AU2002353039A1 - System and method for micro electro mechanical etching - Google Patents

System and method for micro electro mechanical etching

Info

Publication number
AU2002353039A1
AU2002353039A1 AU2002353039A AU2002353039A AU2002353039A1 AU 2002353039 A1 AU2002353039 A1 AU 2002353039A1 AU 2002353039 A AU2002353039 A AU 2002353039A AU 2002353039 A AU2002353039 A AU 2002353039A AU 2002353039 A1 AU2002353039 A1 AU 2002353039A1
Authority
AU
Australia
Prior art keywords
electro mechanical
micro electro
mechanical etching
etching
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002353039A
Inventor
Robert W. Grant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Primaxx Inc
Original Assignee
Primaxx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Primaxx Inc filed Critical Primaxx Inc
Publication of AU2002353039A1 publication Critical patent/AU2002353039A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936—Releasing the movable structure without liquid etchant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
    • B81C99/0025—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Drying Of Semiconductors (AREA)
AU2002353039A 2001-12-04 2002-12-04 System and method for micro electro mechanical etching Abandoned AU2002353039A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33761101P 2001-12-04 2001-12-04
US60/337,611 2001-12-04
PCT/US2002/038679 WO2003049156A2 (en) 2001-12-04 2002-12-04 System and method for micro electro mechanical etching

Publications (1)

Publication Number Publication Date
AU2002353039A1 true AU2002353039A1 (en) 2003-06-17

Family

ID=23321247

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002353039A Abandoned AU2002353039A1 (en) 2001-12-04 2002-12-04 System and method for micro electro mechanical etching

Country Status (2)

Country Link
AU (1) AU2002353039A1 (en)
WO (1) WO2003049156A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL165212A (en) * 2004-11-15 2012-05-31 Elbit Systems Electro Optics Elop Ltd Device for scanning light
AU2013219966B2 (en) 2012-02-15 2015-04-02 Apple Inc. Scanning depth engine
CN104221058B (en) 2012-03-22 2017-03-08 苹果公司 Scanning lens array equipped with universal joint
CN104520750B (en) 2012-07-26 2018-02-23 苹果公司 Twin axle scanning mirror
DE112013005128T5 (en) 2012-10-23 2015-08-13 Apple Inc. Production of micromechanical devices
US9784838B1 (en) 2014-11-26 2017-10-10 Apple Inc. Compact scanner with gimbaled optics
US9835853B1 (en) 2014-11-26 2017-12-05 Apple Inc. MEMS scanner with mirrors of different sizes
US9798135B2 (en) 2015-02-16 2017-10-24 Apple Inc. Hybrid MEMS scanning module
US9897801B2 (en) 2015-09-30 2018-02-20 Apple Inc. Multi-hinge mirror assembly
US9703096B2 (en) 2015-09-30 2017-07-11 Apple Inc. Asymmetric MEMS mirror assembly
US10488652B2 (en) 2016-09-21 2019-11-26 Apple Inc. Prism-based scanner
KR20220027246A (en) 2019-08-18 2022-03-07 애플 인크. Force Balanced Micromirrors with Electromagnetic Actuation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5581874A (en) * 1994-03-28 1996-12-10 Tokyo Electron Limited Method of forming a bonding portion
KR100232664B1 (en) * 1995-07-31 1999-12-01 니시무로 타이죠 Method and appartus for manufacturing a semiconductor device
WO1997015073A1 (en) * 1995-10-17 1997-04-24 Asm Japan K.K. Semiconductor treatment apparatus
US6534413B1 (en) * 2000-10-27 2003-03-18 Air Products And Chemicals, Inc. Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch

Also Published As

Publication number Publication date
WO2003049156A2 (en) 2003-06-12
WO2003049156A3 (en) 2004-02-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase