DE60102775D1 - Verfahren zur Entfernung von Metallen und Siliziumoxid während des Gasphasenätzens vom Opferoxid - Google Patents

Verfahren zur Entfernung von Metallen und Siliziumoxid während des Gasphasenätzens vom Opferoxid

Info

Publication number
DE60102775D1
DE60102775D1 DE60102775T DE60102775T DE60102775D1 DE 60102775 D1 DE60102775 D1 DE 60102775D1 DE 60102775 T DE60102775 T DE 60102775T DE 60102775 T DE60102775 T DE 60102775T DE 60102775 D1 DE60102775 D1 DE 60102775D1
Authority
DE
Germany
Prior art keywords
reactive mixture
chamber
gas phase
during gas
diketone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60102775T
Other languages
English (en)
Other versions
DE60102775T2 (de
Inventor
Robertson, Iii
Scott Edward Beck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Application granted granted Critical
Publication of DE60102775D1 publication Critical patent/DE60102775D1/de
Publication of DE60102775T2 publication Critical patent/DE60102775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H01L21/02049—Dry cleaning only with gaseous HF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936—Releasing the movable structure without liquid etchant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
DE60102775T 2000-10-27 2001-10-24 Verfahren zur Entfernung von Metallen und Siliziumoxid während des Gasphasenätzens vom Opferoxid Expired - Fee Related DE60102775T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/698,467 US6534413B1 (en) 2000-10-27 2000-10-27 Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch
US698467 2000-10-27

Publications (2)

Publication Number Publication Date
DE60102775D1 true DE60102775D1 (de) 2004-05-19
DE60102775T2 DE60102775T2 (de) 2005-05-12

Family

ID=24805374

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60102775T Expired - Fee Related DE60102775T2 (de) 2000-10-27 2001-10-24 Verfahren zur Entfernung von Metallen und Siliziumoxid während des Gasphasenätzens vom Opferoxid

Country Status (7)

Country Link
US (1) US6534413B1 (de)
EP (1) EP1201603B1 (de)
JP (1) JP2002219699A (de)
KR (1) KR20020033067A (de)
AT (1) ATE264266T1 (de)
DE (1) DE60102775T2 (de)
TW (1) TW504762B (de)

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AU2002353039A1 (en) * 2001-12-04 2003-06-17 Primaxx, Inc. System and method for micro electro mechanical etching
US7045459B2 (en) * 2002-02-19 2006-05-16 Northrop Grumman Corporation Thin film encapsulation of MEMS devices
US20050229947A1 (en) 2002-06-14 2005-10-20 Mykrolis Corporation Methods of inserting or removing a species from a substrate
US20050142885A1 (en) * 2002-08-30 2005-06-30 Tokyo Electron Limited Method of etching and etching apparatus
WO2004030049A2 (en) * 2002-09-27 2004-04-08 Tokyo Electron Limited A method and system for etching high-k dielectric materials
US7104130B2 (en) * 2003-04-11 2006-09-12 The Board Of Trustees Of The Leland Stanford Junior University Ultra-miniature accelerometers
US6805433B1 (en) * 2003-05-19 2004-10-19 Xerox Corporation Integrated side shooter inkjet architecture with round nozzles
JP2005212032A (ja) * 2004-01-29 2005-08-11 M Fsi Kk Ｍｅｍｓデバイス向け基板表面の処理方法
CN1950338B (zh) * 2004-03-05 2012-05-16 霍尼韦尔国际公司 杂环胺的离子液体
JP4489541B2 (ja) * 2004-09-07 2010-06-23 セントラル硝子株式会社 ハフニウム含有酸化物のクリーニング方法
US7337671B2 (en) 2005-06-03 2008-03-04 Georgia Tech Research Corp. Capacitive microaccelerometers and fabrication methods
DE102006019836B4 (de) 2006-04-28 2016-09-01 Globalfoundries Inc. Verfahren zum Reduzieren von Siliziddefekten durch Entfernen von Kontaminationsstoffen vor der Drain/Source-Aktivierung
US7578189B1 (en) 2006-05-10 2009-08-25 Qualtre, Inc. Three-axis accelerometers
US7767484B2 (en) 2006-05-31 2010-08-03 Georgia Tech Research Corporation Method for sealing and backside releasing of microelectromechanical systems
US20080054759A1 (en) * 2006-08-11 2008-03-06 Farrokh Ayazi Wafer-level encapsulation and sealing of electrostatic transducers
JP4924245B2 (ja) * 2007-07-02 2012-04-25 東京エレクトロン株式会社 半導体製造装置、半導体装置の製造方法及び記憶媒体
CN102305256B (zh) * 2011-09-06 2013-06-12 复旦大学 一种金属微米/纳米弹簧及其制备方法和应用
CN103165407B (zh) * 2011-12-14 2016-04-06 有研半导体材料有限公司 一种用于硅片表面制样的表面处理及腐蚀的工艺和装置
JP6024272B2 (ja) * 2011-12-22 2016-11-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP5929386B2 (ja) * 2012-03-22 2016-06-08 セントラル硝子株式会社 成膜装置内の金属膜のドライクリーニング方法
JP6766184B2 (ja) * 2016-06-03 2020-10-07 インテグリス・インコーポレーテッド ハフニア及びジルコニアの蒸気相エッチング
JP6906205B2 (ja) * 2017-08-01 2021-07-21 株式会社サイオクス 半導体積層物の製造方法および窒化物結晶基板の製造方法
WO2024019025A1 (ja) * 2022-07-19 2024-01-25 セントラル硝子株式会社 ドライエッチング方法、クリーニング方法及び半導体デバイスの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094701A (en) * 1990-03-30 1992-03-10 Air Products And Chemicals, Inc. Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same
DE4317274A1 (de) 1993-05-25 1994-12-01 Bosch Gmbh Robert Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen
TW371775B (en) * 1995-04-28 1999-10-11 Siemens Ag Method for the selective removal of silicon dioxide
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US5963788A (en) * 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US5954884A (en) * 1997-03-17 1999-09-21 Fsi International Inc. UV/halogen metals removal process
JP4049423B2 (ja) * 1997-11-06 2008-02-20 キヤノンアネルバ株式会社 成膜処理装置内の付着金属膜のクリーニング方法
US6159859A (en) * 1998-06-09 2000-12-12 Air Products And Chemicals, Inc. Gas phase removal of SiO2 /metals from silicon
US6242165B1 (en) * 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same

Also Published As

Publication number Publication date
EP1201603A3 (de) 2002-12-18
US6534413B1 (en) 2003-03-18
TW504762B (en) 2002-10-01
EP1201603B1 (de) 2004-04-14
DE60102775T2 (de) 2005-05-12
ATE264266T1 (de) 2004-04-15
JP2002219699A (ja) 2002-08-06
KR20020033067A (ko) 2002-05-04
EP1201603A2 (de) 2002-05-02

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee