DE602005002860D1 - Vorrichtung zum Scannen von Wafern - Google Patents
Vorrichtung zum Scannen von WafernInfo
- Publication number
- DE602005002860D1 DE602005002860D1 DE602005002860T DE602005002860T DE602005002860D1 DE 602005002860 D1 DE602005002860 D1 DE 602005002860D1 DE 602005002860 T DE602005002860 T DE 602005002860T DE 602005002860 T DE602005002860 T DE 602005002860T DE 602005002860 D1 DE602005002860 D1 DE 602005002860D1
- Authority
- DE
- Germany
- Prior art keywords
- scanning wafers
- wafers
- scanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C15/00—Pavings specially adapted for footpaths, sidewalks or cycle tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C2201/00—Paving elements
- E01C2201/06—Sets of paving elements
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C5/00—Pavings made of prefabricated single units
- E01C5/18—Pavings made of prefabricated single units made of rubber units
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004103434A JP4560321B2 (ja) | 2004-03-31 | 2004-03-31 | ウエハスキャン装置 |
JP2004103434 | 2004-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005002860D1 true DE602005002860D1 (de) | 2007-11-29 |
DE602005002860T2 DE602005002860T2 (de) | 2008-04-10 |
Family
ID=34880031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005002860T Active DE602005002860T2 (de) | 2004-03-31 | 2005-03-30 | Vorrichtung zum Scannen von Wafern |
Country Status (6)
Country | Link |
---|---|
US (1) | US7217934B2 (de) |
EP (1) | EP1583133B1 (de) |
JP (1) | JP4560321B2 (de) |
KR (1) | KR101096862B1 (de) |
DE (1) | DE602005002860T2 (de) |
TW (1) | TWI428952B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100615587B1 (ko) * | 2004-11-25 | 2006-08-25 | 삼성전자주식회사 | 이온주입장치의 패러데이 어셈블리 |
JP4795755B2 (ja) * | 2005-08-25 | 2011-10-19 | 株式会社日立ハイテクノロジーズ | 半導体基板の製造装置 |
JP2008107226A (ja) * | 2006-10-26 | 2008-05-08 | Jeol Ltd | 試料作成装置 |
AT509608B1 (de) * | 2010-12-23 | 2011-10-15 | Leica Mikrosysteme Gmbh | Vorrichtung und verfahren zur kühlung von proben während einer einer ionenstrahlpräparation |
JP5707286B2 (ja) * | 2011-09-21 | 2015-04-30 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置、荷電粒子線装置の調整方法、および試料の検査若しくは試料の観察方法。 |
WO2015079514A1 (ja) * | 2013-11-27 | 2015-06-04 | 株式会社ニレコ | エッジ位置検出センサ |
US9415508B1 (en) * | 2015-05-15 | 2016-08-16 | Varian Semiconductor Equipment Associates, Inc. | Multi-link substrate scanning device |
JP6509089B2 (ja) | 2015-09-30 | 2019-05-08 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置 |
CN110646834A (zh) * | 2018-06-26 | 2020-01-03 | 核工业西南物理研究院 | 应用于高真空装置的全密封精确定位调节机构 |
US11289311B2 (en) | 2018-10-23 | 2022-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for reducing vacuum loss in an ion implantation system |
KR20210024319A (ko) | 2019-08-21 | 2021-03-05 | 삼성전자주식회사 | 웨이퍼 검사장치 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5746456A (en) * | 1980-09-03 | 1982-03-16 | Hitachi Ltd | Ion injector |
US4745287A (en) * | 1986-10-23 | 1988-05-17 | Ionex/Hei | Ion implantation with variable implant angle |
JPS63175326A (ja) * | 1987-01-14 | 1988-07-19 | Nissin Electric Co Ltd | イオン処理装置 |
JPH01276557A (ja) * | 1988-04-28 | 1989-11-07 | Hitachi Ltd | 真空装置 |
JPH0736416B2 (ja) * | 1989-01-25 | 1995-04-19 | 日新電機株式会社 | ウェーハ搬送装置 |
JP3264983B2 (ja) * | 1992-06-09 | 2002-03-11 | 東京エレクトロン株式会社 | イオン注入装置 |
US5406088A (en) * | 1993-12-22 | 1995-04-11 | Eaton Corporation | Scan and tilt apparatus for an ion implanter |
JPH0973873A (ja) * | 1995-09-05 | 1997-03-18 | Nissin Electric Co Ltd | ホルダ駆動装置 |
JP3077605B2 (ja) * | 1996-10-18 | 2000-08-14 | 日新電機株式会社 | ホルダ駆動装置 |
JP3239779B2 (ja) * | 1996-10-29 | 2001-12-17 | 日新電機株式会社 | 基板処理装置および基板処理方法 |
JPH10326590A (ja) * | 1997-05-27 | 1998-12-08 | Oki Electric Ind Co Ltd | イオン注入用ウエハスキャン装置 |
JP3729604B2 (ja) * | 1997-06-16 | 2005-12-21 | 住友イートンノバ株式会社 | イオン注入装置 |
US5898179A (en) * | 1997-09-10 | 1999-04-27 | Orion Equipment, Inc. | Method and apparatus for controlling a workpiece in a vacuum chamber |
JPH11245189A (ja) * | 1998-02-27 | 1999-09-14 | Nippon Seiko Kk | 多段スライド装置 |
JP3363375B2 (ja) * | 1998-03-18 | 2003-01-08 | 東京エレクトロン株式会社 | 基板搬送装置および基板処理装置 |
KR100298587B1 (ko) * | 1999-11-22 | 2001-11-05 | 윤종용 | 이온 주입 장치 |
US6774373B2 (en) * | 2002-07-29 | 2004-08-10 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
US7323695B2 (en) * | 2004-04-05 | 2008-01-29 | Axcelis Technologies, Inc. | Reciprocating drive for scanning a workpiece |
-
2004
- 2004-03-31 JP JP2004103434A patent/JP4560321B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-24 KR KR1020050024471A patent/KR101096862B1/ko active IP Right Grant
- 2005-03-30 TW TW094109957A patent/TWI428952B/zh not_active IP Right Cessation
- 2005-03-30 EP EP05075738A patent/EP1583133B1/de not_active Expired - Fee Related
- 2005-03-30 DE DE602005002860T patent/DE602005002860T2/de active Active
- 2005-03-30 US US11/093,326 patent/US7217934B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1583133B1 (de) | 2007-10-17 |
JP4560321B2 (ja) | 2010-10-13 |
JP2005294331A (ja) | 2005-10-20 |
US7217934B2 (en) | 2007-05-15 |
TWI428952B (zh) | 2014-03-01 |
TW200537547A (en) | 2005-11-16 |
EP1583133A2 (de) | 2005-10-05 |
US20050218336A1 (en) | 2005-10-06 |
DE602005002860T2 (de) | 2008-04-10 |
EP1583133A3 (de) | 2006-07-26 |
KR20060044679A (ko) | 2006-05-16 |
KR101096862B1 (ko) | 2011-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |