DE602005001440D1 - Laserschneidgerät - Google Patents

Laserschneidgerät

Info

Publication number
DE602005001440D1
DE602005001440D1 DE602005001440T DE602005001440T DE602005001440D1 DE 602005001440 D1 DE602005001440 D1 DE 602005001440D1 DE 602005001440 T DE602005001440 T DE 602005001440T DE 602005001440 T DE602005001440 T DE 602005001440T DE 602005001440 D1 DE602005001440 D1 DE 602005001440D1
Authority
DE
Germany
Prior art keywords
cutting machine
laser cutting
optical axis
laser
focussing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005001440T
Other languages
English (en)
Other versions
DE602005001440T2 (de
Inventor
Dirk Emiel Jozef Verschueren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BETTONVILLE INTEGRATED SOLUTIO
Original Assignee
BETTONVILLE INTEGRATED SOLUTIO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BETTONVILLE INTEGRATED SOLUTIO filed Critical BETTONVILLE INTEGRATED SOLUTIO
Publication of DE602005001440D1 publication Critical patent/DE602005001440D1/de
Application granted granted Critical
Publication of DE602005001440T2 publication Critical patent/DE602005001440T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
DE602005001440T 2005-03-04 2005-03-04 Laserschneidgerät Active DE602005001440T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05075533A EP1698426B1 (de) 2005-03-04 2005-03-04 Laserschneidgerät

Publications (2)

Publication Number Publication Date
DE602005001440D1 true DE602005001440D1 (de) 2007-08-02
DE602005001440T2 DE602005001440T2 (de) 2008-06-19

Family

ID=34938081

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005001440T Active DE602005001440T2 (de) 2005-03-04 2005-03-04 Laserschneidgerät

Country Status (5)

Country Link
US (1) US7176406B2 (de)
EP (1) EP1698426B1 (de)
AT (1) ATE365092T1 (de)
DE (1) DE602005001440T2 (de)
IL (1) IL171585A (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008000306B4 (de) * 2008-02-15 2010-08-19 3D-Micromac Ag Verfahren und Vorrichtung zum Laserschneiden
BE1018554A3 (nl) * 2009-06-26 2011-03-01 Bettonville Integrated Solutions Nv Inrichting en werkwijze voor het afvlakken van een edelsteen.
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
US9217731B2 (en) 2010-05-21 2015-12-22 Kabushiki Kaisha Toshiba Welding inspection method and apparatus thereof
US20110284508A1 (en) * 2010-05-21 2011-11-24 Kabushiki Kaisha Toshiba Welding system and welding method
JP5393598B2 (ja) * 2010-06-03 2014-01-22 キヤノン株式会社 ガルバノ装置及びレーザ加工装置
DE102010032958A1 (de) 2010-07-30 2012-02-02 Messer Cutting & Welding Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten eines Werkstücks mittels Laserstrahl
JP5737900B2 (ja) * 2010-10-15 2015-06-17 三菱重工業株式会社 レーザ加工装置及びレーザ加工方法
DE102011082834B4 (de) * 2011-09-16 2016-09-22 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Maschine zum Laserstrahlschneiden von Werkstücken mit einstellbarer Kantenwinkligkeit
DE102011057026B4 (de) * 2011-12-23 2017-11-02 Acandis Gmbh & Co. Kg Medizinische Vorrichtung zum Einführen in ein Körperhohlorgan und Herstellungsverfahren
CN105499795B (zh) * 2015-12-30 2017-11-14 武汉嘉铭激光有限公司 一种激光切割系统及其控制方法
JP7325194B2 (ja) * 2019-02-19 2023-08-14 三菱重工業株式会社 溶接物製造方法、溶接物製造システム及び溶接物
EP3928913A1 (de) 2020-06-25 2021-12-29 Bystronic Laser AG Bearbeitungskopf und verfahren zur laserbearbeitung
US11559375B2 (en) * 2020-07-16 2023-01-24 Leszek Aleksander Tomasik Diamond dental teeth formed by using laser energy
CN111843237A (zh) * 2020-07-24 2020-10-30 广州三义激光科技有限公司 一种人工钻石激光切割工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH534570A (de) * 1967-09-25 1973-04-30 Laser Tech Sa Vorrichtung zum Bohren von Uhrensteinen mittels Laserstrahlung
US4547651A (en) * 1981-05-28 1985-10-15 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
JPH0818153B2 (ja) * 1986-06-27 1996-02-28 株式会社小松製作所 レ−ザ装置
US4822974A (en) * 1988-02-18 1989-04-18 United Technologies Corporation Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism
JPH04270091A (ja) * 1991-01-18 1992-09-25 Nissan Motor Co Ltd レーザ加工装置
JP3063688B2 (ja) * 1997-07-30 2000-07-12 日本電気株式会社 レーザ加工装置及びその制御方法並びにその制御プログラムを記録した記録媒体
DE19905571C1 (de) * 1999-02-11 2000-11-16 Bosch Gmbh Robert Verfahren zur Erzeugung definiert konischer Löcher mittels eines Laserstrahls
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Also Published As

Publication number Publication date
US20060196860A1 (en) 2006-09-07
ATE365092T1 (de) 2007-07-15
EP1698426A1 (de) 2006-09-06
DE602005001440T2 (de) 2008-06-19
IL171585A (en) 2009-12-24
US7176406B2 (en) 2007-02-13
EP1698426B1 (de) 2007-06-20

Similar Documents

Publication Publication Date Title
DE602005001440D1 (de) Laserschneidgerät
MY149114A (en) Focusing an optical beam to two foci
ATE431216T1 (de) Scannerkopf und bearbeitungsmaschine damit
ATE331235T1 (de) Optisches system mit elektronischer punktgrössensteuerung und fokussierungskontrolle
ATE343148T1 (de) Vorrichtung zur fokussierung eines laserstrahls
TWI266893B (en) Beam focusing and scanning system using micromirror array lens
ATE455312T1 (de) Laser-scanning-mikroskop
KR100817825B1 (ko) 레이저 가공장치
ATE470883T1 (de) Optische abtastvorrichtung und bildanzeigegerät
ATE314672T1 (de) Hochdurchsatzscreening-mikroskop mit autofokus- einrichtung
EP1851520A2 (de) Lasererzeugte plasma-euv-lichtquelle
WO2007056486A3 (en) Laser scanner
RU2007143782A (ru) Устройство многопозиционной лазерной обработки
DK2138138T3 (da) Indretning til dannelse af krumme snitflader i et transparent materiale
ATE481600T1 (de) Led-anzeigevorrichtung
WO2010036669A3 (en) Post-lens steering of a laser beam for micro-machining applications
EP2058688A3 (de) Strahleinstellungsoptik
DE602006008717D1 (de) Optische Abtastvorrichtung und Bilderzeugungsvorrichtung damit
TW200705440A (en) Lens positioning method, cutting method, positioning method, and cutting apparatus
DE502004011958D1 (de) Strahlformungsvorrichtung
TW200623091A (en) Optical pickup and optical disc device
BRPI0815581A2 (pt) Dispositivo e processo para grafar uma imagem de estrutura reversível
WO2006111896A3 (en) Device for directing radiation to a layer, apparatus with such device and method using such apparatus
TWI705869B (zh) 雷射整合切換裝置
TW200717504A (en) Optical printhead

Legal Events

Date Code Title Description
8364 No opposition during term of opposition