DE60039513D1 - Echtzeit voraussagung der resist-erwärmung durch proximität und korrektur der raster scan elektronenstrahl-lithographie - Google Patents

Echtzeit voraussagung der resist-erwärmung durch proximität und korrektur der raster scan elektronenstrahl-lithographie

Info

Publication number
DE60039513D1
DE60039513D1 DE60039513T DE60039513T DE60039513D1 DE 60039513 D1 DE60039513 D1 DE 60039513D1 DE 60039513 T DE60039513 T DE 60039513T DE 60039513 T DE60039513 T DE 60039513T DE 60039513 D1 DE60039513 D1 DE 60039513D1
Authority
DE
Germany
Prior art keywords
proximity
correction
real
electron beam
beam lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60039513T
Other languages
English (en)
Inventor
Robert Innes
Sergey Babin
Robin Teitzel
Lee Veneklasen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE60039513D1 publication Critical patent/DE60039513D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31769—Proximity effect correction
DE60039513T 1999-06-30 2000-06-27 Echtzeit voraussagung der resist-erwärmung durch proximität und korrektur der raster scan elektronenstrahl-lithographie Expired - Fee Related DE60039513D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/343,960 US6373071B1 (en) 1999-06-30 1999-06-30 Real-time prediction of proximity resist heating and correction of raster scan electron beam lithography
PCT/US2000/017706 WO2001001440A1 (en) 1999-06-30 2000-06-27 Real-time prediction of proximity resist heating and correction of raster scan electron beam lithography

Publications (1)

Publication Number Publication Date
DE60039513D1 true DE60039513D1 (de) 2008-08-28

Family

ID=23348414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039513T Expired - Fee Related DE60039513D1 (de) 1999-06-30 2000-06-27 Echtzeit voraussagung der resist-erwärmung durch proximität und korrektur der raster scan elektronenstrahl-lithographie

Country Status (7)

Country Link
US (1) US6373071B1 (de)
EP (1) EP1190434B1 (de)
JP (1) JP2003503837A (de)
KR (1) KR100752967B1 (de)
AU (1) AU5772300A (de)
DE (1) DE60039513D1 (de)
WO (1) WO2001001440A1 (de)

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US6720565B2 (en) * 1999-06-30 2004-04-13 Applied Materials, Inc. Real-time prediction of and correction of proximity resist heating in raster scan particle beam lithography
FR2806527B1 (fr) * 2000-03-20 2002-10-25 Schlumberger Technologies Inc Colonne a focalisation simultanee d'un faisceau de particules et d'un faisceau optique
US6420717B1 (en) * 2000-04-11 2002-07-16 Applied Materials, Inc. Method and apparatus for real-time correction of resist heating in lithography
US6379851B1 (en) * 2000-07-31 2002-04-30 Applied Materials, Inc. Methods to predict and correct resist heating during lithography
US6548223B2 (en) * 2001-02-28 2003-04-15 Micron Technology, Inc. Methods of forming patterns across photoresist and methods of forming radiation-patterning tools
DE102004018147A1 (de) * 2004-04-08 2005-11-03 Leica Microsystems Lithography Gmbh Einrichtung und Verfahren zur Erzeugung von Resistprofilen
US7115866B1 (en) * 2005-04-28 2006-10-03 Kla-Tencor Technologies, Inc. Site stepping for electron beam micro analysis
JP4825450B2 (ja) * 2005-05-16 2011-11-30 株式会社東芝 パターン描画システム、荷電ビーム描画方法、及びフォトマスク製造方法
US7897008B2 (en) * 2006-10-27 2011-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for regional plasma control
US7902528B2 (en) * 2006-11-21 2011-03-08 Cadence Design Systems, Inc. Method and system for proximity effect and dose correction for a particle beam writing device
US7824828B2 (en) * 2007-02-22 2010-11-02 Cadence Design Systems, Inc. Method and system for improvement of dose correction for particle beam writers
US8387674B2 (en) 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
US8178280B2 (en) * 2010-02-05 2012-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. Self-contained proximity effect correction inspiration for advanced lithography (special)
JP5894856B2 (ja) * 2012-05-22 2016-03-30 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
WO2014071091A1 (en) * 2012-11-02 2014-05-08 D2S, Inc. Method and system for improving critical dimension uniformity using shaped beam lithography
TWI534528B (zh) * 2013-03-27 2016-05-21 Nuflare Technology Inc Drawing an amount of the charged particle beam to obtain the modulation factor of a charged particle beam irradiation apparatus and method
US9541846B2 (en) * 2013-09-06 2017-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Homogeneous thermal equalization with active device
JP2016184605A (ja) * 2015-03-25 2016-10-20 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び描画データ作成方法
US10032603B2 (en) 2015-09-07 2018-07-24 Nuflare Technology, Inc. Charged particle beam lithography apparatus and charged particle beam lithography method
US10460071B2 (en) * 2015-11-04 2019-10-29 D2S, Inc. Shaped beam lithography including temperature effects
CN109227226B (zh) * 2018-11-12 2020-11-03 中国科学院光电技术研究所 一种光学元件加工过程中驻留时间的匀滑方法
US11654635B2 (en) 2019-04-18 2023-05-23 The Research Foundation For Suny Enhanced non-destructive testing in directed energy material processing
CN117581158A (zh) 2022-04-26 2024-02-20 纽富来科技股份有限公司 多带电粒子束描绘装置、多带电粒子束描绘方法以及记录有程序的可读取记录介质

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Also Published As

Publication number Publication date
KR100752967B1 (ko) 2007-08-30
KR20020036793A (ko) 2002-05-16
EP1190434B1 (de) 2008-07-16
JP2003503837A (ja) 2003-01-28
EP1190434A1 (de) 2002-03-27
US6373071B1 (en) 2002-04-16
WO2001001440A1 (en) 2001-01-04
AU5772300A (en) 2001-01-31

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8339 Ceased/non-payment of the annual fee