DE602004003436D1 - Laserbearbeitungsmaschine und Laserbearbeitungsverfahren - Google Patents

Laserbearbeitungsmaschine und Laserbearbeitungsverfahren

Info

Publication number
DE602004003436D1
DE602004003436D1 DE602004003436T DE602004003436T DE602004003436D1 DE 602004003436 D1 DE602004003436 D1 DE 602004003436D1 DE 602004003436 T DE602004003436 T DE 602004003436T DE 602004003436 T DE602004003436 T DE 602004003436T DE 602004003436 D1 DE602004003436 D1 DE 602004003436D1
Authority
DE
Germany
Prior art keywords
laser processing
processing method
processing machine
machine
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004003436T
Other languages
English (en)
Other versions
DE602004003436T2 (de
Inventor
Yasushi Ito
Futao Naruse
Osamu Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of DE602004003436D1 publication Critical patent/DE602004003436D1/de
Application granted granted Critical
Publication of DE602004003436T2 publication Critical patent/DE602004003436T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00—Separating articles from piles
    • B65H3/08—Separating articles from piles using pneumatic force
    • B65H3/0808—Suction grippers
    • B65H3/0816—Suction grippers separating from the top of pile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/047—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/26—Delivering or advancing articles from machines; Advancing articles to or into piles by dropping the articles
    • B65H29/32—Delivering or advancing articles from machines; Advancing articles to or into piles by dropping the articles from pneumatic, e.g. suction, carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/09—Function indicators indicating that several of an entity are present
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2406/00—Means using fluid
    • B65H2406/30—Suction means
    • B65H2406/34—Suction grippers
    • B65H2406/342—Suction grippers being reciprocated in a rectilinear path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2406/00—Means using fluid
    • B65H2406/30—Suction means
    • B65H2406/35—Other elements with suction surface, e.g. plate or wall
    • B65H2406/351—Other elements with suction surface, e.g. plate or wall facing the surface of the handled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/18—Form of handled article or web
    • B65H2701/182—Piled package
    • B65H2701/1826—Arrangement of sheets
    • B65H2701/18264—Pile of alternate articles of different properties, e.g. pile of working sheets with intermediate sheet between each working sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1928—Printing plate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5124—Plural diverse manufacturing apparatus including means for metal shaping or assembling with means to feed work intermittently from one tool station to another

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
DE602004003436T 2003-08-25 2004-08-18 Laserbearbeitungsmaschine und Laserbearbeitungsverfahren Active DE602004003436T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003208535 2003-08-25
JP2003208535 2003-08-25
JP2004077065 2004-03-17
JP2004077065 2004-03-17
JP2004117328 2004-04-12
JP2004117328A JP4215677B2 (ja) 2003-08-25 2004-04-12 レーザ加工機及びレーザ加工方法

Publications (2)

Publication Number Publication Date
DE602004003436D1 true DE602004003436D1 (de) 2007-01-11
DE602004003436T2 DE602004003436T2 (de) 2007-09-27

Family

ID=34108568

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004003436T Active DE602004003436T2 (de) 2003-08-25 2004-08-18 Laserbearbeitungsmaschine und Laserbearbeitungsverfahren

Country Status (7)

Country Link
US (1) US7132622B2 (de)
EP (1) EP1510482B1 (de)
JP (1) JP4215677B2 (de)
KR (1) KR101098076B1 (de)
CN (1) CN1590006B (de)
DE (1) DE602004003436T2 (de)
TW (1) TWI316437B (de)

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JP2005342748A (ja) * 2004-06-01 2005-12-15 Hitachi Via Mechanics Ltd レーザ加工機
JP4438661B2 (ja) * 2005-03-28 2010-03-24 富士通株式会社 溶接装置および部材把持機構
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US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
JP4375426B2 (ja) * 2007-04-05 2009-12-02 セイコーエプソン株式会社 メディア搬送機構及びそれを備えたメディア処理装置
DE102007023017B4 (de) * 2007-05-15 2011-06-01 Thyssenkrupp Lasertechnik Gmbh Vorrichtung und Verfahren zum Herstellen von Tailored Blanks
JP4795377B2 (ja) * 2008-03-27 2011-10-19 日立ビアメカニクス株式会社 レーザ加工装置
WO2010059595A2 (en) * 2008-11-19 2010-05-27 Applied Materials, Inc. Laser-scribing tool architecture
JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
CN101623796B (zh) * 2009-08-13 2011-10-19 江苏金方圆数控机床有限公司 激光切割自动上下料分选码垛系统
KR20120008345A (ko) * 2010-07-16 2012-01-30 삼성모바일디스플레이주식회사 레이저 조사 장치
TW201318749A (zh) * 2011-11-15 2013-05-16 3D Circuit Taiwan 三維電路雷射加工裝置
KR20140092402A (ko) * 2011-11-16 2014-07-23 어플라이드 머티어리얼스, 인코포레이티드 레이저 스크라이빙 시스템들, 장치들, 및 방법들
CN102794569B (zh) * 2012-08-31 2015-05-20 昆山市和博电子科技有限公司 晶片电阻激光自动划线设备
JP5986470B2 (ja) * 2012-09-25 2016-09-06 ビアメカニクス株式会社 レーザ加工機
CN103600170B (zh) * 2013-04-28 2015-08-26 宝山钢铁股份有限公司 一种纵向金属板上下料与切割方法及其系统
KR101380727B1 (ko) * 2013-05-23 2014-04-02 주식회사 제이플렉스 수동 프레스의 제품 취출시 제품 자동 인출방법 및 그 장치
JP6190696B2 (ja) * 2013-11-01 2017-08-30 株式会社東洋新薬 発泡性皮膚外用剤
US10086471B2 (en) 2014-03-31 2018-10-02 Lincoln Global, Inc. Laser enclosure with reciprocally movable shuttle structure, and method of using same
KR101638161B1 (ko) * 2014-10-28 2016-07-08 (주) 대동에스엠 자동차 부품의 너트 자동용접 시스템
CN104860108B (zh) * 2015-04-08 2016-10-26 广东硕源科技股份有限公司 一种自动切割堆叠设备
CN106964903A (zh) * 2017-03-31 2017-07-21 苏州川普光电有限公司 一种高精度导光板的加工设备
CN107513600A (zh) * 2017-08-31 2017-12-26 江苏密斯欧智能科技有限公司 一种表面改性热处理系统
CN110153551A (zh) * 2018-02-14 2019-08-23 镭射沃激光科技(深圳)有限公司 激光加工装置及利用此的激光加工方法
CN109014607B (zh) * 2018-08-21 2020-06-05 雅科薄膜（东莞）有限公司 一种聚乙烯塑料薄膜生产方法
JP7449097B2 (ja) * 2019-04-09 2024-03-13 株式会社ディスコ レーザー加工装置
CN114082679B (zh) * 2021-11-17 2023-07-21 佛山中科灿光微电子设备有限公司 全自动测阻仪
CN117226280B (zh) * 2023-11-13 2024-03-19 珠海市申科谱工业科技有限公司 一种全自动激光打标设备

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Also Published As

Publication number Publication date
EP1510482B1 (de) 2006-11-29
DE602004003436T2 (de) 2007-09-27
JP4215677B2 (ja) 2009-01-28
US20050045606A1 (en) 2005-03-03
TWI316437B (en) 2009-11-01
KR101098076B1 (ko) 2011-12-26
EP1510482A1 (de) 2005-03-02
TW200513333A (en) 2005-04-16
US7132622B2 (en) 2006-11-07
KR20050022345A (ko) 2005-03-07
CN1590006A (zh) 2005-03-09
JP2005297007A (ja) 2005-10-27
CN1590006B (zh) 2010-05-12

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Legal Events

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8364 No opposition during term of opposition