CN1215746C - 印刷布线板的高锰酸盐去污方法 - Google Patents
印刷布线板的高锰酸盐去污方法 Download PDFInfo
- Publication number
- CN1215746C CN1215746C CNB991193989A CN99119398A CN1215746C CN 1215746 C CN1215746 C CN 1215746C CN B991193989 A CNB991193989 A CN B991193989A CN 99119398 A CN99119398 A CN 99119398A CN 1215746 C CN1215746 C CN 1215746C
- Authority
- CN
- China
- Prior art keywords
- pyrrolidone
- solvent
- gamma
- butyrolacton
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000002904 solvent Substances 0.000 claims abstract description 95
- 229920005989 resin Polymers 0.000 claims abstract description 85
- 239000011347 resin Substances 0.000 claims abstract description 85
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 18
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims abstract description 11
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims description 30
- 239000004094 surface-active agent Substances 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 238000005202 decontamination Methods 0.000 claims description 8
- UGAQMGXCNYQXHP-UHFFFAOYSA-N 1-ethoxypyrrolidin-2-one Chemical compound CCON1CCCC1=O UGAQMGXCNYQXHP-UHFFFAOYSA-N 0.000 claims description 6
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical group [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 claims description 6
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- NJPQAIBZIHNJDO-UHFFFAOYSA-N 1-dodecylpyrrolidin-2-one Chemical compound CCCCCCCCCCCCN1CCCC1=O NJPQAIBZIHNJDO-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 239000004642 Polyimide Substances 0.000 abstract description 3
- 239000004643 cyanate ester Substances 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 2
- MMABHMIOCAINNH-UHFFFAOYSA-N pyrrole-2,5-dione;triazine Chemical compound C1=CN=NN=C1.O=C1NC(=O)C=C1.O=C1NC(=O)C=C1 MMABHMIOCAINNH-UHFFFAOYSA-N 0.000 abstract 2
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 abstract 1
- WPPOGHDFAVQKLN-UHFFFAOYSA-N N-Octyl-2-pyrrolidone Chemical compound CCCCCCCCN1CCCC1=O WPPOGHDFAVQKLN-UHFFFAOYSA-N 0.000 abstract 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011877 solvent mixture Substances 0.000 description 23
- 238000012360 testing method Methods 0.000 description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 11
- 239000007800 oxidant agent Substances 0.000 description 11
- 230000001590 oxidative effect Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 238000006386 neutralization reaction Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- 241000208140 Acer Species 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000003588 decontaminative effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 238000009390 chemical decontamination Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
试验 | 树脂类型 | 溶剂(N-甲基-2-吡咯烷酮) | (80g/l氧化剂E-Prep101,所列浓度的E-Prep102) | 被去除的重量(mg/cm2) | ||
时间(min) | 浓度(%v/v) | 时间(min) | 浓度(vol%102) | |||
1 | FR4 | 2 | 50% | 10 | 5.3 | 0.33 |
2 | RCC | 15 | 50% | 20 | 4.0 | 0.19 |
3 | RCC | 10 | 50% | 15 | 5.3 | 0.18 |
4 | RCC | 3 | 50% | 15 | 8.0 | 0.19 |
5 | RCC | 5 | 100% | 15 | 5.3 | 重量增加 |
6 | FR4 | 5 | 50% | 15 | 5.3 | 0.99 |
7 | RCC | 5 | 50% | 15 | 5.3 | 0.12 |
8 | BT | 5 | 50% | 15 | 5.3 | 0.10 |
试验 | 树脂类型 | 溶剂(N-甲基-2-吡咯烷酮和γ-丁内酯) | 被去除的重量(mg/cm2) | ||
丁内酯浓度(%v/v) | N-甲基-2-吡咯烷酮浓度(%v/v) | 时间(min.) | |||
A | FR4 | 10% | 90% | 5 | 0.44 |
B | RCC | 10% | 90% | 5 | 0.27 |
C | BT | 10% | 90% | 5 | 0.24 |
D | FR4 | 20% | 80% | 5 | 0.13 |
E | RCC | 20% | 80% | 5 | 0.32 |
F | BT | 20% | 80% | 5 | 0.29 |
G | FR4 | 30% | 70% | 5 | 重量增加 |
H | RCC | 30% | 70% | 5 | 0.25 |
I | BT | 30% | 70% | 5 | 0.22 |
J | FR4 | 40% | 60% | 5 | 重量增加 |
K | RCC | 40% | 60% | 5 | 0.15 |
L | BT | 40% | 60% | 5 | 0.14 |
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/157,909 US5985040A (en) | 1998-09-21 | 1998-09-21 | Permanganate desmear process for printed wiring boards |
US09/157909 | 1998-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1248881A CN1248881A (zh) | 2000-03-29 |
CN1215746C true CN1215746C (zh) | 2005-08-17 |
Family
ID=22565839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991193989A Expired - Lifetime CN1215746C (zh) | 1998-09-21 | 1999-09-15 | 印刷布线板的高锰酸盐去污方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5985040A (zh) |
EP (1) | EP0989791B1 (zh) |
CN (1) | CN1215746C (zh) |
DE (1) | DE69904787T2 (zh) |
TW (1) | TW461915B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
GB0104503D0 (en) * | 2001-02-23 | 2001-04-11 | Shipley Co Llc | Solvent swell for texturing resinous material and desmearing and removing resinous material |
DE102004012751A1 (de) * | 2004-03-15 | 2005-10-06 | Basf Ag | Verwendung von N-Ethyl-2-pyrrolidon |
JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
WO2006114130A1 (en) * | 2005-04-26 | 2006-11-02 | Agilent Technologies, Inc. | Enzymes with modified amino acids |
JP2007096186A (ja) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | 回路基板および回路基板の製造方法 |
US7737368B2 (en) | 2005-09-30 | 2010-06-15 | Sanyo Electric Co., Ltd. | Circuit board and method of manufacturing circuit board |
JP2011082374A (ja) * | 2009-10-08 | 2011-04-21 | C Uyemura & Co Ltd | 中和還元剤及びデスミア方法 |
JP5330474B2 (ja) * | 2011-09-22 | 2013-10-30 | 上村工業株式会社 | デスミア液及びデスミア処理方法 |
CN102438405B (zh) * | 2011-11-29 | 2013-08-14 | 电子科技大学 | 一种刚挠结合印制电路板通孔钻污的清洗方法 |
CN104519664B (zh) * | 2013-09-27 | 2018-04-17 | 北大方正集团有限公司 | 印制电路板的清洗方法和印制电路板 |
JP5874720B2 (ja) * | 2013-12-20 | 2016-03-02 | ウシオ電機株式会社 | 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料 |
CN104470237A (zh) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | 一种软硬结合板除钻污方法 |
CN108289384A (zh) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路(惠州)有限公司 | 高tg板除胶方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52134899A (en) * | 1976-05-07 | 1977-11-11 | Nissan Eng | Method of obtaining permanganate from manganese dioxide |
US4316322A (en) * | 1979-10-25 | 1982-02-23 | Burroughs Corporation | Method of fabricating electrical contacts in a printed circuit board |
US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
US4592852A (en) * | 1984-06-07 | 1986-06-03 | Enthone, Incorporated | Composition and process for treating plastics with alkaline permanganate solutions |
US4820548A (en) * | 1984-06-07 | 1989-04-11 | Enthone, Incorporated | Three step process for treating plastics with alkaline permanganate solutions |
US4601783A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards |
US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
GB8613960D0 (en) * | 1986-06-09 | 1986-07-16 | Omi International Gb Ltd | Treating laminates |
US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
US4911802A (en) * | 1988-03-09 | 1990-03-27 | Macdermid, Incorporated | Conversion of manganate to permanganate |
US4853095A (en) * | 1988-03-09 | 1989-08-01 | Macdermid, Incorporated | Conversion of manganese dioxide to permanganate |
US5132038A (en) * | 1988-04-25 | 1992-07-21 | Macdermid, Incorporated | Composition for preparing printed circuit through-holes for metallization |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
US5690747A (en) * | 1988-05-20 | 1997-11-25 | The Boeing Company | Method for removing photoresist with solvent and ultrasonic agitation |
US5271775A (en) * | 1988-06-22 | 1993-12-21 | Asahi Glass Company Ltd. | Methods for treating substrates by applying a halogenated hydrocarbon thereto |
DE3823137C2 (de) * | 1988-07-05 | 1993-12-02 | Schering Ag | Verfahren zur Ätzung von Epoxid-Harz |
IT1232863B (it) * | 1989-06-27 | 1992-03-05 | Alfachimici Spa | Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione |
JP2524436B2 (ja) * | 1990-09-18 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面処理方法 |
US5334331A (en) * | 1993-01-12 | 1994-08-02 | Isp Investments Inc. | Method of activating N-methyl-2-pyrrolidone (NMP) varnish and paint remover solvents for removal of organic coatings |
US5311660A (en) * | 1993-02-10 | 1994-05-17 | International Business Machines Corporation | Methyl chloroform-free desmear process in additive circuitization |
US5612303B1 (en) * | 1993-06-15 | 2000-07-18 | Nitto Chemical Industry Co Ltd | Solvent composition |
JPH0722741A (ja) * | 1993-07-01 | 1995-01-24 | Japan Gore Tex Inc | カバーレイフィルム及びカバーレイフィルム被覆回路基板 |
US5427895A (en) * | 1993-12-23 | 1995-06-27 | International Business Machines Corporation | Semi-subtractive circuitization |
US5554312A (en) * | 1995-01-13 | 1996-09-10 | Ashland | Photoresist stripping composition |
US5558109A (en) * | 1995-02-21 | 1996-09-24 | Church & Dwight Co., Inc. | Aqueous cleaning method and composition with nonionic surfactants for removing water soluble flux |
US5688753A (en) * | 1995-04-06 | 1997-11-18 | Church & Dwight Co.,Inc. | Flux removing composition |
US5814588A (en) * | 1996-03-19 | 1998-09-29 | Church & Dwight Co., Inc. | Aqueous alkali cleaning compositions |
US5755893A (en) * | 1996-06-21 | 1998-05-26 | Church & Dwight & Co., Inc. | Flux removing compositions |
US5798323A (en) * | 1997-05-05 | 1998-08-25 | Olin Microelectronic Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
-
1998
- 1998-09-21 US US09/157,909 patent/US5985040A/en not_active Expired - Lifetime
-
1999
- 1999-08-20 EP EP99202702A patent/EP0989791B1/en not_active Expired - Lifetime
- 1999-08-20 DE DE69904787T patent/DE69904787T2/de not_active Expired - Lifetime
- 1999-09-15 TW TW088115920A patent/TW461915B/zh not_active IP Right Cessation
- 1999-09-15 CN CNB991193989A patent/CN1215746C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69904787T2 (de) | 2003-05-15 |
EP0989791A2 (en) | 2000-03-29 |
CN1248881A (zh) | 2000-03-29 |
DE69904787D1 (de) | 2003-02-13 |
US5985040A (en) | 1999-11-16 |
TW461915B (en) | 2001-11-01 |
EP0989791A3 (en) | 2000-06-21 |
EP0989791B1 (en) | 2003-01-08 |
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