012-05-23
EP1482361B1 (de) 2007-10-03
US7105272B2 (en) 2006-09-12
KR20040088069A (ko) 2004-10-15
JP3935881B2 (ja) 2007-06-27
WO2003069412A1 (fr) 2003-08-21
CN100405220C (zh) 2008-07-23
JPWO2003069412A1 (ja) 2005-06-09
ATE463762T1 (de) 2010-04-15
EP1720063A1 (de) 2006-11-08
EP1482361A1 (de) 2004-12-01
DE60316669T2 (de) 2008-07-17
US20050130057A1 (en) 2005-06-16
DE60332060D1 (de) 2010-05-20
CN1630835A (zh) 2005-06-22

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