DE60118171D1 - Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür - Google Patents

Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür

Info

Publication number
DE60118171D1
DE60118171D1 DE60118171T DE60118171T DE60118171D1 DE 60118171 D1 DE60118171 D1 DE 60118171D1 DE 60118171 T DE60118171 T DE 60118171T DE 60118171 T DE60118171 T DE 60118171T DE 60118171 D1 DE60118171 D1 DE 60118171D1
Authority
DE
Germany
Prior art keywords
method therefor
window system
polishing wafer
abrasive aggregate
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60118171T
Other languages
English (en)
Other versions
DE60118171T2 (de
Inventor
J Muilenburg
Yong Kim
J Fizel
J Webb
J Gagliardi
B Pendergrass
J Streifel
J Bruxvoort
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE60118171D1 publication Critical patent/DE60118171D1/de
Application granted granted Critical
Publication of DE60118171T2 publication Critical patent/DE60118171T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE60118171T 2000-11-29 2001-04-11 Schleifgegenstand mit fenstersystem sowie verfahren zum polieren von wafern Expired - Lifetime DE60118171T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods
US726064 2000-11-29
PCT/US2001/011841 WO2002043925A1 (en) 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods

Publications (2)

Publication Number Publication Date
DE60118171D1 true DE60118171D1 (de) 2006-05-11
DE60118171T2 DE60118171T2 (de) 2007-01-25

Family

ID=24917074

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60118171T Expired - Lifetime DE60118171T2 (de) 2000-11-29 2001-04-11 Schleifgegenstand mit fenstersystem sowie verfahren zum polieren von wafern
DE60134797T Expired - Lifetime DE60134797D1 (de) 2000-11-29 2001-04-11 Verfahren zur Herstellung eines Schleifgegenstands

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60134797T Expired - Lifetime DE60134797D1 (de) 2000-11-29 2001-04-11 Verfahren zur Herstellung eines Schleifgegenstands

Country Status (13)

Country Link
US (3) US20020072296A1 (de)
EP (2) EP1655103B1 (de)
JP (1) JP2004516947A (de)
KR (1) KR100711160B1 (de)
CN (1) CN1238161C (de)
AT (2) ATE320881T1 (de)
AU (1) AU2001253382A1 (de)
CA (1) CA2430377A1 (de)
DE (2) DE60118171T2 (de)
IL (1) IL155856A0 (de)
MY (1) MY126929A (de)
TW (1) TW564202B (de)
WO (1) WO2002043925A1 (de)

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US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US20050054277A1 (en) * 2003-09-04 2005-03-10 Teng-Chun Tsai Polishing pad and method of polishing wafer
DE10346254A1 (de) * 2003-09-25 2005-05-12 Supfina Grieshaber Gmbh & Co Verfahren zur Bearbeitung von Werkstückoberflächen
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
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US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
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US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
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JP4941735B2 (ja) * 2007-03-30 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5004701B2 (ja) * 2007-07-11 2012-08-22 株式会社荏原製作所 研磨装置
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
US20090017323A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
US8357286B1 (en) 2007-10-29 2013-01-22 Semcon Tech, Llc Versatile workpiece refining
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
WO2009158665A1 (en) 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
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CN102159361B (zh) * 2008-07-18 2014-11-05 3M创新有限公司 具有浮动单元的抛光垫以及制造和使用该抛光垫的方法
EP2147745A1 (de) * 2008-07-25 2010-01-27 Supfina Grieshaber GmbH & Co. KG Superfinishmaschine mit Schleifband und Verfahren zum Betrieben einer Superfinishmaschine
WO2010025003A2 (en) 2008-08-28 2010-03-04 3M Innovative Properties Company Structured abrasive article, method of making the same, and use in wafer planarization
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
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CN102148178A (zh) * 2009-12-16 2011-08-10 第一毛织株式会社 电路小片粘性膜、卷筒、安装设备和电子产品
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US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8500515B2 (en) * 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8641476B2 (en) 2011-10-06 2014-02-04 Wayne O. Duescher Coplanar alignment apparatus for rotary spindles
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US8647172B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Wafer pads for fixed-spindle floating-platen lapping
US8696405B2 (en) 2010-03-12 2014-04-15 Wayne O. Duescher Pivot-balanced floating platen lapping machine
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8337280B2 (en) 2010-09-14 2012-12-25 Duescher Wayne O High speed platen abrading wire-driven rotary workholder
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8430717B2 (en) 2010-10-12 2013-04-30 Wayne O. Duescher Dynamic action abrasive lapping workholder
US10675794B2 (en) 2011-02-24 2020-06-09 3M Innovative Properties Company Coated abrasive article with foam backing and method of making
CN102689270B (zh) * 2011-03-22 2015-04-01 中芯国际集成电路制造(上海)有限公司 固结磨料抛光垫及其制备方法
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
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Also Published As

Publication number Publication date
ATE320881T1 (de) 2006-04-15
US6786810B2 (en) 2004-09-07
US20030064663A1 (en) 2003-04-03
US20020072296A1 (en) 2002-06-13
AU2001253382A1 (en) 2002-06-11
EP1655103B1 (de) 2008-07-09
JP2004516947A (ja) 2004-06-10
US20030022598A1 (en) 2003-01-30
CA2430377A1 (en) 2002-06-06
MY126929A (en) 2006-10-31
WO2002043925A1 (en) 2002-06-06
ATE400405T1 (de) 2008-07-15
CN1476368A (zh) 2004-02-18
EP1655103A1 (de) 2006-05-10
KR20030048484A (ko) 2003-06-19
DE60118171T2 (de) 2007-01-25
EP1337380A1 (de) 2003-08-27
US6604985B2 (en) 2003-08-12
CN1238161C (zh) 2006-01-25
IL155856A0 (en) 2003-12-23
DE60134797D1 (de) 2008-08-21
TW564202B (en) 2003-12-01
EP1337380B1 (de) 2006-03-22
KR100711160B1 (ko) 2007-05-16

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