DE602007005036D1 - Dreiachsiger Beschleunigungsmesser mit Membran - Google Patents
Dreiachsiger Beschleunigungsmesser mit MembranInfo
- Publication number
- DE602007005036D1 DE602007005036D1 DE602007005036T DE602007005036T DE602007005036D1 DE 602007005036 D1 DE602007005036 D1 DE 602007005036D1 DE 602007005036 T DE602007005036 T DE 602007005036T DE 602007005036 T DE602007005036 T DE 602007005036T DE 602007005036 D1 DE602007005036 D1 DE 602007005036D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- integrated
- mass
- diaphragm
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0109—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0181—See-saws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Buildings Adapted To Withstand Abnormal External Influences (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Surgical Instruments (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0602216A FR2898683B1 (fr) | 2006-03-14 | 2006-03-14 | Accelerometre triaxial a membrane |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007005036D1 true DE602007005036D1 (de) | 2010-04-15 |
Family
ID=37421177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007005036T Active DE602007005036D1 (de) | 2006-03-14 | 2007-03-09 | Dreiachsiger Beschleunigungsmesser mit Membran |
Country Status (6)
Country | Link |
---|---|
US (1) | US7600428B2 (de) |
EP (1) | EP1835294B1 (de) |
JP (1) | JP5211387B2 (de) |
AT (1) | ATE459888T1 (de) |
DE (1) | DE602007005036D1 (de) |
FR (1) | FR2898683B1 (de) |
Families Citing this family (56)
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---|---|---|---|---|
DE102006062314A1 (de) * | 2006-12-27 | 2008-07-03 | Robert Bosch Gmbh | Mehrachsiger mikromechanischer Beschleunigungssensor |
DE102007017209B4 (de) * | 2007-04-05 | 2014-02-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanischer Inertialsensor zur Messung von Drehraten |
TWI335903B (en) * | 2007-10-05 | 2011-01-11 | Pixart Imaging Inc | Out-of-plane sensing device |
DE102009021567A1 (de) * | 2008-05-15 | 2009-12-31 | Continental Teves Ag & Co. Ohg | Mikromechanischer Beschleunigungssensor |
KR100986221B1 (ko) * | 2008-06-16 | 2010-10-08 | 한국산업기술대학교산학협력단 | 수직 방향 가속도 측정 장치 |
US8187902B2 (en) * | 2008-07-09 | 2012-05-29 | The Charles Stark Draper Laboratory, Inc. | High performance sensors and methods for forming the same |
US8171793B2 (en) * | 2008-07-31 | 2012-05-08 | Honeywell International Inc. | Systems and methods for detecting out-of-plane linear acceleration with a closed loop linear drive accelerometer |
DE102008043524B4 (de) * | 2008-11-06 | 2021-10-14 | Robert Bosch Gmbh | Beschleunigungssensor und Verfahren zu seiner Herstellung |
DE102008044371B4 (de) * | 2008-12-05 | 2016-10-27 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Sensoranordnung |
WO2010138717A1 (en) * | 2009-05-27 | 2010-12-02 | King Abdullah University Of Science And Technology | Mems mass spring damper systems using an out-of-plane suspension scheme |
US8307710B2 (en) * | 2009-07-09 | 2012-11-13 | Honeywell International Inc. | Translational mass in-plane MEMS accelerometer |
US8710599B2 (en) | 2009-08-04 | 2014-04-29 | Fairchild Semiconductor Corporation | Micromachined devices and fabricating the same |
DE102009028343B4 (de) * | 2009-08-07 | 2022-12-15 | Robert Bosch Gmbh | Sensorelement und Verfahren zum Betrieb eines Sensorelements |
DE102010029645B4 (de) * | 2010-06-02 | 2018-03-29 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Teststruktur zur Bestimmung der Schichtdicke einer Abstandsschicht und Verfahren zum Herstellen einer solchen Teststruktur |
US9408555B2 (en) * | 2010-06-30 | 2016-08-09 | Indiana University Research And Technology Corporation | Supersensitive linear pressure transducer |
CN102384984B (zh) * | 2010-09-02 | 2013-06-12 | 孙博华 | 电容式单质量块全梳齿电极三轴加速度传感器及制作方法 |
CN103221333B (zh) | 2010-09-18 | 2017-05-31 | 快捷半导体公司 | 多晶片mems封装 |
WO2012037539A1 (en) | 2010-09-18 | 2012-03-22 | Fairchild Semiconductor Corporation | Micromachined 3-axis accelerometer with a single proof-mass |
WO2012037501A2 (en) | 2010-09-18 | 2012-03-22 | Cenk Acar | Flexure bearing to reduce quadrature for resonating micromachined devices |
KR20130057485A (ko) | 2010-09-18 | 2013-05-31 | 페어차일드 세미컨덕터 코포레이션 | 미세 전자 기계 시스템에 미치는 응력을 감소시키기 위한 패키징 |
US9278845B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | MEMS multi-axis gyroscope Z-axis electrode structure |
CN103221779B (zh) | 2010-09-18 | 2017-05-31 | 快捷半导体公司 | 微机械整体式六轴惯性传感器 |
EP2619536B1 (de) | 2010-09-20 | 2016-11-02 | Fairchild Semiconductor Corporation | Mikroelektromechanischer drucksensor mit einem bezugskondensator |
US9006846B2 (en) | 2010-09-20 | 2015-04-14 | Fairchild Semiconductor Corporation | Through silicon via with reduced shunt capacitance |
US8839670B2 (en) * | 2010-11-24 | 2014-09-23 | Invensense, Inc. | Anchor-tilt cancelling accelerometer |
US8966990B2 (en) * | 2011-02-11 | 2015-03-03 | Purdue Research Foundation | MEMS devices exhibiting linear characteristics |
DE102012200740B4 (de) * | 2011-10-27 | 2024-03-21 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements |
JP2013117396A (ja) * | 2011-12-01 | 2013-06-13 | Denso Corp | 加速度センサ |
TWI467179B (zh) * | 2011-12-02 | 2015-01-01 | Pixart Imaging Inc | 三維微機電感測器 |
US9062972B2 (en) * | 2012-01-31 | 2015-06-23 | Fairchild Semiconductor Corporation | MEMS multi-axis accelerometer electrode structure |
US8978475B2 (en) | 2012-02-01 | 2015-03-17 | Fairchild Semiconductor Corporation | MEMS proof mass with split z-axis portions |
US8754694B2 (en) | 2012-04-03 | 2014-06-17 | Fairchild Semiconductor Corporation | Accurate ninety-degree phase shifter |
US8742964B2 (en) | 2012-04-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Noise reduction method with chopping for a merged MEMS accelerometer sensor |
US9488693B2 (en) | 2012-04-04 | 2016-11-08 | Fairchild Semiconductor Corporation | Self test of MEMS accelerometer with ASICS integrated capacitors |
US9069006B2 (en) | 2012-04-05 | 2015-06-30 | Fairchild Semiconductor Corporation | Self test of MEMS gyroscope with ASICs integrated capacitors |
KR102058489B1 (ko) | 2012-04-05 | 2019-12-23 | 페어차일드 세미컨덕터 코포레이션 | 멤스 장치 프론트 엔드 전하 증폭기 |
EP2647952B1 (de) | 2012-04-05 | 2017-11-15 | Fairchild Semiconductor Corporation | Automatische Verstärkungsregelungsschleife einer MEMS-Vorrichtung für mechanischen Amplitudenantrieb |
EP2647955B8 (de) | 2012-04-05 | 2018-12-19 | Fairchild Semiconductor Corporation | MEMS-Vorrichtung mit Quadraturphasenverschiebungsauslöschung |
KR101999745B1 (ko) | 2012-04-12 | 2019-10-01 | 페어차일드 세미컨덕터 코포레이션 | 미세 전자 기계 시스템 구동기 |
US9625272B2 (en) | 2012-04-12 | 2017-04-18 | Fairchild Semiconductor Corporation | MEMS quadrature cancellation and signal demodulation |
ITTO20120691A1 (it) * | 2012-08-01 | 2014-02-02 | Milano Politecnico | Sensore d'urto con meccanismo bistabile e metodo per il rilevamento di urti |
DE102013014881B4 (de) | 2012-09-12 | 2023-05-04 | Fairchild Semiconductor Corporation | Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien |
US9644963B2 (en) | 2013-03-15 | 2017-05-09 | Fairchild Semiconductor Corporation | Apparatus and methods for PLL-based gyroscope gain control, quadrature cancellation and demodulation |
KR101531088B1 (ko) * | 2013-05-30 | 2015-07-06 | 삼성전기주식회사 | 관성센서 |
US20150247879A1 (en) * | 2014-03-03 | 2015-09-03 | Infineon Technologies Ag | Acceleration sensor |
US20150268269A1 (en) * | 2014-03-20 | 2015-09-24 | Freescale Semiconductor, Inc. | Sensor with combined sense elements for multiple axis sensing |
US9493339B2 (en) * | 2014-09-02 | 2016-11-15 | Kabushiki Kaisha Toshiba | Micro electro mechanical system |
CN104614553A (zh) * | 2015-01-30 | 2015-05-13 | 歌尔声学股份有限公司 | 一种加速度计中的z轴结构 |
US10436812B2 (en) | 2015-03-20 | 2019-10-08 | Nxp Usa, Inc. | Micro-electro-mechanical acceleration sensor device |
US10697994B2 (en) | 2017-02-22 | 2020-06-30 | Semiconductor Components Industries, Llc | Accelerometer techniques to compensate package stress |
JP7176353B2 (ja) * | 2018-10-29 | 2022-11-22 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP7123881B2 (ja) | 2019-08-28 | 2022-08-23 | 株式会社東芝 | センサ |
JP7134931B2 (ja) | 2019-08-28 | 2022-09-12 | 株式会社東芝 | センサ |
DE102020119371B3 (de) | 2020-07-22 | 2021-08-05 | IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH) | Mikroelektromechanischer Beschleunigungssensor |
KR102573515B1 (ko) * | 2021-01-11 | 2023-09-06 | 한국공학대학교산학협력단 | 관성 센서 |
TWI826993B (zh) * | 2021-04-06 | 2023-12-21 | 昇佳電子股份有限公司 | 慣性感測器 |
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JPH04115165A (ja) * | 1990-09-05 | 1992-04-16 | Ricoh Co Ltd | 加速度センサ |
US5591910A (en) * | 1994-06-03 | 1997-01-07 | Texas Instruments Incorporated | Accelerometer |
JPH08166405A (ja) * | 1994-12-15 | 1996-06-25 | Murata Mfg Co Ltd | 加速度センサ |
JPH0989927A (ja) * | 1995-09-28 | 1997-04-04 | Zexel Corp | 多軸加速度センサ |
JP3114570B2 (ja) * | 1995-05-26 | 2000-12-04 | オムロン株式会社 | 静電容量型圧力センサ |
US6612029B2 (en) * | 2000-03-24 | 2003-09-02 | Onix Microsystems | Multi-layer, self-aligned vertical combdrive electrostatic actuators and fabrication methods |
JP2003014778A (ja) * | 2001-04-26 | 2003-01-15 | Samsung Electronics Co Ltd | 垂直変位測定及び駆動構造体とその製造方法 |
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JP2003166999A (ja) * | 2001-12-03 | 2003-06-13 | Denso Corp | 半導体力学量センサ |
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JP2003329444A (ja) * | 2002-03-07 | 2003-11-19 | Alps Electric Co Ltd | 静電容量式センサ |
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AU2003226083A1 (en) * | 2002-03-26 | 2003-10-13 | The Charles Stark Draper Laboratory, Inc. | Microelectromechanical sensors having reduced signal bias errors and methods of manufacturing the same |
WO2003087719A1 (fr) * | 2002-04-02 | 2003-10-23 | Asahi Kasei Emd Corporation | Capteur d'inclinaison, procede de fabrication de ce capteur d'inclinaison et procede permettant de mesurer l'inclinaison |
JP2004150993A (ja) * | 2002-10-31 | 2004-05-27 | Japan Aviation Electronics Industry Ltd | 容量式3軸加速度センサ |
JP2004361388A (ja) * | 2003-05-15 | 2004-12-24 | Mitsubishi Electric Corp | 容量型慣性力検出装置 |
JP2005017227A (ja) * | 2003-06-27 | 2005-01-20 | Star Micronics Co Ltd | 静電容量型加速度センサ |
US6845670B1 (en) * | 2003-07-08 | 2005-01-25 | Freescale Semiconductor, Inc. | Single proof mass, 3 axis MEMS transducer |
JP4073382B2 (ja) * | 2003-09-02 | 2008-04-09 | ホシデン株式会社 | 振動センサ |
EP1624284B1 (de) * | 2004-07-29 | 2017-07-19 | STMicroelectronics Srl | Mikroelektromechanischer hochempfindlicher Inertialsensor und dessen Herstellungsverfahren |
JP2006084219A (ja) * | 2004-09-14 | 2006-03-30 | Hosiden Corp | 加速度センサ |
US7258010B2 (en) * | 2005-03-09 | 2007-08-21 | Honeywell International Inc. | MEMS device with thinned comb fingers |
US20060207327A1 (en) * | 2005-03-16 | 2006-09-21 | Zarabadi Seyed R | Linear accelerometer |
US7337671B2 (en) * | 2005-06-03 | 2008-03-04 | Georgia Tech Research Corp. | Capacitive microaccelerometers and fabrication methods |
US7350415B2 (en) * | 2006-05-25 | 2008-04-01 | Honeywell International Inc. | Closed-loop comb drive sensor |
-
2006
- 2006-03-14 FR FR0602216A patent/FR2898683B1/fr not_active Expired - Fee Related
-
2007
- 2007-03-09 AT AT07103819T patent/ATE459888T1/de not_active IP Right Cessation
- 2007-03-09 EP EP07103819A patent/EP1835294B1/de active Active
- 2007-03-09 DE DE602007005036T patent/DE602007005036D1/de active Active
- 2007-03-13 JP JP2007063974A patent/JP5211387B2/ja active Active
- 2007-03-14 US US11/686,346 patent/US7600428B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ATE459888T1 (de) | 2010-03-15 |
US20070214891A1 (en) | 2007-09-20 |
FR2898683A1 (fr) | 2007-09-21 |
EP1835294A1 (de) | 2007-09-19 |
JP5211387B2 (ja) | 2013-06-12 |
FR2898683B1 (fr) | 2008-05-23 |
JP2007248466A (ja) | 2007-09-27 |
US7600428B2 (en) | 2009-10-13 |
EP1835294B1 (de) | 2010-03-03 |
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