DE60304763D1 - Durch Wärme abziehbare druckempfindliche Klebefolie, Verarbeitungsmethode für ein elektronisches Bauteil und ein elektronisches Bauteil - Google Patents

Durch Wärme abziehbare druckempfindliche Klebefolie, Verarbeitungsmethode für ein elektronisches Bauteil und ein elektronisches Bauteil

Info

Publication number
DE60304763D1
DE60304763D1 DE60304763T DE60304763T DE60304763D1 DE 60304763 D1 DE60304763 D1 DE 60304763D1 DE 60304763 T DE60304763 T DE 60304763T DE 60304763 T DE60304763 T DE 60304763T DE 60304763 D1 DE60304763 D1 DE 60304763D1
Authority
DE
Germany
Prior art keywords
electronic component
heat
processing method
sensitive adhesive
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60304763T
Other languages
English (en)
Other versions
DE60304763T2 (de
Inventor
Kazuyuki Kiuchi
Michirou Kawanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE60304763D1 publication Critical patent/DE60304763D1/de
Application granted granted Critical
Publication of DE60304763T2 publication Critical patent/DE60304763T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
DE60304763T 2002-04-16 2003-02-10 Durch Wärme abziehbare druckempfindliche Klebefolie, Verarbeitungsmethode für ein elektronisches Bauteil und ein elektronisches Bauteil Expired - Lifetime DE60304763T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002113604 2002-04-16
JP2002113604A JP3853247B2 (ja) 2002-04-16 2002-04-16 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品

Publications (2)

Publication Number Publication Date
DE60304763D1 true DE60304763D1 (de) 2006-06-01
DE60304763T2 DE60304763T2 (de) 2006-09-14

Family

ID=28672615

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60304763T Expired - Lifetime DE60304763T2 (de) 2002-04-16 2003-02-10 Durch Wärme abziehbare druckempfindliche Klebefolie, Verarbeitungsmethode für ein elektronisches Bauteil und ein elektronisches Bauteil

Country Status (7)

Country Link
EP (1) EP1354925B1 (de)
JP (1) JP3853247B2 (de)
KR (1) KR100767890B1 (de)
CN (1) CN1262618C (de)
DE (1) DE60304763T2 (de)
SG (1) SG107634A1 (de)
TW (1) TWI255844B (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004300231A (ja) 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
PL1608717T3 (pl) † 2003-04-01 2010-09-30 De Bonding Ltd Sposób i urządzenie do spajania i oddzielania powierzchni interfejsu adhezyjnego
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP2005179496A (ja) * 2003-12-19 2005-07-07 Nitto Denko Corp 加熱剥離型粘着シート
DE102004016308A1 (de) * 2004-04-02 2005-10-20 Henkel Kgaa Klebemittel
TWI384043B (zh) * 2004-04-22 2013-02-01 Nitto Denko Corp An adhesive composition, a method for producing the same, and a use thereof
JP2006064803A (ja) * 2004-08-25 2006-03-09 Konica Minolta Opto Inc 延伸セルロースエステルフィルム、それを用いた偏光板及び液晶表示装置
JP5025141B2 (ja) * 2005-02-28 2012-09-12 株式会社半導体エネルギー研究所 半導体装置の製造方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP2007109927A (ja) 2005-10-14 2007-04-26 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP2007158025A (ja) * 2005-12-05 2007-06-21 Furukawa Electric Co Ltd:The 半導体加工用感圧型テープ
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
JP4781185B2 (ja) * 2006-07-18 2011-09-28 日東電工株式会社 耐熱ダイシングテープ又はシート
JP5027460B2 (ja) 2006-07-28 2012-09-19 東京応化工業株式会社 ウエハの接着方法、薄板化方法、及び剥離方法
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP2008115272A (ja) * 2006-11-04 2008-05-22 Nitto Denko Corp 熱剥離性両面粘着シート及び被加工体の加工方法
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
JP4733680B2 (ja) * 2007-10-31 2011-07-27 日東電工株式会社 光学フィルム用粘着剤、粘着型光学フィルム、その製造方法および画像表示装置
JP5242229B2 (ja) * 2008-04-19 2013-07-24 日東電工株式会社 加熱剥離型粘着シート
JP5456431B2 (ja) 2009-10-20 2014-03-26 日東電工株式会社 加熱剥離型粘着シート
US9458364B2 (en) * 2010-03-31 2016-10-04 Lintec Corporation Adhesive sheet
JP6042347B2 (ja) 2011-01-28 2016-12-14 クレーン アンド カンパニー インコーポレイテッド レーザマーキングされたデバイス
KR101948363B1 (ko) 2011-08-19 2019-04-22 비쥬얼 피직스 엘엘씨 두께가 감소된 선택적으로 전사가능한 광학적 시스템
JP5319857B1 (ja) * 2011-09-22 2013-10-16 リンテック株式会社 難燃粘着シート
JP2013079322A (ja) * 2011-10-04 2013-05-02 Nitto Denko Corp 加熱発泡型再剥離性粘着テープ又はシート、及び剥離方法
JP6034019B2 (ja) * 2011-12-21 2016-11-30 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
JP5921927B2 (ja) * 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
JP5950669B2 (ja) * 2012-04-16 2016-07-13 日東電工株式会社 粘着シート及び粘着剤組成物
JP6103817B2 (ja) * 2012-04-17 2017-03-29 Jsr株式会社 基材の処理方法、積層体、仮固定材、仮固定用組成物および半導体装置
KR101913436B1 (ko) * 2012-07-26 2018-10-30 도레이첨단소재 주식회사 열박리형 양면 점착 시트 및 이를 이용한 가공방법
KR102014576B1 (ko) 2012-08-17 2019-08-26 비쥬얼 피직스 엘엘씨 미세구조물을 최종 기판에 전사하기 위한 프로세스
CN103778853B (zh) * 2012-10-18 2015-10-28 瀚宇彩晶股份有限公司 易分离的电子装置
ES2728508T3 (es) 2013-03-15 2019-10-25 Visual Physics Llc Dispositivo de seguridad óptico
US9873281B2 (en) 2013-06-13 2018-01-23 Visual Physics, Llc Single layer image projection film
US10766292B2 (en) 2014-03-27 2020-09-08 Crane & Co., Inc. Optical device that provides flicker-like optical effects
CN106414102B (zh) 2014-03-27 2019-11-19 光学物理有限责任公司 产生类似闪烁的光学效果的光学设备
CN108583058B (zh) 2014-07-17 2020-11-10 光学物理有限责任公司 用于制造聚合物安全文件的改善的聚合物片材
AU2015317844B2 (en) 2014-09-16 2019-07-18 Crane Security Technologies, Inc. Secure lens layer
CN104312456B (zh) * 2014-10-28 2016-03-30 成都纳硕科技有限公司 一种木质板材用紫外光固化胶及其制备方法
WO2016076131A1 (ja) * 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
JP6947358B2 (ja) 2015-02-11 2021-10-13 クレイン アンド カンパニー、 インコーポレイテッド 基板へのセキュリティデバイスの表面貼付の方法
WO2017166116A1 (zh) * 2016-03-30 2017-10-05 宁德新能源科技有限公司 结构胶纸及其制备方法
CN107304333B (zh) * 2016-04-22 2020-01-17 宁德新能源科技有限公司 结构胶纸及其制备方法
JP2017218559A (ja) * 2016-06-10 2017-12-14 アキレス株式会社 積層粘着シート
WO2018072161A1 (zh) * 2016-10-20 2018-04-26 东莞市澳中电子材料有限公司 加热膨胀失粘型压敏胶粘带及其制作方法
WO2018081941A1 (zh) * 2016-11-02 2018-05-11 宁德新能源科技有限公司 结构胶纸及其制备方法、在电极片预留极耳空位的方法
MX2019009459A (es) 2017-02-10 2019-12-16 Crane & Co Inc Dispositivo de seguridad optico legible por maquina.
CN110476241B (zh) * 2017-03-31 2023-05-09 琳得科株式会社 半导体装置的制造方法及双面粘合片
CN112088421B (zh) * 2018-05-07 2024-10-29 琳得科株式会社 半导体芯片的制造方法
KR102247297B1 (ko) 2019-10-30 2021-05-03 (주)화인테크놀리지 수해리성 점착 테이프
US20240021443A1 (en) 2020-12-04 2024-01-18 Resonac Corporation Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device
CN116547800A (zh) 2020-12-04 2023-08-04 株式会社力森诺科 制造半导体装置的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186791A (ja) * 1987-01-27 1988-08-02 Nitto Electric Ind Co Ltd 発泡型粘着部材
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JPH07183195A (ja) * 1993-12-24 1995-07-21 Nitto Denko Corp レジスト剥離用シート類、及びそれを用いたレジストの剥離除去方法
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
CN1214391C (zh) * 2001-04-23 2005-08-10 日东电工株式会社 用于硬盘驱动器的压敏粘性标签

Also Published As

Publication number Publication date
CN1262618C (zh) 2006-07-05
JP3853247B2 (ja) 2006-12-06
JP2003306653A (ja) 2003-10-31
KR20030082361A (ko) 2003-10-22
TWI255844B (en) 2006-06-01
TW200305624A (en) 2003-11-01
EP1354925A1 (de) 2003-10-22
SG107634A1 (en) 2004-12-29
EP1354925B1 (de) 2006-04-26
CN1451707A (zh) 2003-10-29
DE60304763T2 (de) 2006-09-14
KR100767890B1 (ko) 2007-10-17

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