DE60040252D1 - Verfahren zur Entfernung von Rückständen nach Photoresistveraschung - Google Patents

Verfahren zur Entfernung von Rückständen nach Photoresistveraschung

Info

Publication number
DE60040252D1
DE60040252D1 DE60040252T DE60040252T DE60040252D1 DE 60040252 D1 DE60040252 D1 DE 60040252D1 DE 60040252 T DE60040252 T DE 60040252T DE 60040252 T DE60040252 T DE 60040252T DE 60040252 D1 DE60040252 D1 DE 60040252D1
Authority
DE
Germany
Prior art keywords
incineration
photoresist
removal process
residue removal
residue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60040252T
Other languages
English (en)
Inventor
Ivan Louis Berry Iii
Stuart Nathan Rounds
Michael Shawn Owens
John Scott Hallock
Mahmoud Dahimene
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Application granted granted Critical
Publication of DE60040252D1 publication Critical patent/DE60040252D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D17/00—Rigid or semi-rigid containers specially constructed to be opened by cutting or piercing, or by tearing of frangible members or portions
    • B65D17/28—Rigid or semi-rigid containers specially constructed to be opened by cutting or piercing, or by tearing of frangible members or portions at lines or points of weakness
    • B65D17/401—Rigid or semi-rigid containers specially constructed to be opened by cutting or piercing, or by tearing of frangible members or portions at lines or points of weakness characterised by having the line of weakness provided in an end wall
    • B65D17/4011—Rigid or semi-rigid containers specially constructed to be opened by cutting or piercing, or by tearing of frangible members or portions at lines or points of weakness characterised by having the line of weakness provided in an end wall for opening completely by means of a tearing tab
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/12—Cans, casks, barrels, or drums
    • B65D1/14—Cans, casks, barrels, or drums characterised by shape
    • B65D1/16—Cans, casks, barrels, or drums characterised by shape of curved cross-section, e.g. cylindrical
    • B65D1/165—Cylindrical cans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00—Lids or covers for rigid or semi-rigid containers
    • B65D43/02—Removable lids or covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/002—Closures to be pierced by an extracting-device for the contents and fixed on the container by separate retaining means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/70—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for
    • B65D85/72—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for for edible or potable liquids, semiliquids, or plastic or pasty materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2313/00—Connecting or fastening means
    • B65D2313/08—Double sided adhesive tape, e.g. for suspension of the container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2517/00—Containers specially constructed to be opened by cutting, piercing or tearing of wall portions, e.g. preserving cans or tins
    • B65D2517/0001—Details
    • B65D2517/0031—Reclosable openings
    • B65D2517/004—Reclosable openings by means of an additional element
    • B65D2517/0041—Reclosable openings by means of an additional element in the form of a cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60040252T 1999-02-19 2000-02-17 Verfahren zur Entfernung von Rückständen nach Photoresistveraschung Expired - Lifetime DE60040252D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12086699P 1999-02-19 1999-02-19

Publications (1)

Publication Number Publication Date
DE60040252D1 true DE60040252D1 (de) 2008-10-30

Family

ID=22393001

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60040252T Expired - Lifetime DE60040252D1 (de) 1999-02-19 2000-02-17 Verfahren zur Entfernung von Rückständen nach Photoresistveraschung

Country Status (4)

Country Link
EP (1) EP1032026B1 (de)
JP (1) JP2000241992A (de)
KR (1) KR100544970B1 (de)
DE (1) DE60040252D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092287A (ja) * 2001-09-19 2003-03-28 Nec Corp アッシング方法
KR100772125B1 (ko) * 2002-06-26 2007-10-31 이유브이 리미티드 라이어빌러티 코포레이션 방사 주입된 표면 오염을 감소시키는 공정
KR100474594B1 (ko) * 2002-08-28 2005-03-10 주식회사 하이닉스반도체 반도체 소자의 세정방법
US7875419B2 (en) 2002-10-29 2011-01-25 Semiconductor Energy Laboratory Co., Ltd. Method for removing resist pattern and method for manufacturing semiconductor device
JP2005159294A (ja) 2003-09-18 2005-06-16 Nec Kagoshima Ltd 基板処理方法及びそれに用いる薬液
JP5213433B2 (ja) * 2006-12-21 2013-06-19 富士フイルム株式会社 導電膜およびその製造方法
JP2013030625A (ja) * 2011-07-28 2013-02-07 Fujitsu Semiconductor Ltd 半導体装置の製造方法及び処理装置
CN111009459B (zh) * 2019-12-26 2022-08-16 北京北方华创微电子装备有限公司 含氟残留物去除方法、刻蚀方法和氧化层清洗方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01274426A (ja) * 1988-04-26 1989-11-02 Mitsubishi Electric Corp 半導体装置製造のポジレジスト除去方法
JP2853211B2 (ja) * 1989-11-01 1999-02-03 富士通株式会社 半導体装置の製造方法
JPH0410622A (ja) * 1990-04-27 1992-01-14 Tokyo Electron Ltd ドライ洗浄装置
JPH0475323A (ja) * 1990-07-17 1992-03-10 Seiko Epson Corp レジスト除去法
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
AU7682594A (en) * 1993-09-08 1995-03-27 Uvtech Systems, Inc. Surface processing
KR19980068184A (ko) * 1997-02-17 1998-10-15 김광호 반도체장치 제조공정의 포토레지스트 제거방법
JPH10289891A (ja) * 1997-04-11 1998-10-27 Mitsubishi Gas Chem Co Inc 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法
US5849639A (en) * 1997-11-26 1998-12-15 Lucent Technologies Inc. Method for removing etching residues and contaminants
KR20000004232A (ko) * 1998-06-30 2000-01-25 김영환 반도체 소자의 콘택 홀 형성 방법

Also Published As

Publication number Publication date
EP1032026B1 (de) 2008-09-17
KR100544970B1 (ko) 2006-01-24
JP2000241992A (ja) 2000-09-08
KR20000058107A (ko) 2000-09-25
EP1032026A2 (de) 2000-08-30
EP1032026A3 (de) 2001-01-03

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Legal Events

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