DE60042919D1 - Graben-gate-feldeffekttransistoren mit einer zellenstruktur - Google Patents
Graben-gate-feldeffekttransistoren mit einer zellenstrukturInfo
- Publication number
- DE60042919D1 DE60042919D1 DE60042919T DE60042919T DE60042919D1 DE 60042919 D1 DE60042919 D1 DE 60042919D1 DE 60042919 T DE60042919 T DE 60042919T DE 60042919 T DE60042919 T DE 60042919T DE 60042919 D1 DE60042919 D1 DE 60042919D1
- Authority
- DE
- Germany
- Prior art keywords
- field effect
- effect transistors
- cell structure
- gate field
- digital gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005669 field effect Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7808—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9917099.5A GB9917099D0 (en) | 1999-07-22 | 1999-07-22 | Cellular trench-gate field-effect transistors |
PCT/EP2000/006819 WO2001008226A2 (en) | 1999-07-22 | 2000-07-17 | Cellular trench-gate field-effect transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60042919D1 true DE60042919D1 (de) | 2009-10-22 |
Family
ID=10857658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60042919T Expired - Fee Related DE60042919D1 (de) | 1999-07-22 | 2000-07-17 | Graben-gate-feldeffekttransistoren mit einer zellenstruktur |
Country Status (6)
Country | Link |
---|---|
US (1) | US6359308B1 (de) |
EP (1) | EP1145326B1 (de) |
JP (1) | JP2003505886A (de) |
DE (1) | DE60042919D1 (de) |
GB (1) | GB9917099D0 (de) |
WO (1) | WO2001008226A2 (de) |
Families Citing this family (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001085685A (ja) * | 1999-09-13 | 2001-03-30 | Shindengen Electric Mfg Co Ltd | トランジスタ |
US6461918B1 (en) * | 1999-12-20 | 2002-10-08 | Fairchild Semiconductor Corporation | Power MOS device with improved gate charge performance |
GB0005650D0 (en) * | 2000-03-10 | 2000-05-03 | Koninkl Philips Electronics Nv | Field-effect semiconductor devices |
US7745289B2 (en) * | 2000-08-16 | 2010-06-29 | Fairchild Semiconductor Corporation | Method of forming a FET having ultra-low on-resistance and low gate charge |
US6696726B1 (en) * | 2000-08-16 | 2004-02-24 | Fairchild Semiconductor Corporation | Vertical MOSFET with ultra-low resistance and low gate charge |
US6916745B2 (en) * | 2003-05-20 | 2005-07-12 | Fairchild Semiconductor Corporation | Structure and method for forming a trench MOSFET having self-aligned features |
US6710403B2 (en) * | 2002-07-30 | 2004-03-23 | Fairchild Semiconductor Corporation | Dual trench power MOSFET |
US7345342B2 (en) * | 2001-01-30 | 2008-03-18 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
US7132712B2 (en) * | 2002-11-05 | 2006-11-07 | Fairchild Semiconductor Corporation | Trench structure having one or more diodes embedded therein adjacent a PN junction |
US6818513B2 (en) * | 2001-01-30 | 2004-11-16 | Fairchild Semiconductor Corporation | Method of forming a field effect transistor having a lateral depletion structure |
US6803626B2 (en) | 2002-07-18 | 2004-10-12 | Fairchild Semiconductor Corporation | Vertical charge control semiconductor device |
FI120310B (fi) * | 2001-02-13 | 2009-09-15 | Valtion Teknillinen | Parannettu menetelmä erittyvien proteiinien tuottamiseksi sienissä |
JP2002270840A (ja) * | 2001-03-09 | 2002-09-20 | Toshiba Corp | パワーmosfet |
DE10127885B4 (de) * | 2001-06-08 | 2009-09-24 | Infineon Technologies Ag | Trench-Leistungshalbleiterbauelement |
US7045859B2 (en) * | 2001-09-05 | 2006-05-16 | International Rectifier Corporation | Trench fet with self aligned source and contact |
US7786533B2 (en) | 2001-09-07 | 2010-08-31 | Power Integrations, Inc. | High-voltage vertical transistor with edge termination structure |
US7221011B2 (en) * | 2001-09-07 | 2007-05-22 | Power Integrations, Inc. | High-voltage vertical transistor with a multi-gradient drain doping profile |
US6635544B2 (en) | 2001-09-07 | 2003-10-21 | Power Intergrations, Inc. | Method of fabricating a high-voltage transistor with a multi-layered extended drain structure |
US6573558B2 (en) * | 2001-09-07 | 2003-06-03 | Power Integrations, Inc. | High-voltage vertical transistor with a multi-layered extended drain structure |
GB0122120D0 (en) | 2001-09-13 | 2001-10-31 | Koninkl Philips Electronics Nv | Edge termination in MOS transistors |
GB0122121D0 (en) | 2001-09-13 | 2001-10-31 | Koninkl Philips Electronics Nv | Edge termination in a trench-gate mosfet |
US7061066B2 (en) * | 2001-10-17 | 2006-06-13 | Fairchild Semiconductor Corporation | Schottky diode using charge balance structure |
JP4097417B2 (ja) * | 2001-10-26 | 2008-06-11 | 株式会社ルネサステクノロジ | 半導体装置 |
US6555883B1 (en) * | 2001-10-29 | 2003-04-29 | Power Integrations, Inc. | Lateral power MOSFET for high switching speeds |
US6674124B2 (en) * | 2001-11-15 | 2004-01-06 | General Semiconductor, Inc. | Trench MOSFET having low gate charge |
GB0129450D0 (en) | 2001-12-08 | 2002-01-30 | Koninkl Philips Electronics Nv | Trenched semiconductor devices and their manufacture |
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KR100859701B1 (ko) * | 2002-02-23 | 2008-09-23 | 페어차일드코리아반도체 주식회사 | 고전압 수평형 디모스 트랜지스터 및 그 제조 방법 |
DE10210138B4 (de) * | 2002-03-07 | 2005-07-21 | Infineon Technologies Ag | Durch Feldeffekt steuerbares vertikales Halbleiterbauelement und Verfahren zu seiner Herstellung |
US6838722B2 (en) * | 2002-03-22 | 2005-01-04 | Siliconix Incorporated | Structures of and methods of fabricating trench-gated MIS devices |
US8080459B2 (en) * | 2002-09-24 | 2011-12-20 | Vishay-Siliconix | Self aligned contact in a semiconductor device and method of fabricating the same |
US7557395B2 (en) * | 2002-09-30 | 2009-07-07 | International Rectifier Corporation | Trench MOSFET technology for DC-DC converter applications |
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US6710418B1 (en) | 2002-10-11 | 2004-03-23 | Fairchild Semiconductor Corporation | Schottky rectifier with insulation-filled trenches and method of forming the same |
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JP4903055B2 (ja) * | 2003-12-30 | 2012-03-21 | フェアチャイルド・セミコンダクター・コーポレーション | パワー半導体デバイスおよびその製造方法 |
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US20050199918A1 (en) * | 2004-03-15 | 2005-09-15 | Daniel Calafut | Optimized trench power MOSFET with integrated schottky diode |
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US7183610B2 (en) | 2004-04-30 | 2007-02-27 | Siliconix Incorporated | Super trench MOSFET including buried source electrode and method of fabricating the same |
DE102004063946B4 (de) * | 2004-05-19 | 2018-03-22 | Infineon Technologies Ag | Transistoranordnungen mit einer in einem Trennungstrench angeordneten Elektrode |
US8120135B2 (en) * | 2004-05-19 | 2012-02-21 | Infineon Technologies Ag | Transistor |
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US7265415B2 (en) * | 2004-10-08 | 2007-09-04 | Fairchild Semiconductor Corporation | MOS-gated transistor with reduced miller capacitance |
JP5135663B2 (ja) * | 2004-10-21 | 2013-02-06 | 富士電機株式会社 | 半導体装置およびその製造方法 |
DE102004052678B3 (de) * | 2004-10-29 | 2006-06-14 | Infineon Technologies Ag | Leistungs- Trenchtransistor |
US7371641B2 (en) | 2004-10-29 | 2008-05-13 | International Rectifier Corporation | Method of making a trench MOSFET with deposited oxide |
DE102004063560B4 (de) * | 2004-12-30 | 2009-01-29 | Infineon Technologies Ag | Kapazitive Struktur und Verfahren zur Herstellung einer kapazitiven Struktur |
JP4825424B2 (ja) * | 2005-01-18 | 2011-11-30 | 株式会社東芝 | 電力用半導体装置 |
US9685524B2 (en) | 2005-03-11 | 2017-06-20 | Vishay-Siliconix | Narrow semiconductor trench structure |
CN102867825B (zh) * | 2005-04-06 | 2016-04-06 | 飞兆半导体公司 | 沟栅场效应晶体管结构及其形成方法 |
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US7385248B2 (en) * | 2005-08-09 | 2008-06-10 | Fairchild Semiconductor Corporation | Shielded gate field effect transistor with improved inter-poly dielectric |
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DE102009060072B4 (de) | 2009-12-22 | 2017-05-11 | Infineon Technologies Ag | Halbleiterbauelement und Verfahren zu seiner Herstellung |
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US8319290B2 (en) | 2010-06-18 | 2012-11-27 | Fairchild Semiconductor Corporation | Trench MOS barrier schottky rectifier with a planar surface using CMP techniques |
EP2421044B1 (de) * | 2010-08-16 | 2015-07-29 | Nxp B.V. | Randabschlussregion für Halbleiteranordnung |
US8786010B2 (en) | 2011-04-27 | 2014-07-22 | Fairchild Semiconductor Corporation | Superjunction structures for power devices and methods of manufacture |
US8772868B2 (en) | 2011-04-27 | 2014-07-08 | Fairchild Semiconductor Corporation | Superjunction structures for power devices and methods of manufacture |
US8673700B2 (en) | 2011-04-27 | 2014-03-18 | Fairchild Semiconductor Corporation | Superjunction structures for power devices and methods of manufacture |
US8836028B2 (en) | 2011-04-27 | 2014-09-16 | Fairchild Semiconductor Corporation | Superjunction structures for power devices and methods of manufacture |
US9054133B2 (en) | 2011-09-21 | 2015-06-09 | Globalfoundries Singapore Pte. Ltd. | High voltage trench transistor |
US8492226B2 (en) * | 2011-09-21 | 2013-07-23 | Globalfoundries Singapore Pte. Ltd. | Trench transistor |
US8999769B2 (en) * | 2012-07-18 | 2015-04-07 | Globalfoundries Singapore Pte. Ltd. | Integration of high voltage trench transistor with low voltage CMOS transistor |
US8872278B2 (en) | 2011-10-25 | 2014-10-28 | Fairchild Semiconductor Corporation | Integrated gate runner and field implant termination for trench devices |
US9412883B2 (en) | 2011-11-22 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and apparatus for MOS capacitors in replacement gate process |
KR101854609B1 (ko) * | 2011-12-27 | 2018-05-08 | 삼성전자주식회사 | 게이트 절연층의 형성 방법 |
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US9842911B2 (en) | 2012-05-30 | 2017-12-12 | Vishay-Siliconix | Adaptive charge balanced edge termination |
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GB9817643D0 (en) * | 1998-08-14 | 1998-10-07 | Philips Electronics Nv | Trench-gate semiconductor device |
US5998833A (en) | 1998-10-26 | 1999-12-07 | North Carolina State University | Power semiconductor devices having improved high frequency switching and breakdown characteristics |
-
1999
- 1999-07-22 GB GBGB9917099.5A patent/GB9917099D0/en not_active Ceased
-
2000
- 2000-07-17 EP EP00954523A patent/EP1145326B1/de not_active Expired - Lifetime
- 2000-07-17 WO PCT/EP2000/006819 patent/WO2001008226A2/en active Application Filing
- 2000-07-17 DE DE60042919T patent/DE60042919D1/de not_active Expired - Fee Related
- 2000-07-17 JP JP2001512640A patent/JP2003505886A/ja not_active Withdrawn
- 2000-07-24 US US09/624,481 patent/US6359308B1/en not_active Expired - Lifetime
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EP1145326A3 (de) | 2001-11-28 |
WO2001008226A3 (en) | 2001-09-13 |
GB9917099D0 (en) | 1999-09-22 |
JP2003505886A (ja) | 2003-02-12 |
EP1145326A2 (de) | 2001-10-17 |
WO2001008226A2 (en) | 2001-02-01 |
US6359308B1 (en) | 2002-03-19 |
EP1145326B1 (de) | 2009-09-09 |
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