MX2020003717A - Artículo abrasivo y método para elaborarlo. - Google Patents
Artículo abrasivo y método para elaborarlo.Info
- Publication number
- MX2020003717A MX2020003717A MX2020003717A MX2020003717A MX2020003717A MX 2020003717 A MX2020003717 A MX 2020003717A MX 2020003717 A MX2020003717 A MX 2020003717A MX 2020003717 A MX2020003717 A MX 2020003717A MX 2020003717 A MX2020003717 A MX 2020003717A
- Authority
- MX
- Mexico
- Prior art keywords
- abrasive article
- forming same
- abrasive
- electronic assembly
- abrasive body
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Un articulo abrasivo incluye una estructura abrasiva que tiene un material de union, particulas abrasivas contenidas dentro del material de union y un montaje electronico acoplado a la estructura abrasiva, en donde el montaje electronico comprende al menos un dispositivo electronico. En una forma de realizacion, el montaje electronico se acopla a la estructura abrasiva de una manera a prueba de manipulacion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN201741035158 | 2017-10-04 | ||
PCT/US2018/054474 WO2019071053A1 (en) | 2017-10-04 | 2018-10-04 | ABRASIVE ARTICLE AND ITS TRAINING METHOD |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2020003717A true MX2020003717A (es) | 2020-12-09 |
Family
ID=65895877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2020003717A MX2020003717A (es) | 2017-10-04 | 2018-10-04 | Artículo abrasivo y método para elaborarlo. |
Country Status (9)
Country | Link |
---|---|
US (2) | US11712784B2 (es) |
EP (1) | EP3691830A4 (es) |
JP (2) | JP7186770B2 (es) |
KR (2) | KR102393445B1 (es) |
CN (1) | CN111315535A (es) |
BR (1) | BR112020006842A2 (es) |
CA (1) | CA3078474C (es) |
MX (1) | MX2020003717A (es) |
WO (1) | WO2019071053A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA3108094C (en) * | 2018-08-02 | 2023-11-07 | Saint-Gobain Abrasives, Inc. | Abrasive article including a wear detection sensor |
EP3843947A1 (en) * | 2018-08-27 | 2021-07-07 | 3M Innovative Properties Company | Embedded electronic circuit in grinding wheels and methods of embedding |
US11259443B1 (en) * | 2019-03-11 | 2022-02-22 | Smartrac Investment B.V. | Heat resistant RFID tags |
JP7334008B2 (ja) * | 2019-04-15 | 2023-08-28 | 株式会社ディスコ | 研削ホイール及び研削装置 |
AU2019466740A1 (en) * | 2019-09-19 | 2022-04-07 | Husqvarna Ab | Wireless identification tags and corresponding readers |
CN112536733B (zh) * | 2020-12-03 | 2022-03-22 | 郑州磨料磨具磨削研究所有限公司 | 一种超精密磨削砂轮及其制备方法和应用 |
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JP2810489B2 (ja) | 1990-05-30 | 1998-10-15 | 株式会社ノリタケカンパニーリミテド | 砥石車 |
JPH04109550U (ja) * | 1991-03-07 | 1992-09-22 | シヤープ株式会社 | 電力半導体装置 |
JPH08502695A (ja) * | 1992-02-12 | 1996-03-26 | ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー | 電気伝導性支持体を含有する被覆研磨材物品 |
US5201916A (en) * | 1992-07-23 | 1993-04-13 | Minnesota Mining And Manufacturing Company | Shaped abrasive particles and method of making same |
ZA9410384B (en) * | 1994-04-08 | 1996-02-01 | Ultimate Abrasive Syst Inc | Method for making powder preform and abrasive articles made therefrom |
US5725413A (en) * | 1994-05-06 | 1998-03-10 | Board Of Trustees Of The University Of Arkansas | Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom |
KR19980702613A (ko) | 1995-03-02 | 1998-08-05 | 워렌리차드보비 | 구조적 연마재를 이용하여 기판을 텍스쳐링하는 방법 |
EP0738561B1 (en) * | 1995-03-28 | 2002-01-23 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations |
US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
DE19738229A1 (de) | 1997-09-02 | 1999-03-04 | Bilz Otto Werkzeug | Werkzeug oder Werkzeughalter |
US6123612A (en) * | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
WO2000002236A2 (en) * | 1998-07-07 | 2000-01-13 | Memc Electronic Materials, Inc. | Radio frequency identification system and method for tracking silicon wafers |
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US6602109B1 (en) | 1998-12-16 | 2003-08-05 | University Of Massachusetts | Grinding wheel system |
US6322422B1 (en) * | 1999-01-19 | 2001-11-27 | Nec Corporation | Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same |
WO2000060650A1 (fr) * | 1999-03-31 | 2000-10-12 | Nikon Corporation | Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur |
US6325696B1 (en) * | 1999-09-13 | 2001-12-04 | International Business Machines Corporation | Piezo-actuated CMP carrier |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
KR100718737B1 (ko) * | 2000-01-17 | 2007-05-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치 |
US6520834B1 (en) * | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
AU2002211387A1 (en) | 2000-09-29 | 2002-04-08 | Strasbaugh, Inc. | Polishing pad with built-in optical sensor |
TW541425B (en) * | 2000-10-20 | 2003-07-11 | Ebara Corp | Frequency measuring device, polishing device using the same and eddy current sensor |
US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
US20100156723A1 (en) * | 2001-03-26 | 2010-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
JP2003192769A (ja) | 2001-12-27 | 2003-07-09 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP4216025B2 (ja) * | 2002-09-09 | 2009-01-28 | 株式会社リード | 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法 |
US20040162010A1 (en) * | 2003-02-04 | 2004-08-19 | Nihon Microcoating Co., Ltd. | Polishing sheet and method of producing same |
DE10344602A1 (de) * | 2003-09-25 | 2005-05-19 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben |
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US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
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DE102007031299B4 (de) | 2007-07-05 | 2013-02-28 | Peter Wolters Gmbh | Doppelseitenbearbeitungsmaschine zum Bearbeiten eines Werkstücks |
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CN206182955U (zh) * | 2016-08-29 | 2017-05-24 | 软控股份有限公司 | Rfid地垫 |
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US20200030938A1 (en) | 2017-02-28 | 2020-01-30 | 3M Innovative Properties Company | Abrasive product for communication with abrading tool |
EP3843947A1 (en) * | 2018-08-27 | 2021-07-07 | 3M Innovative Properties Company | Embedded electronic circuit in grinding wheels and methods of embedding |
-
2018
- 2018-10-04 KR KR1020207012750A patent/KR102393445B1/ko active IP Right Grant
- 2018-10-04 KR KR1020227014029A patent/KR20220062419A/ko active IP Right Grant
- 2018-10-04 WO PCT/US2018/054474 patent/WO2019071053A1/en unknown
- 2018-10-04 EP EP18864642.6A patent/EP3691830A4/en active Pending
- 2018-10-04 MX MX2020003717A patent/MX2020003717A/es unknown
- 2018-10-04 BR BR112020006842-0A patent/BR112020006842A2/pt unknown
- 2018-10-04 JP JP2020519388A patent/JP7186770B2/ja active Active
- 2018-10-04 CA CA3078474A patent/CA3078474C/en active Active
- 2018-10-04 CN CN201880072386.3A patent/CN111315535A/zh active Pending
- 2018-10-04 US US16/152,386 patent/US11712784B2/en active Active
-
2022
- 2022-11-29 JP JP2022190438A patent/JP2023022202A/ja active Pending
-
2023
- 2023-06-13 US US18/333,744 patent/US20230339074A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20200063211A (ko) | 2020-06-04 |
EP3691830A1 (en) | 2020-08-12 |
CN111315535A (zh) | 2020-06-19 |
KR20220062419A (ko) | 2022-05-16 |
WO2019071053A1 (en) | 2019-04-11 |
US20190099859A1 (en) | 2019-04-04 |
JP7186770B2 (ja) | 2022-12-09 |
KR102393445B1 (ko) | 2022-05-03 |
JP2023022202A (ja) | 2023-02-14 |
CA3078474C (en) | 2023-05-16 |
BR112020006842A2 (pt) | 2020-10-06 |
CA3078474A1 (en) | 2019-04-11 |
JP2020536752A (ja) | 2020-12-17 |
US11712784B2 (en) | 2023-08-01 |
US20230339074A1 (en) | 2023-10-26 |
EP3691830A4 (en) | 2021-11-17 |
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