IL155856A0 - Abrasive article having a window system for polishing wafers, and methods - Google Patents

Abrasive article having a window system for polishing wafers, and methods

Info

Publication number
IL155856A0
IL155856A0 IL15585601A IL15585601A IL155856A0 IL 155856 A0 IL155856 A0 IL 155856A0 IL 15585601 A IL15585601 A IL 15585601A IL 15585601 A IL15585601 A IL 15585601A IL 155856 A0 IL155856 A0 IL 155856A0
Authority
IL
Israel
Prior art keywords
methods
abrasive article
window system
polishing wafers
backing
Prior art date
Application number
IL15585601A
Other languages
English (en)
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of IL155856A0 publication Critical patent/IL155856A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
IL15585601A 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods IL155856A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods
PCT/US2001/011841 WO2002043925A1 (en) 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods

Publications (1)

Publication Number Publication Date
IL155856A0 true IL155856A0 (en) 2003-12-23

Family

ID=24917074

Family Applications (1)

Application Number Title Priority Date Filing Date
IL15585601A IL155856A0 (en) 2000-11-29 2001-04-11 Abrasive article having a window system for polishing wafers, and methods

Country Status (13)

Country Link
US (3) US20020072296A1 (xx)
EP (2) EP1337380B1 (xx)
JP (1) JP2004516947A (xx)
KR (1) KR100711160B1 (xx)
CN (1) CN1238161C (xx)
AT (2) ATE320881T1 (xx)
AU (1) AU2001253382A1 (xx)
CA (1) CA2430377A1 (xx)
DE (2) DE60118171T2 (xx)
IL (1) IL155856A0 (xx)
MY (1) MY126929A (xx)
TW (1) TW564202B (xx)
WO (1) WO2002043925A1 (xx)

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US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
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US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
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JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
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Also Published As

Publication number Publication date
US20020072296A1 (en) 2002-06-13
CA2430377A1 (en) 2002-06-06
CN1238161C (zh) 2006-01-25
TW564202B (en) 2003-12-01
EP1655103A1 (en) 2006-05-10
JP2004516947A (ja) 2004-06-10
ATE320881T1 (de) 2006-04-15
EP1337380B1 (en) 2006-03-22
WO2002043925A1 (en) 2002-06-06
EP1655103B1 (en) 2008-07-09
ATE400405T1 (de) 2008-07-15
DE60118171T2 (de) 2007-01-25
DE60118171D1 (de) 2006-05-11
AU2001253382A1 (en) 2002-06-11
US6786810B2 (en) 2004-09-07
US6604985B2 (en) 2003-08-12
US20030064663A1 (en) 2003-04-03
KR100711160B1 (ko) 2007-05-16
DE60134797D1 (de) 2008-08-21
CN1476368A (zh) 2004-02-18
KR20030048484A (ko) 2003-06-19
US20030022598A1 (en) 2003-01-30
MY126929A (en) 2006-10-31
EP1337380A1 (en) 2003-08-27

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