DE60023549D1 - Verfahren zum polieren oder planarisieren eines substrats - Google Patents
Verfahren zum polieren oder planarisieren eines substratsInfo
- Publication number
- DE60023549D1 DE60023549D1 DE60023549T DE60023549T DE60023549D1 DE 60023549 D1 DE60023549 D1 DE 60023549D1 DE 60023549 T DE60023549 T DE 60023549T DE 60023549 T DE60023549 T DE 60023549T DE 60023549 D1 DE60023549 D1 DE 60023549D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- planarizing
- polishing
- metal oxide
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17254099P | 1999-12-17 | 1999-12-17 | |
US172540P | 1999-12-17 | ||
PCT/US2000/034058 WO2001044402A1 (en) | 1999-12-17 | 2000-12-15 | Method of polishing or planarizing a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60023549D1 true DE60023549D1 (de) | 2005-12-01 |
DE60023549T2 DE60023549T2 (de) | 2006-04-20 |
Family
ID=22628143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60023549T Expired - Lifetime DE60023549T2 (de) | 1999-12-17 | 2000-12-15 | Verfahren zum polieren oder planarisieren eines substrats |
Country Status (11)
Country | Link |
---|---|
US (1) | US6872328B2 (de) |
EP (1) | EP1242557B8 (de) |
JP (1) | JP4237439B2 (de) |
KR (1) | KR100563166B1 (de) |
CN (1) | CN1196760C (de) |
AT (1) | ATE307859T1 (de) |
AU (1) | AU2266301A (de) |
DE (1) | DE60023549T2 (de) |
IL (1) | IL150186A0 (de) |
TW (1) | TWI263671B (de) |
WO (1) | WO2001044402A1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6656241B1 (en) * | 2001-06-14 | 2003-12-02 | Ppg Industries Ohio, Inc. | Silica-based slurry |
US20030003747A1 (en) * | 2001-06-29 | 2003-01-02 | Jae Hong Kim | Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
US7416680B2 (en) * | 2001-10-12 | 2008-08-26 | International Business Machines Corporation | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate |
CN101058713B (zh) | 2001-10-31 | 2011-02-09 | 日立化成工业株式会社 | 研磨液及研磨方法 |
US7524346B2 (en) * | 2002-01-25 | 2009-04-28 | Dupont Air Products Nanomaterials Llc | Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates |
US20030162399A1 (en) * | 2002-02-22 | 2003-08-28 | University Of Florida | Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures |
US6716771B2 (en) * | 2002-04-09 | 2004-04-06 | Intel Corporation | Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface |
US6953532B2 (en) * | 2003-03-06 | 2005-10-11 | Cabot Microelectronics Corporation | Method of polishing a lanthanide substrate |
WO2005019364A1 (en) * | 2003-08-14 | 2005-03-03 | Ekc Technology, Inc. | Periodic acid compositions for polishing ruthenium/high k substrates |
JP4012180B2 (ja) * | 2004-08-06 | 2007-11-21 | 株式会社東芝 | Cmp用スラリー、研磨方法、および半導体装置の製造方法 |
US20080283502A1 (en) * | 2006-05-26 | 2008-11-20 | Kevin Moeggenborg | Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates |
JP5333741B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010034497A (ja) * | 2008-02-18 | 2010-02-12 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333740B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333743B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010041027A (ja) * | 2008-02-18 | 2010-02-18 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333744B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体、化学機械研磨方法および化学機械研磨用水系分散体の製造方法 |
JP2009224767A (ja) * | 2008-02-18 | 2009-10-01 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2009224771A (ja) * | 2008-02-18 | 2009-10-01 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010016344A (ja) * | 2008-02-18 | 2010-01-21 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010028078A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
US20110081780A1 (en) * | 2008-02-18 | 2011-04-07 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
JP5333742B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010028079A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP5333739B2 (ja) * | 2008-02-18 | 2013-11-06 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
JP2010028077A (ja) * | 2008-02-18 | 2010-02-04 | Jsr Corp | 化学機械研磨用水系分散体およびその製造方法、ならびに化学機械研磨方法 |
KR20100123678A (ko) * | 2008-02-18 | 2010-11-24 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 |
CN102358824B (zh) * | 2011-07-29 | 2013-08-21 | 清华大学 | 一种用于硬盘盘基片超精密表面制造的抛光组合物 |
CN102358825B (zh) * | 2011-08-05 | 2013-08-21 | 清华大学 | 一种用于蓝宝石晶片的抛光组合物 |
US9803109B2 (en) * | 2015-02-03 | 2017-10-31 | Cabot Microelectronics Corporation | CMP composition for silicon nitride removal |
CN106752969A (zh) * | 2016-11-22 | 2017-05-31 | 启东市清清蔬果农地股份专业合作社 | 一种铝合金外壳的抛光液 |
CN108527012A (zh) * | 2018-05-21 | 2018-09-14 | 浙江工业大学 | 一种利用液态金属抛光液进行大平面抛光的装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61136909A (ja) * | 1984-12-04 | 1986-06-24 | Mitsubishi Chem Ind Ltd | 無水ケイ酸の水分散液組成物 |
JPH01317155A (ja) * | 1988-03-04 | 1989-12-21 | Mitsubishi Kasei Corp | セラミック成形体の製造法 |
US5226930A (en) | 1988-06-03 | 1993-07-13 | Monsanto Japan, Ltd. | Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same |
US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
US5340370A (en) * | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
JP3303544B2 (ja) * | 1994-07-27 | 2002-07-22 | ソニー株式会社 | 半導体装置の製造方法および配線層表面研磨用のスラリーおよび配線層表面研磨用のスラリーの製造方法 |
US5527423A (en) | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
US5993686A (en) * | 1996-06-06 | 1999-11-30 | Cabot Corporation | Fluoride additive containing chemical mechanical polishing slurry and method for use of same |
US5664990A (en) * | 1996-07-29 | 1997-09-09 | Integrated Process Equipment Corp. | Slurry recycling in CMP apparatus |
JPH10166258A (ja) * | 1996-12-06 | 1998-06-23 | Tadahiro Omi | 研磨剤組成物 |
US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6126853A (en) * | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
US6294105B1 (en) * | 1997-12-23 | 2001-09-25 | International Business Machines Corporation | Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
KR100581649B1 (ko) | 1998-06-10 | 2006-05-23 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 금속 cmp에서 광택화를 위한 조성물 및 방법 |
AU4309601A (en) * | 1999-12-07 | 2001-06-18 | Cabot Microelectronics Corporation | Chemical-mechanical polishing method |
-
2000
- 2000-12-15 WO PCT/US2000/034058 patent/WO2001044402A1/en active IP Right Grant
- 2000-12-15 EP EP00986423A patent/EP1242557B8/de not_active Expired - Lifetime
- 2000-12-15 US US09/737,905 patent/US6872328B2/en not_active Expired - Lifetime
- 2000-12-15 KR KR1020027007597A patent/KR100563166B1/ko active IP Right Grant
- 2000-12-15 AT AT00986423T patent/ATE307859T1/de not_active IP Right Cessation
- 2000-12-15 CN CNB008170908A patent/CN1196760C/zh not_active Expired - Lifetime
- 2000-12-15 JP JP2001545482A patent/JP4237439B2/ja not_active Expired - Lifetime
- 2000-12-15 AU AU22663/01A patent/AU2266301A/en not_active Abandoned
- 2000-12-15 IL IL15018600A patent/IL150186A0/xx unknown
- 2000-12-15 DE DE60023549T patent/DE60023549T2/de not_active Expired - Lifetime
- 2000-12-16 TW TW089126982A patent/TWI263671B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1242557B8 (de) | 2006-02-01 |
US20020076932A1 (en) | 2002-06-20 |
WO2001044402A1 (en) | 2001-06-21 |
DE60023549T2 (de) | 2006-04-20 |
AU2266301A (en) | 2001-06-25 |
EP1242557B1 (de) | 2005-10-26 |
KR100563166B1 (ko) | 2006-03-27 |
JP4237439B2 (ja) | 2009-03-11 |
EP1242557A1 (de) | 2002-09-25 |
US6872328B2 (en) | 2005-03-29 |
CN1409749A (zh) | 2003-04-09 |
CN1196760C (zh) | 2005-04-13 |
JP2004500708A (ja) | 2004-01-08 |
KR20020070321A (ko) | 2002-09-05 |
ATE307859T1 (de) | 2005-11-15 |
IL150186A0 (en) | 2002-12-01 |
TWI263671B (en) | 2006-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |