DE60042993D1 - Verfahren zum thermischen Behandeln eines Substrates - Google Patents
Verfahren zum thermischen Behandeln eines SubstratesInfo
- Publication number
- DE60042993D1 DE60042993D1 DE60042993T DE60042993T DE60042993D1 DE 60042993 D1 DE60042993 D1 DE 60042993D1 DE 60042993 T DE60042993 T DE 60042993T DE 60042993 T DE60042993 T DE 60042993T DE 60042993 D1 DE60042993 D1 DE 60042993D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- thermal treatment
- thermal
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/12—Heating of the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/350,415 US6215106B1 (en) | 1997-06-30 | 1999-07-08 | Thermally processing a substrate |
US09/611,349 US6803546B1 (en) | 1999-07-08 | 2000-07-06 | Thermally processing a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60042993D1 true DE60042993D1 (de) | 2009-11-05 |
Family
ID=26996606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60042993T Expired - Lifetime DE60042993D1 (de) | 1999-07-08 | 2000-07-07 | Verfahren zum thermischen Behandeln eines Substrates |
Country Status (6)
Country | Link |
---|---|
US (1) | US6803546B1 (de) |
EP (1) | EP1067587B1 (de) |
JP (1) | JP4953497B2 (de) |
KR (1) | KR100709517B1 (de) |
DE (1) | DE60042993D1 (de) |
TW (1) | TW479298B (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6803546B1 (en) * | 1999-07-08 | 2004-10-12 | Applied Materials, Inc. | Thermally processing a substrate |
JP4549484B2 (ja) * | 2000-03-30 | 2010-09-22 | 東京エレクトロン株式会社 | 枚葉式熱処理装置 |
JP2001297995A (ja) * | 2000-04-13 | 2001-10-26 | Nec Corp | 回路製造方法および装置 |
JP2004503108A (ja) * | 2000-07-06 | 2004-01-29 | アプライド マテリアルズ インコーポレイテッド | 半導体基板の熱処理 |
EP1393360A1 (de) * | 2001-06-08 | 2004-03-03 | Aixtron AG | Verfahren und vorrichtung zur kurzzeitigen thermischen behandlung von flachen gegenständen |
KR100377011B1 (ko) * | 2002-11-01 | 2003-03-19 | 코닉 시스템 주식회사 | 급속 열처리 장치의 히터 모듈 |
CN100430803C (zh) * | 2003-01-30 | 2008-11-05 | 日本写真印刷株式会社 | 加热装置 |
US7293986B2 (en) * | 2003-05-06 | 2007-11-13 | Mrl Industries, Inc. | Vestibule assembly for a heat treatment furnace |
JP3857283B2 (ja) * | 2004-07-22 | 2006-12-13 | 株式会社エピクエスト | 面発光レーザ作製用酸化装置 |
JP4589092B2 (ja) * | 2004-12-03 | 2010-12-01 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8282768B1 (en) * | 2005-04-26 | 2012-10-09 | Novellus Systems, Inc. | Purging of porogen from UV cure chamber |
US20060291833A1 (en) * | 2005-06-01 | 2006-12-28 | Mattson Techonology, Inc. | Switchable reflector wall concept |
US7554103B2 (en) * | 2006-06-26 | 2009-06-30 | Applied Materials, Inc. | Increased tool utilization/reduction in MWBC for UV curing chamber |
US7928019B2 (en) * | 2007-08-10 | 2011-04-19 | Micron Technology, Inc. | Semiconductor processing |
JP5719710B2 (ja) * | 2011-07-11 | 2015-05-20 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
US10242890B2 (en) * | 2011-08-08 | 2019-03-26 | Applied Materials, Inc. | Substrate support with heater |
US8980767B2 (en) * | 2012-01-13 | 2015-03-17 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
DE102012202099A1 (de) * | 2012-02-13 | 2013-08-14 | Siltronic Ag | Verfahren zum Abkühlen von Scheiben aus Halbleitermaterial |
US10256121B2 (en) * | 2015-07-06 | 2019-04-09 | Tokyo Electron Limited | Heated stage with variable thermal emissivity method and apparatus |
JP6847610B2 (ja) * | 2016-09-14 | 2021-03-24 | 株式会社Screenホールディングス | 熱処理装置 |
JP6832154B2 (ja) * | 2016-12-27 | 2021-02-24 | 東京エレクトロン株式会社 | パージ方法 |
DE102017221778A1 (de) | 2017-12-04 | 2019-06-06 | Siemens Aktiengesellschaft | Kühlkörper für eine elektronische Komponente, elektronische Baugruppe mit einem solchen Kühlkörper und Verfahren zum Erzeugen eines solchen Kühlkörpers |
CN112272865B (zh) | 2019-03-14 | 2022-05-27 | 玛特森技术公司 | 具有温度不均匀性控制的热处理系统 |
DE102021115349A1 (de) * | 2020-07-14 | 2022-01-20 | Infineon Technologies Ag | Substrat-prozesskammer und prozessgasströmungsablenker zur verwendung in der prozesskammer |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4500367A (en) * | 1983-10-31 | 1985-02-19 | At&T Bell Laboratories | LPE Growth on group III-V compound semiconductor substrates containing phosphorus |
US4818327A (en) | 1987-07-16 | 1989-04-04 | Texas Instruments Incorporated | Wafer processing apparatus |
JP2635153B2 (ja) * | 1989-03-15 | 1997-07-30 | 株式会社日立製作所 | 真空処理方法及び装置 |
US5620525A (en) | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
US5238499A (en) * | 1990-07-16 | 1993-08-24 | Novellus Systems, Inc. | Gas-based substrate protection during processing |
US5181556A (en) | 1991-09-20 | 1993-01-26 | Intevac, Inc. | System for substrate cooling in an evacuated environment |
JPH06252094A (ja) * | 1993-02-22 | 1994-09-09 | Hitachi Ltd | 半導体製造装置および半導体製造方法 |
US5318801A (en) * | 1993-05-18 | 1994-06-07 | United States Of America As Represented By The Secretary Of The Navy | Substrate temperature control apparatus and technique for CVD reactors |
KR100274754B1 (ko) * | 1993-08-18 | 2000-12-15 | 히가시 데쓰로 | 성막장치 및 성막방법 |
TW277139B (de) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
JPH07307258A (ja) * | 1994-05-10 | 1995-11-21 | Toshiba Corp | 熱処理用の温度補償部材、その温度補償部材を用いたウェハの熱処理方法及びその装置 |
JP3451137B2 (ja) * | 1994-08-29 | 2003-09-29 | 大日本スクリーン製造株式会社 | 基板の熱処理装置 |
US5660472A (en) * | 1994-12-19 | 1997-08-26 | Applied Materials, Inc. | Method and apparatus for measuring substrate temperatures |
JP3553204B2 (ja) * | 1995-04-28 | 2004-08-11 | アネルバ株式会社 | Cvd装置 |
US6140612A (en) * | 1995-06-07 | 2000-10-31 | Lam Research Corporation | Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck |
JPH0997830A (ja) * | 1995-07-21 | 1997-04-08 | Fuji Electric Co Ltd | 静電チャックホールダ、ウエハ保持機構ならびにその使用方法 |
US6046439A (en) | 1996-06-17 | 2000-04-04 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
NL1003538C2 (nl) | 1996-07-08 | 1998-01-12 | Advanced Semiconductor Mat | Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat. |
US5834068A (en) * | 1996-07-12 | 1998-11-10 | Applied Materials, Inc. | Wafer surface temperature control for deposition of thin films |
US5960555A (en) * | 1996-07-24 | 1999-10-05 | Applied Materials, Inc. | Method and apparatus for purging the back side of a substrate during chemical vapor processing |
US6035100A (en) * | 1997-05-16 | 2000-03-07 | Applied Materials, Inc. | Reflector cover for a semiconductor processing chamber |
US6054688A (en) | 1997-06-25 | 2000-04-25 | Brooks Automation, Inc. | Hybrid heater with ceramic foil serrated plate and gas assist |
US6280790B1 (en) * | 1997-06-30 | 2001-08-28 | Applied Materials, Inc. | Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system |
TW429271B (en) * | 1997-10-10 | 2001-04-11 | Applied Materials Inc | Introducing process fluid over rotating substrates |
JPH11145217A (ja) * | 1997-11-13 | 1999-05-28 | Matsushita Electric Ind Co Ltd | ウェハ一括型測定検査のための温度制御方法及びその装置ならびにバーンイン装置 |
US6063186A (en) * | 1997-12-17 | 2000-05-16 | Cree, Inc. | Growth of very uniform silicon carbide epitaxial layers |
US6108937A (en) * | 1998-09-10 | 2000-08-29 | Asm America, Inc. | Method of cooling wafers |
US6803546B1 (en) | 1999-07-08 | 2004-10-12 | Applied Materials, Inc. | Thermally processing a substrate |
JP2004503108A (ja) * | 2000-07-06 | 2004-01-29 | アプライド マテリアルズ インコーポレイテッド | 半導体基板の熱処理 |
-
2000
- 2000-07-06 US US09/611,349 patent/US6803546B1/en not_active Expired - Fee Related
- 2000-07-07 DE DE60042993T patent/DE60042993D1/de not_active Expired - Lifetime
- 2000-07-07 EP EP00114673A patent/EP1067587B1/de not_active Expired - Lifetime
- 2000-07-08 KR KR1020000039156A patent/KR100709517B1/ko not_active IP Right Cessation
- 2000-07-10 JP JP2000208418A patent/JP4953497B2/ja not_active Expired - Fee Related
- 2000-08-28 TW TW089113708A patent/TW479298B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6803546B1 (en) | 2004-10-12 |
KR20010015254A (ko) | 2001-02-26 |
EP1067587A2 (de) | 2001-01-10 |
JP4953497B2 (ja) | 2012-06-13 |
EP1067587B1 (de) | 2009-09-23 |
JP2001196324A (ja) | 2001-07-19 |
TW479298B (en) | 2002-03-11 |
EP1067587A3 (de) | 2006-03-29 |
KR100709517B1 (ko) | 2007-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |