DE69904787D1 - Verfahren zur Entfernung von Verschmierungen - Google Patents
Verfahren zur Entfernung von VerschmierungenInfo
- Publication number
- DE69904787D1 DE69904787D1 DE69904787T DE69904787T DE69904787D1 DE 69904787 D1 DE69904787 D1 DE 69904787D1 DE 69904787 T DE69904787 T DE 69904787T DE 69904787 T DE69904787 T DE 69904787T DE 69904787 D1 DE69904787 D1 DE 69904787D1
- Authority
- DE
- Germany
- Prior art keywords
- removal process
- smudge removal
- smudge
- removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/157,909 US5985040A (en) | 1998-09-21 | 1998-09-21 | Permanganate desmear process for printed wiring boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69904787D1 true DE69904787D1 (de) | 2003-02-13 |
DE69904787T2 DE69904787T2 (de) | 2003-05-15 |
Family
ID=22565839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69904787T Expired - Lifetime DE69904787T2 (de) | 1998-09-21 | 1999-08-20 | Verfahren zur Entfernung von Verschmierungen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5985040A (de) |
EP (1) | EP0989791B1 (de) |
CN (1) | CN1215746C (de) |
DE (1) | DE69904787T2 (de) |
TW (1) | TW461915B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
GB0104503D0 (en) * | 2001-02-23 | 2001-04-11 | Shipley Co Llc | Solvent swell for texturing resinous material and desmearing and removing resinous material |
DE102004012751A1 (de) * | 2004-03-15 | 2005-10-06 | Basf Ag | Verwendung von N-Ethyl-2-pyrrolidon |
JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
WO2006114130A1 (en) * | 2005-04-26 | 2006-11-02 | Agilent Technologies, Inc. | Enzymes with modified amino acids |
JP2007096186A (ja) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | 回路基板および回路基板の製造方法 |
US7737368B2 (en) | 2005-09-30 | 2010-06-15 | Sanyo Electric Co., Ltd. | Circuit board and method of manufacturing circuit board |
JP2011082374A (ja) * | 2009-10-08 | 2011-04-21 | C Uyemura & Co Ltd | 中和還元剤及びデスミア方法 |
JP5330474B2 (ja) * | 2011-09-22 | 2013-10-30 | 上村工業株式会社 | デスミア液及びデスミア処理方法 |
CN102438405B (zh) * | 2011-11-29 | 2013-08-14 | 电子科技大学 | 一种刚挠结合印制电路板通孔钻污的清洗方法 |
CN104519664B (zh) * | 2013-09-27 | 2018-04-17 | 北大方正集团有限公司 | 印制电路板的清洗方法和印制电路板 |
JP5874720B2 (ja) * | 2013-12-20 | 2016-03-02 | ウシオ電機株式会社 | 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料 |
CN104470237A (zh) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | 一种软硬结合板除钻污方法 |
CN108289384A (zh) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路(惠州)有限公司 | 高tg板除胶方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52134899A (en) * | 1976-05-07 | 1977-11-11 | Nissan Eng | Method of obtaining permanganate from manganese dioxide |
US4316322A (en) * | 1979-10-25 | 1982-02-23 | Burroughs Corporation | Method of fabricating electrical contacts in a printed circuit board |
US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
US4820548A (en) * | 1984-06-07 | 1989-04-11 | Enthone, Incorporated | Three step process for treating plastics with alkaline permanganate solutions |
US4592852A (en) * | 1984-06-07 | 1986-06-03 | Enthone, Incorporated | Composition and process for treating plastics with alkaline permanganate solutions |
US4601783A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards |
US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
GB8613960D0 (en) * | 1986-06-09 | 1986-07-16 | Omi International Gb Ltd | Treating laminates |
US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
US4911802A (en) * | 1988-03-09 | 1990-03-27 | Macdermid, Incorporated | Conversion of manganate to permanganate |
US4853095A (en) * | 1988-03-09 | 1989-08-01 | Macdermid, Incorporated | Conversion of manganese dioxide to permanganate |
US5132038A (en) * | 1988-04-25 | 1992-07-21 | Macdermid, Incorporated | Composition for preparing printed circuit through-holes for metallization |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
US5690747A (en) * | 1988-05-20 | 1997-11-25 | The Boeing Company | Method for removing photoresist with solvent and ultrasonic agitation |
US5271775A (en) * | 1988-06-22 | 1993-12-21 | Asahi Glass Company Ltd. | Methods for treating substrates by applying a halogenated hydrocarbon thereto |
DE3823137C2 (de) * | 1988-07-05 | 1993-12-02 | Schering Ag | Verfahren zur Ätzung von Epoxid-Harz |
IT1232863B (it) * | 1989-06-27 | 1992-03-05 | Alfachimici Spa | Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione |
JP2524436B2 (ja) * | 1990-09-18 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面処理方法 |
US5334331A (en) * | 1993-01-12 | 1994-08-02 | Isp Investments Inc. | Method of activating N-methyl-2-pyrrolidone (NMP) varnish and paint remover solvents for removal of organic coatings |
US5311660A (en) * | 1993-02-10 | 1994-05-17 | International Business Machines Corporation | Methyl chloroform-free desmear process in additive circuitization |
US5612303B1 (en) * | 1993-06-15 | 2000-07-18 | Nitto Chemical Industry Co Ltd | Solvent composition |
JPH0722741A (ja) * | 1993-07-01 | 1995-01-24 | Japan Gore Tex Inc | カバーレイフィルム及びカバーレイフィルム被覆回路基板 |
US5427895A (en) * | 1993-12-23 | 1995-06-27 | International Business Machines Corporation | Semi-subtractive circuitization |
US5554312A (en) * | 1995-01-13 | 1996-09-10 | Ashland | Photoresist stripping composition |
US5558109A (en) * | 1995-02-21 | 1996-09-24 | Church & Dwight Co., Inc. | Aqueous cleaning method and composition with nonionic surfactants for removing water soluble flux |
US5688753A (en) * | 1995-04-06 | 1997-11-18 | Church & Dwight Co.,Inc. | Flux removing composition |
US5814588A (en) * | 1996-03-19 | 1998-09-29 | Church & Dwight Co., Inc. | Aqueous alkali cleaning compositions |
US5755893A (en) * | 1996-06-21 | 1998-05-26 | Church & Dwight & Co., Inc. | Flux removing compositions |
US5798323A (en) * | 1997-05-05 | 1998-08-25 | Olin Microelectronic Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
-
1998
- 1998-09-21 US US09/157,909 patent/US5985040A/en not_active Expired - Lifetime
-
1999
- 1999-08-20 EP EP99202702A patent/EP0989791B1/de not_active Expired - Lifetime
- 1999-08-20 DE DE69904787T patent/DE69904787T2/de not_active Expired - Lifetime
- 1999-09-15 CN CNB991193989A patent/CN1215746C/zh not_active Expired - Lifetime
- 1999-09-15 TW TW088115920A patent/TW461915B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW461915B (en) | 2001-11-01 |
CN1215746C (zh) | 2005-08-17 |
EP0989791A3 (de) | 2000-06-21 |
US5985040A (en) | 1999-11-16 |
EP0989791A2 (de) | 2000-03-29 |
EP0989791B1 (de) | 2003-01-08 |
CN1248881A (zh) | 2000-03-29 |
DE69904787T2 (de) | 2003-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, INC., SOUTH PLAINFIE, US |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: OMG ELECTRONIC CHEMICALS, LLC (N. D. GES.D. ST, US |