DE60028709D1 - Verfahren und Vorrichtung für Schichtdickenmessung und Substratverarbeitung - Google Patents

Verfahren und Vorrichtung für Schichtdickenmessung und Substratverarbeitung

Info

Publication number
DE60028709D1
DE60028709D1 DE60028709T DE60028709T DE60028709D1 DE 60028709 D1 DE60028709 D1 DE 60028709D1 DE 60028709 T DE60028709 T DE 60028709T DE 60028709 T DE60028709 T DE 60028709T DE 60028709 D1 DE60028709 D1 DE 60028709D1
Authority
DE
Germany
Prior art keywords
substrate processing
coating thickness
thickness measurement
measurement
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60028709T
Other languages
English (en)
Other versions
DE60028709T2 (de
Inventor
Toshifumi Kimba
Shunsuke Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60028709D1 publication Critical patent/DE60028709D1/de
Publication of DE60028709T2 publication Critical patent/DE60028709T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Paper (AREA)
DE60028709T 1999-12-13 2000-12-13 Verfahren und Vorrichtung für Schichtdickenmessung und Substratverarbeitung Expired - Fee Related DE60028709T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP35369399 1999-12-13
JP35369399 1999-12-13
JP2000315212 2000-10-16
JP2000315212A JP3854056B2 (ja) 1999-12-13 2000-10-16 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置

Publications (2)

Publication Number Publication Date
DE60028709D1 true DE60028709D1 (de) 2006-07-27
DE60028709T2 DE60028709T2 (de) 2007-05-24

Family

ID=26579896

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60028709T Expired - Fee Related DE60028709T2 (de) 1999-12-13 2000-12-13 Verfahren und Vorrichtung für Schichtdickenmessung und Substratverarbeitung

Country Status (6)

Country Link
US (4) US6785010B2 (de)
EP (1) EP1108979B1 (de)
JP (1) JP3854056B2 (de)
KR (1) KR100742764B1 (de)
DE (1) DE60028709T2 (de)
TW (1) TW517278B (de)

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US8564780B2 (en) 2003-01-16 2013-10-22 Jordan Valley Semiconductors Ltd. Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
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US8316866B2 (en) 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US7511265B2 (en) 2004-08-11 2009-03-31 Metrosol, Inc. Method and apparatus for accurate calibration of a reflectometer by using a relative reflectance measurement
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CN103017691B (zh) * 2012-11-30 2015-09-30 上海华力微电子有限公司 一种侦测硅片平坦度的装置及方法
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
JP5702832B2 (ja) * 2013-06-11 2015-04-15 ファナック株式会社 距離測定用ホルダおよび干渉物検知機能を有する工作機械
JP6101621B2 (ja) * 2013-11-28 2017-03-22 株式会社荏原製作所 研磨装置
JP6441056B2 (ja) * 2014-12-10 2018-12-19 株式会社ディスコ 研削装置
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JP6473050B2 (ja) 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
JP6707278B2 (ja) * 2015-09-04 2020-06-10 株式会社ディスコ 研削ホイール及び被加工物の研削方法
JP6599285B2 (ja) * 2016-06-07 2019-10-30 三菱重工業株式会社 光学センサ
JP6470366B2 (ja) * 2016-07-27 2019-02-13 株式会社荏原製作所 ポリッシング装置
US10234265B2 (en) 2016-12-12 2019-03-19 Precitec Optronik Gmbh Distance measuring device and method for measuring distances
WO2018216246A1 (ja) * 2017-05-23 2018-11-29 浜松ホトニクス株式会社 配向特性測定方法、配向特性測定プログラム、及び配向特性測定装置
US11243073B2 (en) 2017-05-23 2022-02-08 Hamamatsu Photonics K.K. Orientation characteristic measurement method, orientation characteristic measurement program, and orientation characteristic measurement device
DE102017126310A1 (de) * 2017-11-09 2019-05-09 Precitec Optronik Gmbh Abstandsmessvorrichtung
KR102690417B1 (ko) * 2018-07-26 2024-07-31 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
DE102018130901A1 (de) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optische Messeinrichtung
KR20200068785A (ko) * 2018-12-05 2020-06-16 삼성디스플레이 주식회사 연마 모니터링 시스템 및 연마 모니터링 방법
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
CN109746813B (zh) * 2019-01-24 2020-09-29 长春理工大学 一种五轴联动激光磁流变复合抛光加工装置及其使用方法
JP7031626B2 (ja) 2019-03-13 2022-03-08 オムロン株式会社 センサヘッド
JP7403998B2 (ja) * 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
US12051316B2 (en) 2019-12-18 2024-07-30 Hypertherm, Inc. Liquid jet cutting head sensor systems and methods
JP7503418B2 (ja) 2020-05-14 2024-06-20 株式会社荏原製作所 膜厚測定装置、研磨装置及び膜厚測定方法
JP7494092B2 (ja) 2020-11-02 2024-06-03 株式会社荏原製作所 研磨装置及び研磨方法

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Also Published As

Publication number Publication date
US20090051939A1 (en) 2009-02-26
US20010005265A1 (en) 2001-06-28
JP3854056B2 (ja) 2006-12-06
EP1108979A3 (de) 2003-10-08
JP2001235311A (ja) 2001-08-31
DE60028709T2 (de) 2007-05-24
KR20010062402A (ko) 2001-07-07
KR100742764B1 (ko) 2007-07-25
EP1108979A2 (de) 2001-06-20
US7072050B2 (en) 2006-07-04
US7675634B2 (en) 2010-03-09
US7428064B2 (en) 2008-09-23
US20040223166A1 (en) 2004-11-11
TW517278B (en) 2003-01-11
US20060209308A1 (en) 2006-09-21
US6785010B2 (en) 2004-08-31
EP1108979B1 (de) 2006-06-14

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee