DE602005007648D1 - Dampfquelle für Beschichtungsanlage - Google Patents

Dampfquelle für Beschichtungsanlage

Info

Publication number
DE602005007648D1
DE602005007648D1 DE602005007648T DE602005007648T DE602005007648D1 DE 602005007648 D1 DE602005007648 D1 DE 602005007648D1 DE 602005007648 T DE602005007648 T DE 602005007648T DE 602005007648 T DE602005007648 T DE 602005007648T DE 602005007648 D1 DE602005007648 D1 DE 602005007648D1
Authority
DE
Germany
Prior art keywords
steam source
coating plant
plant
coating
steam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005007648T
Other languages
English (en)
Inventor
Hirosi Abiko
Daisuke Masuda
Shigehiro Umetsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp filed Critical Tohoku Pioneer Corp
Publication of DE602005007648D1 publication Critical patent/DE602005007648D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
DE602005007648T 2004-03-30 2005-03-03 Dampfquelle für Beschichtungsanlage Active DE602005007648D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004099944A JP4366226B2 (ja) 2004-03-30 2004-03-30 有機ｅｌパネルの製造方法、有機ｅｌパネルの成膜装置

Publications (1)

Publication Number Publication Date
DE602005007648D1 true DE602005007648D1 (de) 2008-08-07

Family

ID=34909438

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005007648T Active DE602005007648D1 (de) 2004-03-30 2005-03-03 Dampfquelle für Beschichtungsanlage

Country Status (7)

Country Link
US (2) US20050217584A1 (de)
EP (1) EP1584705B1 (de)
JP (1) JP4366226B2 (de)
KR (1) KR20060043241A (de)
CN (1) CN100446300C (de)
DE (1) DE602005007648D1 (de)
TW (1) TW200532046A (de)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465475B2 (en) * 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
JP4583200B2 (ja) * 2005-02-17 2010-11-17 日立造船株式会社 蒸着装置
JP4545028B2 (ja) * 2005-03-30 2010-09-15 日立造船株式会社 蒸着装置
JP4402016B2 (ja) 2005-06-20 2010-01-20 キヤノン株式会社 蒸着装置及び蒸着方法
JP2007227086A (ja) 2006-02-22 2007-09-06 Tokyo Electron Ltd 成膜装置および発光素子の製造方法
JP2007232802A (ja) * 2006-02-27 2007-09-13 Hitachi Displays Ltd 有機ｅｌ表示装置
JP5179739B2 (ja) * 2006-09-27 2013-04-10 東京エレクトロン株式会社 蒸着装置、蒸着装置の制御装置、蒸着装置の制御方法および蒸着装置の使用方法
JP5127372B2 (ja) * 2007-09-03 2013-01-23 キヤノン株式会社 蒸着装置
JP5506147B2 (ja) * 2007-10-18 2014-05-28 キヤノン株式会社 成膜装置及び成膜方法
EP2128303B1 (de) * 2008-05-30 2013-03-13 Applied Materials, Inc. Anordnung zur Beschichtung eines Substrats
CN102046832B (zh) * 2008-05-30 2014-07-23 应用材料公司 基板镀膜设备
JP2010159448A (ja) * 2009-01-07 2010-07-22 Canon Inc 成膜装置及び成膜方法
JP5328726B2 (ja) * 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
JP5410235B2 (ja) * 2009-10-15 2014-02-05 小島プレス工業株式会社 有機高分子薄膜の形成方法及び形成装置
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
JP5452178B2 (ja) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法
EP2501839B1 (de) * 2009-11-16 2016-01-27 FEI Company Gaszufuhr für strahlenverarbeitungssysteme
KR101146982B1 (ko) 2009-11-20 2012-05-22 삼성모바일디스플레이주식회사 박막 증착 장치 및 유기 발광 디스플레이 장치 제조 방법
KR101084234B1 (ko) 2009-11-30 2011-11-16 삼성모바일디스플레이주식회사 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법
KR101174874B1 (ko) * 2010-01-06 2012-08-17 삼성디스플레이 주식회사 증착 소스, 박막 증착 장치 및 유기 발광 표시 장치 제조 방법
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101019947B1 (ko) * 2010-06-10 2011-03-09 에스엔유 프리시젼 주식회사 유기 반도체 제조장치
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
WO2012039383A1 (ja) * 2010-09-22 2012-03-29 株式会社アルバック 真空処理装置及び有機薄膜形成方法
JP5661416B2 (ja) * 2010-10-15 2015-01-28 キヤノン株式会社 蒸着装置
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
JP2012156073A (ja) * 2011-01-28 2012-08-16 Konica Minolta Holdings Inc 真空蒸着装置、有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
KR20130015144A (ko) 2011-08-02 2013-02-13 삼성디스플레이 주식회사 증착원어셈블리, 유기층증착장치 및 이를 이용한 유기발광표시장치의 제조 방법
JP5511767B2 (ja) * 2011-10-27 2014-06-04 東京エレクトロン株式会社 蒸着装置
JP2012088731A (ja) * 2011-12-07 2012-05-10 Hitachi Displays Ltd 有機ｅｌ表示装置
JP2013163845A (ja) * 2012-02-10 2013-08-22 Nitto Denko Corp 蒸着用坩堝及び蒸着装置並びに蒸着方法
JP6021377B2 (ja) * 2012-03-28 2016-11-09 日立造船株式会社 真空蒸着装置および真空蒸着装置におけるるつぼ交換方法
JP5840055B2 (ja) * 2012-03-29 2016-01-06 日立造船株式会社 蒸着装置
JP2013209702A (ja) * 2012-03-30 2013-10-10 Nitto Denko Corp 蒸着装置及び蒸着方法
JP5460773B2 (ja) * 2012-04-23 2014-04-02 キヤノン株式会社 成膜装置及び成膜方法
JP6013071B2 (ja) * 2012-08-06 2016-10-25 株式会社カネカ 真空蒸着装置
KR101994838B1 (ko) 2012-09-24 2019-10-01 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
EP2746423B1 (de) * 2012-12-20 2019-12-18 Applied Materials, Inc. Abscheidungsanordnung, Abscheidungsvorrichtung und Betriebsverfahren dafür
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统
KR102111020B1 (ko) * 2013-05-02 2020-05-15 삼성디스플레이 주식회사 증착 장치
JP6302786B2 (ja) * 2014-08-01 2018-03-28 シャープ株式会社 蒸着装置、蒸着方法、及び有機ｅｌ素子の製造方法
DE102014014970B4 (de) * 2014-10-14 2020-01-02 NICE Solar Energy GmbH Vorrichtung und Verfahren zur Schichtdickenmessung für Dampfabscheideverfahren
CN108520833B (zh) * 2018-03-16 2019-09-17 江苏中天科技股份有限公司 多孔铝宏观体及其制造系统与方法
CN108265267B (zh) * 2018-03-26 2020-01-21 京东方科技集团股份有限公司 一种线性蒸发源及蒸镀装置
JP7200083B2 (ja) 2019-10-31 2023-01-06 日立造船株式会社 真空蒸着装置の制御方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690933A (en) * 1970-05-21 1972-09-12 Republic Steel Corp Apparatus and method for continuously condensing metal vapor upon a substrate
US4325986A (en) * 1979-05-29 1982-04-20 University Of Delaware Method for continuous deposition by vacuum evaporation
JP2774351B2 (ja) * 1990-03-26 1998-07-09 出光興産株式会社 有機薄膜エレクトロルミネッセンス素子及びその製造方法
JPH04323362A (ja) * 1991-04-19 1992-11-12 Ulvac Japan Ltd 多層膜の形成方法およびその形成装置
JP2000252269A (ja) * 1992-09-21 2000-09-14 Mitsubishi Electric Corp 液体気化装置及び液体気化方法
JPH06295862A (ja) * 1992-11-20 1994-10-21 Mitsubishi Electric Corp 化合物半導体製造装置及び有機金属材料容器
JPH06196419A (ja) * 1992-12-24 1994-07-15 Canon Inc 化学気相堆積装置及びそれによる半導体装置の製造方法
JPH0784650A (ja) * 1993-07-23 1995-03-31 Hitachi Metals Ltd マスフローコントローラ、その運転方法及び電磁弁
JP3328389B2 (ja) * 1993-09-14 2002-09-24 康夫 垂井 強誘電体薄膜の製造方法
US5776254A (en) * 1994-12-28 1998-07-07 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming thin film by chemical vapor deposition
US5648175A (en) * 1996-02-14 1997-07-15 Applied Materials, Inc. Chemical vapor deposition reactor system and integrated circuit
US5871813A (en) * 1997-03-05 1999-02-16 Applied Materials, Inc. Apparatus and method for controlling process chamber pressure
US5968588A (en) * 1997-03-17 1999-10-19 Applied Materials, Inc. In-situ liquid flow rate estimation and verification by sonic flow method
US5925980A (en) * 1997-05-01 1999-07-20 Motorola, Inc. Organic electroluminescent device with graded region
US6258170B1 (en) * 1997-09-11 2001-07-10 Applied Materials, Inc. Vaporization and deposition apparatus
US6037241A (en) * 1998-02-19 2000-03-14 First Solar, Llc Apparatus and method for depositing a semiconductor material
US6197119B1 (en) * 1999-02-18 2001-03-06 Mks Instruments, Inc. Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
US20020011205A1 (en) * 2000-05-02 2002-01-31 Shunpei Yamazaki Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device
US7517551B2 (en) * 2000-05-12 2009-04-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light-emitting device
KR20030038689A (ko) * 2000-08-10 2003-05-16 신닛테츠가가쿠 가부시키가이샤 유기 ｅｌ 소자의 제조방법 및 장치
US6558735B2 (en) * 2001-04-20 2003-05-06 Eastman Kodak Company Reusable mass-sensor in manufacture of organic light-emitting devices
US6896929B2 (en) * 2001-08-03 2005-05-24 Applied Materials, Inc. Susceptor shaft vacuum pumping
US6649436B2 (en) * 2002-02-11 2003-11-18 Eastman Kodak Company Using organic materials in making an organic light-emitting device
JP2003257635A (ja) * 2002-03-01 2003-09-12 Ulvac Japan Ltd 薄膜形成方法
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
JP2004014311A (ja) * 2002-06-07 2004-01-15 Sony Corp 有機薄膜の形成方法
JP2004043853A (ja) * 2002-07-10 2004-02-12 Sony Corp 薄膜形成装置および薄膜形成方法
JP2007500794A (ja) * 2003-05-16 2007-01-18 エスブイティー アソーシエイツ インコーポレイテッド 薄膜蒸着エバポレーター
JP2005082880A (ja) * 2003-09-11 2005-03-31 Shoka Kagi Kofun Yugenkoshi 有機ｅｌ発光装置の成膜設備

Also Published As

Publication number Publication date
JP2005281808A (ja) 2005-10-13
CN1678143A (zh) 2005-10-05
US20050217584A1 (en) 2005-10-06
EP1584705A1 (de) 2005-10-12
EP1584705B1 (de) 2008-06-25
KR20060043241A (ko) 2006-05-15
TW200532046A (en) 2005-10-01
US20070292610A1 (en) 2007-12-20
JP4366226B2 (ja) 2009-11-18
CN100446300C (zh) 2008-12-24

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