DE112005000839A5 - Verkapselung für ein organisches elektronisches Bauteil, Herstellungsverfahren dazu, sowie Verwendung - Google Patents

Verkapselung für ein organisches elektronisches Bauteil, Herstellungsverfahren dazu, sowie Verwendung Download PDF

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Publication number
DE112005000839A5
DE112005000839A5 DE112005000839T DE112005000839T DE112005000839A5 DE 112005000839 A5 DE112005000839 A5 DE 112005000839A5 DE 112005000839 T DE112005000839 T DE 112005000839T DE 112005000839 T DE112005000839 T DE 112005000839T DE 112005000839 A5 DE112005000839 A5 DE 112005000839A5
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DE
Germany
Prior art keywords
encapsulation
manufacturing
electronic component
organic electronic
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112005000839T
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English (en)
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DE112005000839B4 (de
Inventor
Dirk Buchhauser
Debora Henseler
Karsten Heuser
Arvid Hunze
Ralph Pätzold
Wiebke Sarfert
Carsten Tschamber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pictiva Displays International Ltd
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE112005000839A5 publication Critical patent/DE112005000839A5/de
Application granted granted Critical
Publication of DE112005000839B4 publication Critical patent/DE112005000839B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
DE112005000839.8T 2004-04-22 2005-04-13 Verkapselung für ein organisches elektronisches Bauteil sowie Verwendung Active DE112005000839B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004019643 2004-04-22
DE102004019643.5 2004-04-22
PCT/EP2005/051623 WO2005104259A2 (de) 2004-04-22 2005-04-13 Verkapselung für ein organisches elekronisches bauteil, herstellungsverfahren dazu, sowie verwendung

Publications (2)

Publication Number Publication Date
DE112005000839A5 true DE112005000839A5 (de) 2007-05-24
DE112005000839B4 DE112005000839B4 (de) 2019-01-17

Family

ID=34964305

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005000839.8T Active DE112005000839B4 (de) 2004-04-22 2005-04-13 Verkapselung für ein organisches elektronisches Bauteil sowie Verwendung

Country Status (6)

Country Link
US (2) US8288861B2 (de)
JP (1) JP2007535144A (de)
KR (1) KR20070015590A (de)
CN (1) CN1947278B (de)
DE (1) DE112005000839B4 (de)
WO (1) WO2005104259A2 (de)

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JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US20090263581A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene and boron nitride
US20090263641A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene
KR20110059563A (ko) * 2008-04-16 2011-06-02 노쓰이스트 마리타임 인스티튜트, 인코포레이티드 선박 용도 및 다른 환경에 대한 금속 및 전자 소자 코팅 방법
DE102008033017A1 (de) * 2008-07-14 2010-01-21 Osram Opto Semiconductors Gmbh Verkapseltes optoelektronisches Bauelement und Verfahren zu dessen Herstellung
TWI462978B (zh) * 2009-03-05 2014-12-01 Hzo Inc 於海洋使用和其它環境之金屬和電子元件塗覆製程
FR2938375A1 (fr) * 2009-03-16 2010-05-14 Commissariat Energie Atomique Film multicouches souple, transparent, autoporte et a effet de barriere, son procede de fabrication et dispositif optoelectronique l'incorporant
US8525397B2 (en) * 2009-09-11 2013-09-03 Koninklijke Philips N.V. OLED devices with protection cover
KR101125689B1 (ko) 2010-03-12 2012-03-27 주식회사 프로텍 Ｌｅｄ 웨이퍼 디본더
JP5412634B2 (ja) * 2010-09-14 2014-02-12 後藤電子 株式会社 有機ｅｌ表示装置および有機ｅｌ照明装置
US9761830B1 (en) * 2012-05-14 2017-09-12 Eclipse Energy Systems, Inc. Environmental protection film for thin film devices
JP6081585B2 (ja) 2012-06-18 2017-02-15 エイチズィーオー・インコーポレーテッド 耐湿性エネルギー貯蔵デバイス及び関連方法
US9565793B2 (en) * 2012-10-31 2017-02-07 Industrial Technology Research Institute Environmental sensitive electronic device package
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
KR102039808B1 (ko) 2012-12-27 2019-11-01 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
US10008689B2 (en) 2013-09-27 2018-06-26 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel
CN103500800A (zh) * 2013-09-27 2014-01-08 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制作方法
JP6363707B2 (ja) 2013-12-12 2018-07-25 カティーバ， インコーポレイテッド ハーフトーニングを用いて厚さを制御するインクベース層加工
AT516194B1 (de) * 2014-08-20 2017-11-15 Joanneum Res Forschungsgmbh Photovoltaikmodul mit integrierter lichtlenkender Struktur basierend auf interner Totalreflexion
CN104465607A (zh) * 2014-12-15 2015-03-25 贵州振华风光半导体有限公司 无引线平面表贴式微波薄膜混合集成电路及其集成方法
EP3072582A1 (de) * 2015-03-27 2016-09-28 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zum einkapseln einer nanostruktur, beschichtete nanostruktur und verwendung einer beschichteten nanostruktur
TWI701087B (zh) * 2015-08-21 2020-08-11 美商康寧公司 處理玻璃卷材的設備及方法
CN105304618A (zh) * 2015-12-04 2016-02-03 贵州振华风光半导体有限公司 抗干扰抗腐蚀半导体集成电路的集成方法
US11065960B2 (en) * 2017-09-13 2021-07-20 Corning Incorporated Curved vehicle displays
US11056625B2 (en) * 2018-02-19 2021-07-06 Creeled, Inc. Clear coating for light emitting device exterior having chemical resistance and related methods

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JPH07169567A (ja) * 1993-12-16 1995-07-04 Idemitsu Kosan Co Ltd 有機ｅｌ素子
US6548912B1 (en) * 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6605826B2 (en) * 2000-08-18 2003-08-12 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and display device
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6506681B2 (en) * 2000-12-06 2003-01-14 Micron Technology, Inc. Thin flip—chip method
US6614057B2 (en) * 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
DE10134541A1 (de) * 2001-07-16 2003-02-13 Siemens Ag Computersystem und Verfahren für die Bestellung eines Produkts, insbesondere eines Nahrungs- oder Genussmittels
US6692610B2 (en) 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
GB2383683B (en) 2001-12-28 2004-04-07 Delta Optoelectronics Inc Housing structure with multiple sealing layers
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP4154898B2 (ja) 2002-02-21 2008-09-24 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス表示装置及び有機エレクトロルミネッセンス表示素子の封止方法
US6710542B2 (en) * 2002-08-03 2004-03-23 Agilent Technologies, Inc. Organic light emitting device with improved moisture seal
DE10238799A1 (de) * 2002-08-23 2004-03-11 Siemens Ag Organische lichtemittierende Diode (OLED) und/oder Display, Verfahren zur Versiegelung und Verwendung davon
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US7279063B2 (en) * 2004-01-16 2007-10-09 Eastman Kodak Company Method of making an OLED display device with enhanced optical and mechanical properties
US7642642B2 (en) * 2004-03-23 2010-01-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Microcap wafer bonding apparatus

Also Published As

Publication number Publication date
DE112005000839B4 (de) 2019-01-17
WO2005104259A2 (de) 2005-11-03
US20080057260A1 (en) 2008-03-06
KR20070015590A (ko) 2007-02-05
CN1947278A (zh) 2007-04-11
JP2007535144A (ja) 2007-11-29
US8288861B2 (en) 2012-10-16
US20130011599A1 (en) 2013-01-10
WO2005104259A3 (de) 2006-07-20
CN1947278B (zh) 2010-10-13

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