DE60122626D1 - Zweipol-Halbleiter-Überstromschutz - Google Patents

Zweipol-Halbleiter-Überstromschutz

Info

Publication number
DE60122626D1
DE60122626D1 DE60122626T DE60122626T DE60122626D1 DE 60122626 D1 DE60122626 D1 DE 60122626D1 DE 60122626 T DE60122626 T DE 60122626T DE 60122626 T DE60122626 T DE 60122626T DE 60122626 D1 DE60122626 D1 DE 60122626D1
Authority
DE
Germany
Prior art keywords
mosfet
zener diode
overcurrent protection
terminal semiconductor
vertical mosfet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60122626T
Other languages
English (en)
Other versions
DE60122626T2 (de
Inventor
Kunihito Ohshima
Masaya Shirota
Toshikazu Tezuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Publication of DE60122626D1 publication Critical patent/DE60122626D1/de
Application granted granted Critical
Publication of DE60122626T2 publication Critical patent/DE60122626T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60122626T 2000-06-30 2001-06-20 Halbleiter-Überstrombegrenzer Expired - Fee Related DE60122626T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000198415 2000-06-30
JP2000198415A JP3660566B2 (ja) 2000-06-30 2000-06-30 過電流制限型半導体素子

Publications (2)

Publication Number Publication Date
DE60122626D1 true DE60122626D1 (de) 2006-10-12
DE60122626T2 DE60122626T2 (de) 2007-08-30

Family

ID=18696581

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60122626T Expired - Fee Related DE60122626T2 (de) 2000-06-30 2001-06-20 Halbleiter-Überstrombegrenzer

Country Status (5)

Country Link
US (1) US6469352B2 (de)
EP (1) EP1168449B1 (de)
JP (1) JP3660566B2 (de)
AT (1) ATE338344T1 (de)
DE (1) DE60122626T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6521958B1 (en) * 1999-08-26 2003-02-18 Micron Technology, Inc. MOSFET technology for programmable address decode and correction
US6674667B2 (en) * 2001-02-13 2004-01-06 Micron Technology, Inc. Programmable fuse and antifuse and method therefor
TW200509496A (en) * 2003-08-21 2005-03-01 Fultec Pty Ltd Proprietary Integrated electronic disconnecting circuits, methods, and systems
JP4437655B2 (ja) * 2003-10-02 2010-03-24 三菱電機株式会社 半導体装置及び半導体装置の駆動回路
DE102004052096B4 (de) * 2004-10-26 2016-05-19 Infineon Technologies Ag Halbleiterschaltelement mit Feldeffekttransistoren
JP4718517B2 (ja) * 2007-05-29 2011-07-06 Ｉｍｖ株式会社 基板検査装置
CN101452953B (zh) * 2007-11-28 2011-10-26 广州南科集成电子有限公司 一种恒流源器件及制造方法
JP4632068B2 (ja) * 2008-05-30 2011-02-16 三菱電機株式会社 半導体装置
US9379045B2 (en) 2012-09-13 2016-06-28 Fairchild Semiconductor Corporation Common drain power clip for battery pack protection mosfet
US9343568B2 (en) * 2014-05-12 2016-05-17 Macronix International Co., Ltd. Semiconductor device having high-resistance conductor structure, method of manufacturing the same and method of operating the same
CN104992934B (zh) * 2015-05-29 2018-01-09 株洲南车时代电气股份有限公司 功率半导体器件子模组
US9553087B1 (en) * 2015-11-02 2017-01-24 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device
DE102016207859B3 (de) * 2016-05-06 2017-10-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Monolithisch integrierter Halbleiterschalter, insbesondere Leistungstrennschalter
CN110993600B (zh) * 2019-12-16 2024-03-15 广东聚华印刷显示技术有限公司 Esd防护结构、esd防护结构制作方法及显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533970A (en) * 1983-06-27 1985-08-06 Motorola, Inc. Series current limiter
JPS63181376A (ja) * 1987-01-23 1988-07-26 Toshiba Corp 半導体装置
JP3111576B2 (ja) * 1992-01-06 2000-11-27 富士電機株式会社 半導体装置
US5550701A (en) * 1994-08-30 1996-08-27 International Rectifier Corporation Power MOSFET with overcurrent and over-temperature protection and control circuit decoupled from body diode
FR2742933B1 (fr) 1995-12-20 1998-03-13 Sgs Thomson Microelectronics Composant statique et monolithique limiteur de courant et disjoncteur
FR2751489B1 (fr) * 1996-07-16 1998-10-16 Sgs Thomson Microelectronics Microdisjoncteur statique autoblocable
FR2766984B1 (fr) 1997-08-01 1999-09-03 Commissariat Energie Atomique Dispositif de protection d'une charge electrique et circuit d'alimentation comportant un tel dispositif

Also Published As

Publication number Publication date
EP1168449B1 (de) 2006-08-30
US20020000568A1 (en) 2002-01-03
JP3660566B2 (ja) 2005-06-15
EP1168449A3 (de) 2004-08-04
EP1168449A2 (de) 2002-01-02
JP2002016485A (ja) 2002-01-18
US6469352B2 (en) 2002-10-22
ATE338344T1 (de) 2006-09-15
DE60122626T2 (de) 2007-08-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee