JP2005342748A - レーザ加工機 - Google Patents
レーザ加工機 Download PDFInfo
- Publication number
- JP2005342748A JP2005342748A JP2004163694A JP2004163694A JP2005342748A JP 2005342748 A JP2005342748 A JP 2005342748A JP 2004163694 A JP2004163694 A JP 2004163694A JP 2004163694 A JP2004163694 A JP 2004163694A JP 2005342748 A JP2005342748 A JP 2005342748A
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- JP
- Japan
- Prior art keywords
- sheet
- laser
- processing
- workpiece
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Abstract
【解決手段】 fθレンズ4aとfθレンズ4bをシート状ワーク2の長手方向(Y方向)と直角の幅方向(X方向)にずらせて配置し、2個のシート状ワーク2を加工テーブル11に対して幅方向に並列に固定して、前記シート状ワークを加工をする。加工テーブル11のY方向の移動ストロークにほぼ等しいプリント基板3を加工することができるので、加工するプリント基板の長さの制限が少ない。また、プリント基板3の加工を完了することができるので、シート状ワーク2の位置決め制御が容易であり、加工能率を向上させることができる。
【選択図】 図2
Description
3 プリント基板
4a レーザ照射手段(fθレンズ)
4b レーザ照射手段(fθレンズ)
11 加工テーブル
23 レーザ分配手段(音響光学素子)
50,51 供給ロール
52,53 巻き取りロール
Claims (2)
- 一端が供給ロールに、他端が巻き取りロールに、それぞれ巻かれたシート状ワークの一部を固定する加工テーブルと、レーザを前記シート状ワーク上に集光させるレーザ照射手段と、を備え、
前記加工テーブルと前記レーザ照射手段とを相対的に移動させて前記加工テーブルに固定された前記シート状ワークを加工し、加工が終了した場合は前記シート状ワークを長手方向に移動させて次の加工領域を前記加工テーブルに固定することを繰り返すレーザ加工機において、
前記レーザ照射手段を複数個設け、
前記レーザ照射手段を前記長手方向と直角の幅方向にずらせて配置し、前記シート状ワークを前記複数個前記加工テーブルに対して前記幅方向に並列に固定して、前記シート状ワークを加工をすることを特徴とするレーザ加工機。 - 前記複数個のレーザ照射手段が、2個であり、1個のレーザ発振器から出力されたレーザを前記2個のレーザ照射手段のいずれか一方に供給するレーザ分配手段を設け、
このレーザ分配手段を介して供給するレーザにより前記シート状ワークを加工をすることを特徴とする請求項1に記載のレーザ加工機。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004163694A JP2005342748A (ja) | 2004-06-01 | 2004-06-01 | レーザ加工機 |
US11/139,587 US7098423B2 (en) | 2004-06-01 | 2005-05-31 | Laser machining apparatus |
DE102005025556A DE102005025556A1 (de) | 2004-06-01 | 2005-06-01 | Laserbearbeitungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004163694A JP2005342748A (ja) | 2004-06-01 | 2004-06-01 | レーザ加工機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005342748A true JP2005342748A (ja) | 2005-12-15 |
JP2005342748A5 JP2005342748A5 (ja) | 2006-04-27 |
Family
ID=35424044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004163694A Pending JP2005342748A (ja) | 2004-06-01 | 2004-06-01 | レーザ加工機 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7098423B2 (ja) |
JP (1) | JP2005342748A (ja) |
DE (1) | DE102005025556A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9029731B2 (en) * | 2007-01-26 | 2015-05-12 | Electro Scientific Industries, Inc. | Methods and systems for laser processing continuously moving sheet material |
US8084712B2 (en) * | 2007-03-16 | 2011-12-27 | TEN Medias LLC | Method and apparatus for laser marking objects |
DE102008022449A1 (de) * | 2008-05-08 | 2009-11-12 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungsmaschine mit erweitertem Arbeitsraum |
KR20120008345A (ko) * | 2010-07-16 | 2012-01-30 | 삼성모바일디스플레이주식회사 | 레이저 조사 장치 |
KR20140007968A (ko) * | 2012-03-08 | 2014-01-20 | 바오샨 아이론 앤 스틸 유한공사 | 자동차 시트 블랭킹 방법 및 그 시스템 |
EP3038821A4 (en) * | 2013-08-28 | 2017-05-03 | Odds, LLC | Overwrapping food system using laser-perforated film |
EP3077148B1 (en) * | 2013-12-04 | 2019-05-01 | Microlution, Inc. | System for drilling small holes ; method of drilling a hole ; article of manufacturing for perfoming drilling |
DE202013105639U1 (de) | 2013-12-11 | 2014-01-15 | Dr. Schneider Kunststoffwerke Gmbh | Schallabsorbierendes Element für einen Luftausströmer |
CN106346144A (zh) * | 2016-08-25 | 2017-01-25 | 安庆市兴丰工贸有限公司 | 一种塑料薄膜生产系统的打孔组件 |
FR3084005B1 (fr) * | 2018-07-21 | 2020-07-31 | Michelin & Cie | Procede de realisation d'un element moulant avec fente d'evacuation d'air |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4639572A (en) * | 1985-11-25 | 1987-01-27 | Ibm Corporation | Laser cutting of composite materials |
JPH0569170A (ja) * | 1991-09-13 | 1993-03-23 | Amada Co Ltd | レーザ加工機 |
US6040552A (en) * | 1997-01-30 | 2000-03-21 | Jain; Kanti | High-speed drilling system for micro-via pattern formation, and resulting structure |
KR100446052B1 (ko) * | 1997-05-15 | 2004-10-14 | 스미도모쥬기가이고교 가부시키가이샤 | 다수의갈바노스캐너를사용한레이저빔가공장치 |
JP4218209B2 (ja) * | 1999-03-05 | 2009-02-04 | 三菱電機株式会社 | レーザ加工装置 |
JP3504200B2 (ja) * | 1999-12-01 | 2004-03-08 | 日鐵溶接工業株式会社 | マルチシ−トの同時連続溶接装置 |
JP3855684B2 (ja) * | 2001-06-05 | 2006-12-13 | 松下電器産業株式会社 | レーザ加工装置およびレーザ加工方法 |
JP4215677B2 (ja) * | 2003-08-25 | 2009-01-28 | 日立ビアメカニクス株式会社 | レーザ加工機及びレーザ加工方法 |
-
2004
- 2004-06-01 JP JP2004163694A patent/JP2005342748A/ja active Pending
-
2005
- 2005-05-31 US US11/139,587 patent/US7098423B2/en not_active Expired - Fee Related
- 2005-06-01 DE DE102005025556A patent/DE102005025556A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20050263506A1 (en) | 2005-12-01 |
DE102005025556A1 (de) | 2005-12-22 |
US7098423B2 (en) | 2006-08-29 |
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