DE60221433D1 - Elektroleitfähige zusammensetzung, elektroleitfähige beschichtung und verfahren zur bildung einer elektroleitfähigen beschichtung - Google Patents

Elektroleitfähige zusammensetzung, elektroleitfähige beschichtung und verfahren zur bildung einer elektroleitfähigen beschichtung

Info

Publication number
DE60221433D1
DE60221433D1 DE60221433T DE60221433T DE60221433D1 DE 60221433 D1 DE60221433 D1 DE 60221433D1 DE 60221433 T DE60221433 T DE 60221433T DE 60221433 T DE60221433 T DE 60221433T DE 60221433 D1 DE60221433 D1 DE 60221433D1
Authority
DE
Germany
Prior art keywords
coating
electroproof
electroprocess
electroprocessing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60221433T
Other languages
English (en)
Other versions
DE60221433T2 (de
Inventor
Katsuhiko Takahashi
Kiwako Ohmori
Masanori Endo
Hikaru Yasuhara
Akinobu Ono
Takayuki Imai
Yukihiko Kurosawa
Hiroaki Zaima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Application granted granted Critical
Publication of DE60221433D1 publication Critical patent/DE60221433D1/de
Publication of DE60221433T2 publication Critical patent/DE60221433T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
DE60221433T 2001-12-27 2002-12-25 Elektroleitfähige zusammensetzung, elektroleitfähige beschichtung und verfahren zur bildung einer elektroleitfähigen beschichtung Expired - Lifetime DE60221433T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001398425 2001-12-27
JP2001398425 2001-12-27
JP2002115438 2002-04-17
JP2002115438 2002-04-17
PCT/JP2002/013502 WO2003056574A1 (fr) 2001-12-27 2002-12-25 Composition electroconductrice, revetement electroconducteur et procede de formation d'un revetement electroconducteur

Publications (2)

Publication Number Publication Date
DE60221433D1 true DE60221433D1 (de) 2007-09-06
DE60221433T2 DE60221433T2 (de) 2008-04-10

Family

ID=26625350

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60221433T Expired - Lifetime DE60221433T2 (de) 2001-12-27 2002-12-25 Elektroleitfähige zusammensetzung, elektroleitfähige beschichtung und verfahren zur bildung einer elektroleitfähigen beschichtung
DE60237174T Expired - Lifetime DE60237174D1 (de) 2001-12-27 2002-12-25 Elektrisch leitfähige Zusammensetzung, elektrisch leitfähige Beschichtung und Verfahren zur Bildung einer elektrisch leitfähigen Beschichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60237174T Expired - Lifetime DE60237174D1 (de) 2001-12-27 2002-12-25 Elektrisch leitfähige Zusammensetzung, elektrisch leitfähige Beschichtung und Verfahren zur Bildung einer elektrisch leitfähigen Beschichtung

Country Status (8)

Country Link
US (1) US20040259007A1 (de)
EP (2) EP1775734B1 (de)
JP (2) JP4156522B2 (de)
KR (1) KR100951726B1 (de)
CN (1) CN100428368C (de)
DE (2) DE60221433T2 (de)
TW (1) TW588101B (de)
WO (1) WO2003056574A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0427164D0 (en) * 2004-12-11 2005-01-12 Eastman Kodak Co Conductive silver dispersions and uses thereof
US7842274B2 (en) * 2006-03-31 2010-11-30 Umicore, S.A. Process for manufacture of silver-based particles and electrical contact materials
US20100167051A1 (en) * 2006-03-31 2010-07-01 Goia Dan V Process for Manufacture of Silver-Based Particles and Electrical Contact Materials
TWI399759B (zh) 2006-06-30 2013-06-21 Mitsubishi Materials Corp 形成太陽電池之電極用組成物及該電極之形成方法以及使用依該形成方法所得電極之太陽電池
JP5309521B2 (ja) 2006-10-11 2013-10-09 三菱マテリアル株式会社 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
JP4895994B2 (ja) * 2006-12-28 2012-03-14 株式会社日立製作所 金属粒子を用いた接合方法及び接合材料
JP5169389B2 (ja) 2007-04-19 2013-03-27 三菱マテリアル株式会社 導電性反射膜の製造方法
JP4912991B2 (ja) * 2007-09-07 2012-04-11 住友化学株式会社 熱電変換素子の製造方法
JP5778382B2 (ja) * 2008-10-22 2015-09-16 東ソー株式会社 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法
US9137902B2 (en) * 2009-08-14 2015-09-15 Xerox Corporation Process to form highly conductive feature from silver nanoparticles with reduced processing temperature
DE102010042702A1 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
DE102010042721A1 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
JP5899623B2 (ja) * 2011-02-10 2016-04-06 三菱マテリアル株式会社 はんだ接合用積層体および接合体
DE102011079660B4 (de) 2011-07-22 2023-06-07 Robert Bosch Gmbh Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente, eine Schaltungsanordnung diesen Schichtverbund enthaltend und Verfahren zu dessen Ausbildung
KR101285551B1 (ko) * 2011-08-31 2013-07-18 주식회사 케이씨씨 태양전지 전극 형성용 금속 페이스트
DE102011083893A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
CN102417781B (zh) * 2011-11-10 2013-09-04 武汉爱劳高科技有限责任公司 用于接地的防腐导电涂料及其制备工艺
MY185528A (en) * 2011-11-18 2021-05-19 Sumitomo Metal Mining Co Silver powder, method for producing silver powder, and conductive paste
TWI481326B (zh) * 2011-11-24 2015-04-11 Showa Denko Kk A conductive pattern forming method, and a conductive pattern forming composition by light irradiation or microwave heating
US9029692B2 (en) * 2012-04-17 2015-05-12 Heraeus Precious Metals North America Conshohocken Llc Tellurium inorganic reaction systems for conductive thick film paste for solar cell contacts
JP6356389B2 (ja) 2012-04-17 2018-07-11 ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー 太陽電池接点用導電性厚膜ペースト
JP6209666B1 (ja) * 2016-12-02 2017-10-04 田中貴金属工業株式会社 導電性接合材料及び半導体装置の製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2163266A (en) * 1935-12-24 1939-06-20 Telefunken Gmbh Double mosaic screen
GB569388A (en) * 1943-05-19 1945-05-22 Standard Telephones Cables Ltd Improvements in or relating to the formation of adherent silver films on non-metallic surfaces
GB566718A (en) * 1943-09-07 1945-01-10 Johnson Matthey Co Ltd Improvements in or relating to the silvering of non-metallic surfaces
US2560151A (en) * 1944-12-23 1951-07-10 Svenska Elektronror Ab Method of coating electrical contact pins
US2592870A (en) * 1946-09-06 1952-04-15 Ward Blenkinsop & Co Ltd Production of compositions containing finely divided metallic silver
US3131060A (en) * 1959-02-26 1964-04-28 Gevaert Photo Prod Nv Electrophotographic material
DE2728465C2 (de) * 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
FR2398331A1 (fr) * 1977-07-22 1979-02-16 Issec Laboratoires Physico Chi Procede, element et appareils d'enregistrement electrographique
US4273593A (en) * 1979-06-25 1981-06-16 Scm Corporation Metal-joining paste and vehicle therefor
FR2537898A1 (fr) 1982-12-21 1984-06-22 Univ Paris Procede de reduction de composes metalliques par les polyols, et poudres metalliques obtenues par ce procede
US5182165A (en) * 1986-03-24 1993-01-26 Ensci, Inc. Coating compositions
JPH0417398A (ja) * 1990-05-11 1992-01-22 Asahi Chem Ind Co Ltd 導電性複合材料
JPH0431463A (ja) * 1990-05-25 1992-02-03 Asahi Chem Ind Co Ltd 電気回路材料
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
JP2965759B2 (ja) * 1991-08-28 1999-10-18 エヌ・イーケムキャット株式会社 導電性薄膜形成用銀ペースト
US5296459A (en) * 1992-06-19 1994-03-22 Trustees Of Boston University Method for making an electrically conductive contact for joining high T.sub.
CN1137285C (zh) * 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
US5756008A (en) * 1996-08-14 1998-05-26 E. I. Du Pont De Nemours And Company Water cleanable silver composition
JP3429958B2 (ja) * 1996-08-28 2003-07-28 三井金属鉱業株式会社 銀コロイド液の製造方法
JPH10183209A (ja) * 1996-12-25 1998-07-14 Sumitomo Metal Mining Co Ltd 鱗片状銀粉末の製造方法
US6004717A (en) * 1997-06-13 1999-12-21 Xerox Corporation Carrier coating processes
JP2001135138A (ja) * 1999-10-29 2001-05-18 Matsushita Electric Ind Co Ltd 導体ペースト
JP4419239B2 (ja) 1999-12-28 2010-02-24 横河電機株式会社 粉粒体の体積測定装置
JP2001192856A (ja) * 2000-01-06 2001-07-17 Japan Science & Technology Corp 金属コーティング方法および金属コーティングされた材料
JP2001240984A (ja) * 2000-03-01 2001-09-04 Hitachi Ltd 導電性皮膜および導電性皮膜形成用組成物および導電性皮膜形成方法および回路基板
US6686045B2 (en) * 2001-01-31 2004-02-03 Shin-Etsu Chemical Co., Ltd. Composite fine particles, conductive paste, and conductive film
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features

Also Published As

Publication number Publication date
US20040259007A1 (en) 2004-12-23
WO2003056574A1 (fr) 2003-07-10
TW588101B (en) 2004-05-21
DE60237174D1 (de) 2010-09-09
EP1460644B1 (de) 2007-07-25
EP1775734A2 (de) 2007-04-18
KR100951726B1 (ko) 2010-04-07
TW200301294A (en) 2003-07-01
CN100428368C (zh) 2008-10-22
EP1775734A3 (de) 2008-04-23
EP1460644A4 (de) 2005-03-16
EP1460644A1 (de) 2004-09-22
JPWO2003056574A1 (ja) 2005-05-12
DE60221433T2 (de) 2008-04-10
EP1775734B1 (de) 2010-07-28
JP4156522B2 (ja) 2008-09-24
CN1608296A (zh) 2005-04-20
JP2008177172A (ja) 2008-07-31
KR20040083071A (ko) 2004-09-30

Similar Documents

Publication Publication Date Title
DE60221433D1 (de) Elektroleitfähige zusammensetzung, elektroleitfähige beschichtung und verfahren zur bildung einer elektroleitfähigen beschichtung
ATE435839T1 (de) Verfahren zur bekämpfung der bildung und ablagerung von kesselstein in wässrigen systemen
DE50009311D1 (de) Otoplastik und verfahren zur fertigung einer otoplastik
DE60221399D1 (de) Verfahren zur herstellung von mitteldistillaten
ATE403641T1 (de) Verfahren zur herstellung von o- desmethylvenlafaxin
ATE364497T1 (de) Verfahren zur herstellung von verbindungsprofilen
DE50214717D1 (de) Und verfahren zu seiner herstellung
DE50213224D1 (de) Induktives bauelement und verfahren zu seiner herstellung
DE60110775D1 (de) Verfahren zur Reparaturbeschichtung
DE60208373D1 (de) Polyaryleneether-polyolefinzusammensetzung, verfahren zu deren herstellung und formassen daraus
DE60238438D1 (de) Positiv-resistzusammensetzung und verfahren zur ausbildung einer resiststruktur
ATE453648T1 (de) Verfahren zur herstellung von hexahydrofuroc2,3- büfuran-3-ol
DE60230908D1 (de) Verfahren zur herstellung von polyarylenethern
ATE286011T1 (de) Verfahren zur herstellung von 1-octen
DE60226766D1 (de) Verfahren zur herstellung von phenolischen novolaken
DE60018894D1 (de) Verfahren und System zur Beschichtung
DE69914995D1 (de) Verfahren zur schnellen Vorhangbeschichtung
DE60219867D1 (de) Verfahren zur Revitalisierung der Haarfarbe
ATE357540T1 (de) Verfahren zur bakterienunterstützten haldenauslaugung von chalkopyrit
DE60236754D1 (de) Verfahren zur herstellung von polyoxyalkylenpolyetherprodukten
ATE262576T1 (de) Verfahren zur herstellung von weichmittelzusammensetzungen
DE60214243D1 (de) Verfahren zur herstellung von metallpulver
DE60116862D1 (de) Verfahren zur bereitung einer pulvrlackzusammensetzung, pulverlackzusammensetzung und verfahren zur bildung des beschichtungsfilms
ATE441662T1 (de) Verfahren zur herstellung von echinocandinderivaten
DE60210911D1 (de) Verfahren zur Herstellung von dehnungserfassenden Vorrichtungen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition