DE69933753D1 - Verbessertes verfahren und vorrichtung zur schichtdickenbestimmung - Google Patents
Verbessertes verfahren und vorrichtung zur schichtdickenbestimmungInfo
- Publication number
- DE69933753D1 DE69933753D1 DE69933753T DE69933753T DE69933753D1 DE 69933753 D1 DE69933753 D1 DE 69933753D1 DE 69933753 T DE69933753 T DE 69933753T DE 69933753 T DE69933753 T DE 69933753T DE 69933753 D1 DE69933753 D1 DE 69933753D1
- Authority
- DE
- Germany
- Prior art keywords
- layer thickness
- improved method
- thickness determination
- determination
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0666—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using an exciting beam and a detection beam including surface acoustic waves [SAW]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/636—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited using an arrangement of pump beam and probe beam; using the measurement of optical non-linear properties
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Acoustics & Sound (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US176174 | 1998-10-21 | ||
US09/176,174 US6188478B1 (en) | 1998-10-21 | 1998-10-21 | Method and apparatus for film-thickness measurements |
PCT/EP1999/008231 WO2000023790A1 (en) | 1998-10-21 | 1999-10-21 | Improved method and apparatus for film-thickness measurements |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69933753D1 true DE69933753D1 (de) | 2006-12-07 |
DE69933753T2 DE69933753T2 (de) | 2007-10-04 |
Family
ID=22643298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69933753T Expired - Fee Related DE69933753T2 (de) | 1998-10-21 | 1999-10-21 | Verbessertes verfahren und vorrichtung zur schichtdickenbestimmung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6188478B1 (de) |
EP (1) | EP1044362B1 (de) |
JP (1) | JP2002527770A (de) |
KR (1) | KR20010033388A (de) |
CN (1) | CN1291284A (de) |
DE (1) | DE69933753T2 (de) |
WO (1) | WO2000023790A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998045745A1 (en) * | 1997-04-04 | 1998-10-15 | Isis Innovation Limited | Microscopy imaging apparatus and method |
US6587794B1 (en) * | 1999-07-30 | 2003-07-01 | Koninklijke Philips Electronics N.V. | Method for measuring thin metal films |
US6778683B1 (en) * | 1999-12-08 | 2004-08-17 | Federal Express Corporation | Method and apparatus for reading and decoding information |
US6381019B1 (en) * | 2000-06-30 | 2002-04-30 | Brown University Research Foundation | Ultrasonic generator and detector using an optical mask having a grating for launching a plurality of spatially distributed, time varying strain pulses in a sample |
US7130029B2 (en) * | 2000-09-20 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for determining an adhesion characteristic and a thickness of a specimen |
US6919957B2 (en) * | 2000-09-20 | 2005-07-19 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen |
US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
US6694284B1 (en) | 2000-09-20 | 2004-02-17 | Kla-Tencor Technologies Corp. | Methods and systems for determining at least four properties of a specimen |
US7196782B2 (en) * | 2000-09-20 | 2007-03-27 | Kla-Tencor Technologies Corp. | Methods and systems for determining a thin film characteristic and an electrical property of a specimen |
US6782337B2 (en) * | 2000-09-20 | 2004-08-24 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension an a presence of defects on a specimen |
US6673637B2 (en) * | 2000-09-20 | 2004-01-06 | Kla-Tencor Technologies | Methods and systems for determining a presence of macro defects and overlay of a specimen |
US7349090B2 (en) * | 2000-09-20 | 2008-03-25 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography |
US6812045B1 (en) | 2000-09-20 | 2004-11-02 | Kla-Tencor, Inc. | Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation |
US6504618B2 (en) * | 2001-03-21 | 2003-01-07 | Rudolph Technologies, Inc. | Method and apparatus for decreasing thermal loading and roughness sensitivity in a photoacoustic film thickness measurement system |
US7050178B2 (en) * | 2001-07-13 | 2006-05-23 | Rudolph Technologies, Inc. | Method and apparatus for increasing signal to noise ratio in a photoacoustic film thickness measurement system |
US6786099B2 (en) | 2002-02-14 | 2004-09-07 | Kla-Tencor Technologies Corporation | Surface photo-acoustic film measurement device and technique |
US7027142B2 (en) * | 2002-05-06 | 2006-04-11 | Applied Materials, Israel, Ltd. | Optical technique for detecting buried defects in opaque films |
WO2004048945A1 (en) * | 2002-11-27 | 2004-06-10 | Optical Metrology Patents Limited | Apparatus for modulating a light beam |
US7046712B2 (en) | 2003-05-02 | 2006-05-16 | Jds Uniphase Corporation | Laser resistant to internal ir-induced damage |
TWI296041B (en) * | 2003-06-24 | 2008-04-21 | Advanced Metrology Systems Llc | Method of measuring sub-micron trench structures |
US7274465B2 (en) * | 2005-02-17 | 2007-09-25 | Timbre Technologies, Inc. | Optical metrology of a structure formed on a semiconductor wafer using optical pulses |
GB0610318D0 (en) * | 2006-05-24 | 2006-07-05 | Univ Nottingham | Transducers |
KR100855628B1 (ko) * | 2006-10-02 | 2008-09-03 | 삼성전기주식회사 | 광변조기 검사를 위한 장치 및 방법 |
US8334986B2 (en) * | 2010-02-25 | 2012-12-18 | Corning Incorporated | Methods and apparatus for the measurement of film thickness |
US9140542B2 (en) * | 2012-02-08 | 2015-09-22 | Honeywell Asca Inc. | Caliper coating measurement on continuous non-uniform web using THz sensor |
WO2016132349A1 (en) * | 2015-02-19 | 2016-08-25 | B. G. Negev Technologies And Applications Ltd., At Ben-Gurion University | Transient bragg gratings in optical waveguides and their applications |
TWI601938B (zh) * | 2016-06-28 | 2017-10-11 | 國立清華大學 | 即時檢測全場厚度的光學裝置 |
US10276455B2 (en) * | 2016-07-29 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for measurement of semiconductor device fabrication tool implement |
KR102370055B1 (ko) | 2018-01-08 | 2022-03-03 | 일루미나, 인코포레이티드 | 반도체-기반 검출을 사용하는 고-처리율 서열분석용 시스템 및 디바이스 |
TWI699559B (zh) | 2018-01-16 | 2020-07-21 | 美商伊路米納有限公司 | 結構照明成像系統和使用結構化光來創建高解析度圖像的方法 |
NL2020620B1 (en) | 2018-01-16 | 2019-07-25 | Illumina Inc | Pattern angle spatial selection structured illumination imaging |
NL2020619B1 (en) | 2018-01-16 | 2019-07-25 | Illumina Inc | Dual optical grating slide structured illumination imaging |
NL2020623B1 (en) | 2018-01-24 | 2019-07-30 | Illumina Inc | Structured illumination microscopy with line scanning |
NL2020622B1 (en) | 2018-01-24 | 2019-07-30 | Lllumina Cambridge Ltd | Reduced dimensionality structured illumination microscopy with patterned arrays of nanowells |
NL2021258B1 (en) | 2018-06-14 | 2019-12-20 | Illumina Inc | Device for luminescent imaging |
TWI718557B (zh) | 2018-06-29 | 2021-02-11 | 美商伊路米納有限公司 | 用於預測結構照明參數之方法、系統和非暫時性電腦可讀取媒體 |
US10901202B2 (en) | 2018-09-19 | 2021-01-26 | Illumina, Inc. | Structured illumination of a sample |
CN111551503B (zh) * | 2020-04-29 | 2023-04-07 | 南京理工大学 | 一种非接触式检测材料弹性模量的激光超声系统及方法 |
US11881436B2 (en) | 2021-07-07 | 2024-01-23 | Applied Materials, Inc. | Pre and post processing metrology apparatus |
WO2024086453A1 (en) * | 2022-10-18 | 2024-04-25 | Massachusetts Institute Of Technology | Systems, devices, and methods for high-throughput non-contact characterization of materials via vibrational signatures |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4750822A (en) * | 1986-03-28 | 1988-06-14 | Therma-Wave, Inc. | Method and apparatus for optically detecting surface states in materials |
US5220403A (en) * | 1991-03-11 | 1993-06-15 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
US5377006A (en) * | 1991-05-20 | 1994-12-27 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal |
US5479259A (en) * | 1991-05-20 | 1995-12-26 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal |
US5344236A (en) * | 1992-01-23 | 1994-09-06 | Fishman Iiya M | Method for evaluation of quality of the interface between layer and substrate |
US5812261A (en) * | 1992-07-08 | 1998-09-22 | Active Impulse Systems, Inc. | Method and device for measuring the thickness of opaque and transparent films |
EP0805947A4 (de) * | 1995-01-24 | 1999-10-20 | Massachusetts Inst Technology | Optisches verfahren und vorrichtung für zeitaufgelöste messungen |
-
1998
- 1998-10-21 US US09/176,174 patent/US6188478B1/en not_active Expired - Fee Related
-
1999
- 1999-10-21 WO PCT/EP1999/008231 patent/WO2000023790A1/en not_active Application Discontinuation
- 1999-10-21 KR KR1020007006857A patent/KR20010033388A/ko not_active Application Discontinuation
- 1999-10-21 CN CN99803134A patent/CN1291284A/zh active Pending
- 1999-10-21 EP EP99968333A patent/EP1044362B1/de not_active Expired - Lifetime
- 1999-10-21 DE DE69933753T patent/DE69933753T2/de not_active Expired - Fee Related
- 1999-10-21 JP JP2000577479A patent/JP2002527770A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69933753T2 (de) | 2007-10-04 |
JP2002527770A (ja) | 2002-08-27 |
KR20010033388A (ko) | 2001-04-25 |
EP1044362A1 (de) | 2000-10-18 |
EP1044362B1 (de) | 2006-10-25 |
WO2000023790A1 (en) | 2000-04-27 |
CN1291284A (zh) | 2001-04-11 |
US6188478B1 (en) | 2001-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ADVANCED METROLOGY SYSTEMS LLC. (N. D. GES. D., US |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: MARKS & CLERK, LUXEMBOURG, LU |
|
8339 | Ceased/non-payment of the annual fee |