DE60140077D1 - Vorrichtung zur mehrstrahllaserbearbeitung - Google Patents

Vorrichtung zur mehrstrahllaserbearbeitung

Info

Publication number
DE60140077D1
DE60140077D1 DE60140077T DE60140077T DE60140077D1 DE 60140077 D1 DE60140077 D1 DE 60140077D1 DE 60140077 T DE60140077 T DE 60140077T DE 60140077 T DE60140077 T DE 60140077T DE 60140077 D1 DE60140077 D1 DE 60140077D1
Authority
DE
Germany
Prior art keywords
array
elements
light
light modulator
microlens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140077T
Other languages
English (en)
Inventor
Sergei V Oshemkov
Vladimir Yu Dmitriev
Nicolai N Guletsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pixer Technology Ltd
Original Assignee
Pixer Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pixer Technology Ltd filed Critical Pixer Technology Ltd
Application granted granted Critical
Publication of DE60140077D1 publication Critical patent/DE60140077D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Laser Surgery Devices (AREA)
DE60140077T 2000-10-23 2001-10-22 Vorrichtung zur mehrstrahllaserbearbeitung Expired - Lifetime DE60140077D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/694,429 US6625181B1 (en) 2000-10-23 2000-10-23 Method and apparatus for multi-beam laser machining
PCT/IL2001/000969 WO2002034446A2 (en) 2000-10-23 2001-10-22 Method and apparatus for multi-beam laser machining

Publications (1)

Publication Number Publication Date
DE60140077D1 true DE60140077D1 (de) 2009-11-12

Family

ID=24788787

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140077T Expired - Lifetime DE60140077D1 (de) 2000-10-23 2001-10-22 Vorrichtung zur mehrstrahllaserbearbeitung

Country Status (7)

Country Link
US (1) US6625181B1 (de)
EP (1) EP1345726B1 (de)
AT (1) ATE444136T1 (de)
AU (1) AU2002212648A1 (de)
CA (1) CA2425875A1 (de)
DE (1) DE60140077D1 (de)
WO (1) WO2002034446A2 (de)

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JPWO2005084874A1 (ja) * 2004-03-05 2008-01-17 オリンパス株式会社 レーザ加工装置
US20060032841A1 (en) * 2004-08-10 2006-02-16 Tan Kee C Forming features in printhead components
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
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DE112006001394B4 (de) * 2005-06-01 2010-04-08 Phoeton Corp., Atsugi Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren
JP2007054992A (ja) * 2005-08-23 2007-03-08 Sii Printek Inc インクジェットヘッド用ノズルプレートの製造方法、インクジェットヘッド用ノズルプレートの製造装置、インクジェットヘッド用ノズルプレート、インクジェットヘッド、およびインクジェット記録装置
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US8122846B2 (en) * 2005-10-26 2012-02-28 Micronic Mydata AB Platforms, apparatuses, systems and methods for processing and analyzing substrates
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JP4938784B2 (ja) * 2005-10-26 2012-05-23 マイクロニック レーザー システムズ アクチボラゲット 書込み装置および方法
EP1957959A2 (de) 2005-11-30 2008-08-20 Board of Trustees of Michigan State University Identifizierung molekularer eigenschaften auf laserbasis
WO2007145702A2 (en) * 2006-04-10 2007-12-21 Board Of Trustees Of Michigan State University Laser material processing systems and methods with, in particular, use of a hollow waveguide for broadening the bandwidth of the pulse above 20 nm
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CN101439431A (zh) * 2007-11-21 2009-05-27 新科实业有限公司 多束激光接合机及接合方法
US8311069B2 (en) 2007-12-21 2012-11-13 Board Of Trustees Of Michigan State University Direct ultrashort laser system
DE102008032751B3 (de) * 2008-07-11 2009-12-10 Innolas Systems Gmbh Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners
EP2211430A3 (de) 2009-01-23 2015-05-27 Board of Trustees of Michigan State University Laserautokorrelationssystem
WO2010141128A2 (en) 2009-03-05 2010-12-09 Board Of Trustees Of Michigan State University Laser amplification system
US8630322B2 (en) 2010-03-01 2014-01-14 Board Of Trustees Of Michigan State University Laser system for output manipulation
JP5495043B2 (ja) * 2010-04-23 2014-05-21 株式会社ブイ・テクノロジー レーザアニール方法、装置及びマイクロレンズアレイ
GB2488780A (en) * 2011-03-07 2012-09-12 Isis Innovation Laser Fabrication System and Method
WO2014140046A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Mechanically produced alignment fiducial method and device
WO2014140047A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
JP6014538B2 (ja) 2013-04-05 2016-10-25 浜松ホトニクス株式会社 光学モジュール、光観察装置、及び光照射装置
JP6014537B2 (ja) 2013-04-05 2016-10-25 浜松ホトニクス株式会社 光学モジュールおよび観察装置
JP6043228B2 (ja) * 2013-04-05 2016-12-14 浜松ホトニクス株式会社 光学モジュールおよび光照射装置
US9855626B2 (en) * 2015-01-29 2018-01-02 Rohr, Inc. Forming a pattern of apertures in an object with a plurality of laser beams
CN106495454A (zh) * 2016-12-19 2017-03-15 华南师范大学 皮秒激光玻璃焊接系统及方法
DE102017200170A1 (de) 2017-01-09 2018-07-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Formung eines Laserstrahls durch einen programmierbaren Strahlformer
KR102160225B1 (ko) 2017-06-12 2020-09-28 유니카르타, 인크. 개별 부품들의 기판 상으로의 병렬적 조립
WO2019179604A1 (de) 2018-03-20 2019-09-26 Robert Bosch Gmbh Vorrichtung und verfahren zur formung eines laserstrahls durch einen programmierbaren strahlformer
CN109483067B (zh) * 2018-12-04 2020-10-02 淄博职业学院 一种计算机控制式激光加工装置及其加工方法
US20210283719A1 (en) * 2020-03-12 2021-09-16 Rohr, Inc. Substrate perforation system & method using beamlets
BE1028021B1 (fr) * 2020-06-30 2021-08-23 Laser Eng Applications Dispositif optique pour le marquage de pièces transparentes
EP4079446A1 (de) * 2021-04-19 2022-10-26 Akzenta Paneele + Profile GmbH Verfahren zum herstellen eines dekorpaneels mit verbesserter strukturierung
DE102021134080A1 (de) 2021-12-21 2023-06-22 Ekpo Fuel Cell Technologies Gmbh Brennstoffzellenvorrichtung mit Flachbauteil sowie Verfahren zur Herstellung einer Brennstoffzellenvorrichtung mit Flachbauteil und Anlage hierfür

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Also Published As

Publication number Publication date
WO2002034446A2 (en) 2002-05-02
ATE444136T1 (de) 2009-10-15
AU2002212648A1 (en) 2002-05-06
EP1345726B1 (de) 2009-09-30
WO2002034446A3 (en) 2003-02-06
CA2425875A1 (en) 2002-05-02
EP1345726A4 (de) 2008-01-30
EP1345726A2 (de) 2003-09-24
US6625181B1 (en) 2003-09-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition