DE60038854D1 - Hochfrequenzschaltungsmodul und Kommunikationseinrichtung - Google Patents

Hochfrequenzschaltungsmodul und Kommunikationseinrichtung

Info

Publication number
DE60038854D1
DE60038854D1 DE60038854T DE60038854T DE60038854D1 DE 60038854 D1 DE60038854 D1 DE 60038854D1 DE 60038854 T DE60038854 T DE 60038854T DE 60038854 T DE60038854 T DE 60038854T DE 60038854 D1 DE60038854 D1 DE 60038854D1
Authority
DE
Germany
Prior art keywords
communication device
high frequency
circuit module
frequency circuit
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038854T
Other languages
English (en)
Inventor
Eiichi Hase
Shun Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE60038854D1 publication Critical patent/DE60038854D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Microwave Amplifiers (AREA)
  • Transceivers (AREA)
DE60038854T 1999-09-29 2000-08-17 Hochfrequenzschaltungsmodul und Kommunikationseinrichtung Expired - Lifetime DE60038854D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27573099A JP3976297B2 (ja) 1999-09-29 1999-09-29 高周波回路モジュールおよび通信装置

Publications (1)

Publication Number Publication Date
DE60038854D1 true DE60038854D1 (de) 2008-06-26

Family

ID=17559596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038854T Expired - Lifetime DE60038854D1 (de) 1999-09-29 2000-08-17 Hochfrequenzschaltungsmodul und Kommunikationseinrichtung

Country Status (5)

Country Link
US (1) US6753604B1 (de)
EP (1) EP1089375B1 (de)
JP (1) JP3976297B2 (de)
KR (1) KR100711175B1 (de)
DE (1) DE60038854D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3941416B2 (ja) 2001-04-26 2007-07-04 ソニー株式会社 高周波モジュール装置及びその製造方法
FR2824986B1 (fr) * 2001-05-18 2003-10-31 St Microelectronics Sa Composant electronique permettant le decodage d'un canal de transmission radiofrequence vehiculant des informations numeriques codees, en particulier pour la telediffusion numerique par satellite
US6985712B2 (en) * 2001-08-27 2006-01-10 Matsushita Electric Industrial Co., Ltd. RF device and communication apparatus using the same
DE10224221A1 (de) * 2002-05-31 2003-12-11 Siemens Ag Elektrische Vorrichtung
JP3960277B2 (ja) 2002-10-23 2007-08-15 株式会社村田製作所 高周波モジュールおよび通信装置
US7373171B2 (en) * 2003-02-14 2008-05-13 Tdk Corporation Front end module
JP2004266673A (ja) * 2003-03-03 2004-09-24 Mitsubishi Electric Corp 高周波電力増幅器
KR100608289B1 (ko) * 2004-10-01 2006-08-09 엘지이노텍 주식회사 프론트 엔드 모듈
TWI470752B (zh) * 2011-12-09 2015-01-21 Univ Nat Taipei Technology 應用於電子元件之電容式連接結構
JP5285806B1 (ja) * 2012-08-21 2013-09-11 太陽誘電株式会社 高周波回路モジュール
JP5117632B1 (ja) 2012-08-21 2013-01-16 太陽誘電株式会社 高周波回路モジュール
US9871501B2 (en) * 2015-06-22 2018-01-16 Nxp Usa, Inc. RF circuit with multiple-definition RF substrate and conductive material void under a bias line
CN113466733A (zh) * 2020-03-30 2021-10-01 Oppo广东移动通信有限公司 电源性能测试方法、装置、电子设备及存储介质
CN114725642B (zh) * 2022-03-16 2023-09-19 天津大学 针对介质集成悬置线和金属-介质集成悬置线有源器件的封装结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793392B2 (ja) * 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPH04142801A (ja) * 1990-10-03 1992-05-15 Mitsubishi Electric Corp マイクロ波用パッケージ
JPH04322502A (ja) * 1991-04-22 1992-11-12 Fukushima Nippon Denki Kk 分布定数型整合回路
EP0563873B1 (de) * 1992-04-03 1998-06-03 Matsushita Electric Industrial Co., Ltd. Keramisches Mehrschicht-Substrat für hohe Frequenzen
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JPH07226607A (ja) * 1994-02-10 1995-08-22 Hitachi Ltd 分波器、分波器モジュールおよび無線通信装置
JPH1013163A (ja) * 1996-06-25 1998-01-16 Matsushita Electric Ind Co Ltd 高周波電力増幅器
JPH10135749A (ja) * 1996-10-29 1998-05-22 Nec Corp 高周波帯増幅器
JP3538045B2 (ja) * 1998-12-09 2004-06-14 三菱電機株式会社 Ｒｆ回路モジュール
JP2000209006A (ja) * 1999-01-14 2000-07-28 Hitachi Ltd 高周波回路モジュ―ルおよび携帯通信機器

Also Published As

Publication number Publication date
KR20010030080A (ko) 2001-04-16
KR100711175B1 (ko) 2007-04-27
JP3976297B2 (ja) 2007-09-12
EP1089375A2 (de) 2001-04-04
JP2001102511A (ja) 2001-04-13
EP1089375A3 (de) 2002-12-11
US6753604B1 (en) 2004-06-22
EP1089375B1 (de) 2008-05-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition