DE60227534D1 - Schaltung und Anordnung zur Tempeaturüberwachung von chalcogenische Elementen, insbesondere von Phasenänderungsspeicherelementen - Google Patents

Schaltung und Anordnung zur Tempeaturüberwachung von chalcogenische Elementen, insbesondere von Phasenänderungsspeicherelementen

Info

Publication number
DE60227534D1
DE60227534D1 DE60227534T DE60227534T DE60227534D1 DE 60227534 D1 DE60227534 D1 DE 60227534D1 DE 60227534 T DE60227534 T DE 60227534T DE 60227534 T DE60227534 T DE 60227534T DE 60227534 D1 DE60227534 D1 DE 60227534D1
Authority
DE
Germany
Prior art keywords
elements
tempeaturüberwachung
arrangement
circuit
phase change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60227534T
Other languages
English (en)
Inventor
Osama Khouri
Ferdinando Bedeschi
Claudio Resta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Ovonyx Inc
Original Assignee
STMicroelectronics SRL
Ovonyx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL, Ovonyx Inc filed Critical STMicroelectronics SRL
Application granted granted Critical
Publication of DE60227534D1 publication Critical patent/DE60227534D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0078Write using current through the cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5002Characteristic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
DE60227534T 2002-11-18 2002-11-18 Schaltung und Anordnung zur Tempeaturüberwachung von chalcogenische Elementen, insbesondere von Phasenänderungsspeicherelementen Expired - Lifetime DE60227534D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02425706A EP1420412B1 (de) 2002-11-18 2002-11-18 Schaltung und Anordnung zur Tempeaturüberwachung von chalcogenische Elementen, insbesondere von Phasenänderungsspeicherelementen

Publications (1)

Publication Number Publication Date
DE60227534D1 true DE60227534D1 (de) 2008-08-21

Family

ID=32116371

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60227534T Expired - Lifetime DE60227534D1 (de) 2002-11-18 2002-11-18 Schaltung und Anordnung zur Tempeaturüberwachung von chalcogenische Elementen, insbesondere von Phasenänderungsspeicherelementen

Country Status (3)

Country Link
US (1) US7020014B2 (de)
EP (1) EP1420412B1 (de)
DE (1) DE60227534D1 (de)

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JP4529493B2 (ja) * 2004-03-12 2010-08-25 株式会社日立製作所 半導体装置
KR100618824B1 (ko) * 2004-05-08 2006-08-31 삼성전자주식회사 상 변화 메모리 장치의 전류 펄스 폭을 제어하는 구동회로 및 프로그래밍 방법
DE102004040753A1 (de) * 2004-08-23 2006-03-09 Infineon Technologies Ag Schaltungsanordnungen zum Speichern von Informationen in Speicherelementen vom CBRAM-Typ
US7443710B2 (en) * 2004-09-28 2008-10-28 Spansion, Llc Control of memory devices possessing variable resistance characteristics
US7646630B2 (en) * 2004-11-08 2010-01-12 Ovonyx, Inc. Programmable matrix array with chalcogenide material
DE102005001668A1 (de) * 2005-01-13 2006-03-16 Infineon Technologies Ag Speicherschaltung mit einer Phasenwechsel-Speicherzelle
US7319608B2 (en) * 2005-06-30 2008-01-15 International Business Machines Corporation Non-volatile content addressable memory using phase-change-material memory elements
US7907435B2 (en) 2005-09-21 2011-03-15 Renesas Electronics Corporation Semiconductor device
US7460394B2 (en) * 2006-05-18 2008-12-02 Infineon Technologies Ag Phase change memory having temperature budget sensor
US7414883B2 (en) * 2006-04-20 2008-08-19 Intel Corporation Programming a normally single phase chalcogenide material for use as a memory or FPLA
US7405964B2 (en) * 2006-07-27 2008-07-29 Qimonda North America Corp. Integrated circuit to identify read disturb condition in memory cell
US7471582B2 (en) * 2006-07-28 2008-12-30 Freescale Semiconductor, Inc. Memory circuit using a reference for sensing
US7623401B2 (en) 2006-10-06 2009-11-24 Qimonda North America Corp. Semiconductor device including multi-bit memory cells and a temperature budget sensor
JP2008103841A (ja) * 2006-10-17 2008-05-01 Matsushita Electric Ind Co Ltd 水晶発振回路
US7679980B2 (en) 2006-11-21 2010-03-16 Qimonda North America Corp. Resistive memory including selective refresh operation
US7539050B2 (en) 2006-11-22 2009-05-26 Qimonda North America Corp. Resistive memory including refresh operation
KR100809339B1 (ko) * 2006-12-20 2008-03-05 삼성전자주식회사 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법
US7916524B2 (en) * 2007-06-26 2011-03-29 Qimonda Ag Program method with locally optimized write parameters
US7795605B2 (en) * 2007-06-29 2010-09-14 International Business Machines Corporation Phase change material based temperature sensor
KR100908814B1 (ko) * 2007-08-29 2009-07-21 주식회사 하이닉스반도체 코어전압 방전회로 및 이를 포함하는 반도체 메모리장치
TWI367485B (en) * 2007-09-21 2012-07-01 Higgs Opl Capital Llc Device controlling phase change storage element and method of increasing reliability of phase change storage element
JP5205662B2 (ja) * 2008-04-01 2013-06-05 ルネサスエレクトロニクス株式会社 半導体装置
US7882455B2 (en) * 2008-05-09 2011-02-01 International Business Machines Corporation Circuit and method using distributed phase change elements for across-chip temperature profiling
US7929336B2 (en) * 2008-06-11 2011-04-19 Qimonda Ag Integrated circuit including a memory element programmed using a seed pulse
JP5259270B2 (ja) * 2008-06-27 2013-08-07 ルネサスエレクトロニクス株式会社 半導体装置
KR101435128B1 (ko) * 2008-07-21 2014-09-01 삼성전자 주식회사 저항체를 이용한 비휘발성 메모리 장치
US8036014B2 (en) * 2008-11-06 2011-10-11 Macronix International Co., Ltd. Phase change memory program method without over-reset
KR101543434B1 (ko) * 2008-12-15 2015-08-10 삼성전자주식회사 반도체 메모리 시스템의 제조 방법
US8259488B1 (en) * 2009-05-11 2012-09-04 Micron Technology, Inc. Phase-change memory temperature sensitive detector
KR20100132374A (ko) * 2009-06-09 2010-12-17 삼성전자주식회사 Pvt 변화에 무관한 전류 공급회로, 및 이를 포함하는 반도체 장치들
WO2011070599A1 (en) 2009-12-10 2011-06-16 Ferdinando Bedeschi Apparatus and method for reading a phase-change memory cell
WO2012046638A1 (en) 2010-10-04 2012-04-12 Ricoh Company, Ltd. Electric element
KR101212747B1 (ko) 2010-10-28 2012-12-14 에스케이하이닉스 주식회사 커런트 제어 장치 및 이를 포함하는 상변화 메모리
KR20120045197A (ko) * 2010-10-29 2012-05-09 에스케이하이닉스 주식회사 온도에 의존하는 저장 매체를 포함하는 메모리 장치 및 그 구동방법
US9036396B2 (en) * 2012-08-30 2015-05-19 SanDisk Technologies, Inc. Apparatus and method for detecting reflow process
US9625325B2 (en) 2015-02-18 2017-04-18 Globalfoundries Inc. System and method for identifying operating temperatures and modifying of integrated circuits
EP3281202A4 (de) * 2015-04-10 2018-03-28 Hewlett-Packard Enterprise Development LP Temperaturausgleichsschaltungen
ITUB20153221A1 (it) * 2015-08-25 2017-02-25 St Microelectronics Srl Circuito e metodo di polarizzazione di celle di memoria non volatile
US9400511B1 (en) * 2016-01-07 2016-07-26 International Business Machines Corporation Methods and control systems of resistance adjustment of resistors
US9785178B1 (en) * 2016-03-17 2017-10-10 King Abdulaziz City For Science And Technology Precision current reference generator circuit
US10366752B2 (en) * 2016-12-11 2019-07-30 Technion Research & Development Foundation Ltd. Programming for electronic memories
US11940831B2 (en) * 2021-12-07 2024-03-26 Infineon Technologies LLC Current generator for memory sensing

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SU522523A1 (ru) * 1974-10-18 1976-07-25 Предприятие П/Я М-5769 Запоминающее устройство
US6233190B1 (en) * 1999-08-30 2001-05-15 Micron Technology, Inc. Method of storing a temperature threshold in an integrated circuit, method of modifying operation of dynamic random access memory in response to temperature, programmable temperature sensing circuit and memory integrated circuit
JP4491870B2 (ja) * 1999-10-27 2010-06-30 ソニー株式会社 不揮発性メモリの駆動方法
EP1115120A3 (de) * 2000-01-07 2003-09-10 Lucent Technologies Inc. Verfahren und Vorrichtung zur Temperaturkompensation eines Festwertspeichers
DE60137788D1 (de) * 2001-12-27 2009-04-09 St Microelectronics Srl Architektur einer nichtflüchtigen Phasenwechsel -Speichermatrix

Also Published As

Publication number Publication date
US7020014B2 (en) 2006-03-28
US20040151023A1 (en) 2004-08-05
EP1420412A1 (de) 2004-05-19
EP1420412B1 (de) 2008-07-09

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