ATE444136T1 - Vorrichtung zur mehrstrahllaserbearbeitung - Google Patents
Vorrichtung zur mehrstrahllaserbearbeitungInfo
- Publication number
- ATE444136T1 ATE444136T1 AT01980864T AT01980864T ATE444136T1 AT E444136 T1 ATE444136 T1 AT E444136T1 AT 01980864 T AT01980864 T AT 01980864T AT 01980864 T AT01980864 T AT 01980864T AT E444136 T1 ATE444136 T1 AT E444136T1
- Authority
- AT
- Austria
- Prior art keywords
- array
- elements
- light
- light modulator
- microlens
- Prior art date
Links
- 238000003754 machining Methods 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Laser Surgery Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/694,429 US6625181B1 (en) | 2000-10-23 | 2000-10-23 | Method and apparatus for multi-beam laser machining |
| PCT/IL2001/000969 WO2002034446A2 (en) | 2000-10-23 | 2001-10-22 | Method and apparatus for multi-beam laser machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE444136T1 true ATE444136T1 (de) | 2009-10-15 |
Family
ID=24788787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01980864T ATE444136T1 (de) | 2000-10-23 | 2001-10-22 | Vorrichtung zur mehrstrahllaserbearbeitung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6625181B1 (de) |
| EP (1) | EP1345726B1 (de) |
| AT (1) | ATE444136T1 (de) |
| AU (1) | AU2002212648A1 (de) |
| CA (1) | CA2425875A1 (de) |
| DE (1) | DE60140077D1 (de) |
| WO (1) | WO2002034446A2 (de) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6929886B2 (en) * | 2001-01-02 | 2005-08-16 | U-C-Laser Ltd. | Method and apparatus for the manufacturing of reticles |
| US7450618B2 (en) | 2001-01-30 | 2008-11-11 | Board Of Trustees Operating Michigan State University | Laser system using ultrashort laser pulses |
| US7583710B2 (en) | 2001-01-30 | 2009-09-01 | Board Of Trustees Operating Michigan State University | Laser and environmental monitoring system |
| US7973936B2 (en) | 2001-01-30 | 2011-07-05 | Board Of Trustees Of Michigan State University | Control system and apparatus for use with ultra-fast laser |
| US8208505B2 (en) | 2001-01-30 | 2012-06-26 | Board Of Trustees Of Michigan State University | Laser system employing harmonic generation |
| US7567596B2 (en) | 2001-01-30 | 2009-07-28 | Board Of Trustees Of Michigan State University | Control system and apparatus for use with ultra-fast laser |
| US6717104B2 (en) * | 2001-06-13 | 2004-04-06 | The Regents Of The University Of California | Programmable phase plate for tool modification in laser machining applications |
| US6720519B2 (en) * | 2001-11-30 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling |
| US6803539B2 (en) * | 2002-07-25 | 2004-10-12 | Matsushita Electrical Industrial Co., Ltd. | System and method of aligning a microfilter in a laser drilling system using a CCD camera |
| US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| US20050155500A1 (en) * | 2004-01-16 | 2005-07-21 | Icon Textile Laser Systems, Inc. | Screen printing and laser treating system and method |
| EP1721695A4 (de) * | 2004-03-05 | 2009-04-01 | Olympus Corp | Laserbearbeitungseinrichtung |
| US20060032841A1 (en) * | 2004-08-10 | 2006-02-16 | Tan Kee C | Forming features in printhead components |
| US20060039419A1 (en) * | 2004-08-16 | 2006-02-23 | Tan Deshi | Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths |
| US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
| US8633437B2 (en) | 2005-02-14 | 2014-01-21 | Board Of Trustees Of Michigan State University | Ultra-fast laser system |
| JP4199820B2 (ja) * | 2005-06-01 | 2008-12-24 | フェトン株式会社 | レーザー加工装置及びレーザー加工方法 |
| JP2007054992A (ja) * | 2005-08-23 | 2007-03-08 | Sii Printek Inc | インクジェットヘッド用ノズルプレートの製造方法、インクジェットヘッド用ノズルプレートの製造装置、インクジェットヘッド用ノズルプレート、インクジェットヘッド、およびインクジェット記録装置 |
| AU2006299612A1 (en) * | 2005-10-03 | 2007-04-12 | Aradigm Corporation | Method and system for laser machining |
| WO2007050022A2 (en) * | 2005-10-26 | 2007-05-03 | Micronic Laser Systems Ab | Writing apparatuses and methods |
| CN101346668B (zh) * | 2005-10-26 | 2013-07-17 | 麦克罗尼克激光系统公司 | 写入装置和方法 |
| US8122846B2 (en) * | 2005-10-26 | 2012-02-28 | Micronic Mydata AB | Platforms, apparatuses, systems and methods for processing and analyzing substrates |
| US8618470B2 (en) | 2005-11-30 | 2013-12-31 | Board Of Trustees Of Michigan State University | Laser based identification of molecular characteristics |
| WO2007145702A2 (en) * | 2006-04-10 | 2007-12-21 | Board Of Trustees Of Michigan State University | Laser material processing systems and methods with, in particular, use of a hollow waveguide for broadening the bandwidth of the pulse above 20 nm |
| US7443903B2 (en) * | 2006-04-19 | 2008-10-28 | Mobius Photonics, Inc. | Laser apparatus having multiple synchronous amplifiers tied to one master oscillator |
| WO2008011059A1 (en) * | 2006-07-20 | 2008-01-24 | Board Of Trustees Of Michigan State University | Laser plasmonic system |
| JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
| CN101439431A (zh) * | 2007-11-21 | 2009-05-27 | 新科实业有限公司 | 多束激光接合机及接合方法 |
| WO2009086122A2 (en) | 2007-12-21 | 2009-07-09 | Board Of Trustees Of Michigan State University | Control in ultrashort laser systems by a deformable mirror in the stretcher |
| DE102008032751B3 (de) * | 2008-07-11 | 2009-12-10 | Innolas Systems Gmbh | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners |
| EP2211430A3 (de) | 2009-01-23 | 2015-05-27 | Board of Trustees of Michigan State University | Laserautokorrelationssystem |
| WO2010141128A2 (en) | 2009-03-05 | 2010-12-09 | Board Of Trustees Of Michigan State University | Laser amplification system |
| US8630322B2 (en) | 2010-03-01 | 2014-01-14 | Board Of Trustees Of Michigan State University | Laser system for output manipulation |
| JP5495043B2 (ja) * | 2010-04-23 | 2014-05-21 | 株式会社ブイ・テクノロジー | レーザアニール方法、装置及びマイクロレンズアレイ |
| GB2488780A (en) * | 2011-03-07 | 2012-09-12 | Isis Innovation | Laser Fabrication System and Method |
| WO2014140047A2 (en) | 2013-03-12 | 2014-09-18 | Micronic Mydata AB | Method and device for writing photomasks with reduced mura errors |
| CN105143987B (zh) | 2013-03-12 | 2017-10-20 | 麦克罗尼克迈达塔有限责任公司 | 机械制造的对准基准方法和对准系统 |
| JP6043228B2 (ja) * | 2013-04-05 | 2016-12-14 | 浜松ホトニクス株式会社 | 光学モジュールおよび光照射装置 |
| JP6014537B2 (ja) | 2013-04-05 | 2016-10-25 | 浜松ホトニクス株式会社 | 光学モジュールおよび観察装置 |
| JP6014538B2 (ja) | 2013-04-05 | 2016-10-25 | 浜松ホトニクス株式会社 | 光学モジュール、光観察装置、及び光照射装置 |
| US9855626B2 (en) * | 2015-01-29 | 2018-01-02 | Rohr, Inc. | Forming a pattern of apertures in an object with a plurality of laser beams |
| CN106495454A (zh) * | 2016-12-19 | 2017-03-15 | 华南师范大学 | 皮秒激光玻璃焊接系统及方法 |
| DE102017200170A1 (de) | 2017-01-09 | 2018-07-12 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Formung eines Laserstrahls durch einen programmierbaren Strahlformer |
| CN109417065B (zh) | 2017-06-12 | 2024-05-14 | 库力索法荷兰有限公司 | 分立组件向基板上的并行组装 |
| CN111868602B (zh) | 2018-03-20 | 2022-07-26 | 罗伯特·博世有限公司 | 用于通过可编程光束整形器来对激光光束进行整形的设备和方法 |
| CN109483067B (zh) * | 2018-12-04 | 2020-10-02 | 淄博职业学院 | 一种计算机控制式激光加工装置及其加工方法 |
| CN110732771A (zh) * | 2019-11-06 | 2020-01-31 | 西安中科微精光子制造科技有限公司 | 一种动态可控激光分束装置 |
| US12064830B2 (en) * | 2020-03-12 | 2024-08-20 | Rohr, Inc. | Substrate perforation system and method using beamlets |
| BE1028021B1 (fr) * | 2020-06-30 | 2021-08-23 | Laser Eng Applications | Dispositif optique pour le marquage de pièces transparentes |
| JP7547105B2 (ja) * | 2020-07-29 | 2024-09-09 | 株式会社ディスコ | Si基板生成方法 |
| PL4079446T3 (pl) * | 2021-04-19 | 2025-02-17 | Akzenta Paneele + Profile Gmbh | Sposób wytwarzania panelu dekoracyjnego o ulepszonej strukturze |
| DE102021134080A1 (de) | 2021-12-21 | 2023-06-22 | Ekpo Fuel Cell Technologies Gmbh | Brennstoffzellenvorrichtung mit Flachbauteil sowie Verfahren zur Herstellung einer Brennstoffzellenvorrichtung mit Flachbauteil und Anlage hierfür |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2663560B2 (ja) * | 1988-10-12 | 1997-10-15 | 日本電気株式会社 | レーザ加工装置 |
| JPH082511B2 (ja) * | 1989-05-08 | 1996-01-17 | 松下電器産業株式会社 | レーザ加工装置 |
| JP2657957B2 (ja) * | 1990-04-27 | 1997-09-30 | キヤノン株式会社 | 投影装置及び光照射方法 |
| DE69222113T2 (de) * | 1991-05-21 | 1998-02-05 | Seiko Epson Corp | Optische vorrichtung und optisches bearbeitungssystem unter verwendung der optischen vorrichtung |
| EP0627643B1 (de) | 1993-06-03 | 1999-05-06 | Hamamatsu Photonics K.K. | Optisches Laser-Abtastsystem mit Axikon |
| US5400319A (en) * | 1993-10-06 | 1995-03-21 | Digital Audio Disc Corporation | CD-ROM with machine-readable I.D. code |
| JP3462272B2 (ja) * | 1994-09-07 | 2003-11-05 | 浜松ホトニクス株式会社 | アレイ電極基板の検査装置 |
| US5981902A (en) * | 1994-12-15 | 1999-11-09 | Mitsubishi Chemical Corporation | Texturing apparatus for magnetic recording medium and magnetic recording medium process thereby |
| DE19602307A1 (de) * | 1996-01-23 | 1997-07-24 | Roland Man Druckmasch | Druckmaschine |
| US6037967A (en) | 1996-12-18 | 2000-03-14 | Etec Systems, Inc. | Short wavelength pulsed laser scanner |
| US5946130A (en) * | 1997-10-03 | 1999-08-31 | Mcdonnell Douglas Corporation | Optical fiber amplifier network having a coherently combined output and high-power laser amplifier containing same |
| SE9800965D0 (sv) * | 1998-03-23 | 1998-03-23 | Astra Ab | Analysing Device |
| US6037564A (en) * | 1998-03-31 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Method for scanning a beam and an apparatus therefor |
| US6181472B1 (en) * | 1998-06-10 | 2001-01-30 | Robotic Vision Systems, Inc. | Method and system for imaging an object with a plurality of optical beams |
| US6208424B1 (en) * | 1998-08-27 | 2001-03-27 | Zygo Corporation | Interferometric apparatus and method for measuring motion along multiple axes |
| US6377591B1 (en) * | 1998-12-09 | 2002-04-23 | Mcdonnell Douglas Corporation | Modularized fiber optic laser system and associated optical amplification modules |
| US6246046B1 (en) * | 1999-01-21 | 2001-06-12 | University Of Pittsburgh | Method and apparatus for electronically controlled scanning of micro-area devices |
| JP2000267295A (ja) * | 1999-03-15 | 2000-09-29 | Fujitsu Ltd | 露光方法及びその装置 |
-
2000
- 2000-10-23 US US09/694,429 patent/US6625181B1/en not_active Expired - Lifetime
-
2001
- 2001-10-22 EP EP01980864A patent/EP1345726B1/de not_active Expired - Lifetime
- 2001-10-22 WO PCT/IL2001/000969 patent/WO2002034446A2/en not_active Ceased
- 2001-10-22 DE DE60140077T patent/DE60140077D1/de not_active Expired - Lifetime
- 2001-10-22 AT AT01980864T patent/ATE444136T1/de not_active IP Right Cessation
- 2001-10-22 CA CA002425875A patent/CA2425875A1/en not_active Abandoned
- 2001-10-22 AU AU2002212648A patent/AU2002212648A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1345726B1 (de) | 2009-09-30 |
| WO2002034446A2 (en) | 2002-05-02 |
| AU2002212648A1 (en) | 2002-05-06 |
| US6625181B1 (en) | 2003-09-23 |
| CA2425875A1 (en) | 2002-05-02 |
| DE60140077D1 (de) | 2009-11-12 |
| WO2002034446A3 (en) | 2003-02-06 |
| EP1345726A2 (de) | 2003-09-24 |
| EP1345726A4 (de) | 2008-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |