DE60028275D1 - Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren - Google Patents

Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren

Info

Publication number
DE60028275D1
DE60028275D1 DE60028275T DE60028275T DE60028275D1 DE 60028275 D1 DE60028275 D1 DE 60028275D1 DE 60028275 T DE60028275 T DE 60028275T DE 60028275 T DE60028275 T DE 60028275T DE 60028275 D1 DE60028275 D1 DE 60028275D1
Authority
DE
Germany
Prior art keywords
manufacturing
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60028275T
Other languages
English (en)
Other versions
DE60028275T2 (de
Inventor
Teruhiko Kuramachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of DE60028275D1 publication Critical patent/DE60028275D1/de
Application granted granted Critical
Publication of DE60028275T2 publication Critical patent/DE60028275T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0021—Degradation or life time measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02492—CuW heat spreaders

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
DE60028275T 1999-03-19 2000-03-17 Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren Expired - Lifetime DE60028275T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP07603999A JP4104032B2 (ja) 1999-03-19 1999-03-19 半導体発光装置およびその製造方法
JP7603999 1999-03-19

Publications (2)

Publication Number Publication Date
DE60028275D1 true DE60028275D1 (de) 2006-07-06
DE60028275T2 DE60028275T2 (de) 2006-11-02

Family

ID=13593677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60028275T Expired - Lifetime DE60028275T2 (de) 1999-03-19 2000-03-17 Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren

Country Status (4)

Country Link
US (1) US6621159B1 (de)
EP (1) EP1039596B1 (de)
JP (1) JP4104032B2 (de)
DE (1) DE60028275T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486900B2 (ja) * 2000-02-15 2004-01-13 ソニー株式会社 発光装置およびそれを用いた光装置
DE102004024156B4 (de) * 2004-03-31 2011-01-13 Osram Opto Semiconductors Gmbh Kantenemittierender Diodenlaser
KR20060115453A (ko) * 2005-05-06 2006-11-09 삼성전자주식회사 방열 구조체 및 이를 구비한 발광소자 조립체
TWI307915B (en) 2006-06-26 2009-03-21 Univ Nat Cheng Kung Method for manufacturing heat sink of semiconductor device
WO2008021073A2 (en) * 2006-08-07 2008-02-21 University Of Massachusetts Nanoheater elements, systems and methods of use thereof
JP5273922B2 (ja) * 2006-12-28 2013-08-28 株式会社アライドマテリアル 放熱部材および半導体装置
EP2415086B1 (de) * 2009-04-03 2019-02-27 OSRAM Opto Semiconductors GmbH Verfahren zur herstellung eines optoelektronischen bauelements, optoelektronisches bauelement und bauelementanordnung mit mehreren optoelektronischen bauelementen
KR20140070141A (ko) * 2012-11-30 2014-06-10 삼성전자주식회사 열 방출 부를 갖는 반도체 패키지
JP7324665B2 (ja) * 2019-09-13 2023-08-10 シチズンファインデバイス株式会社 サブマウント
CN113637942B (zh) * 2021-08-16 2023-04-14 陕西理工大学 金属W/非晶NiTiNbFe纳米多层膜及制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2431900A1 (fr) * 1978-07-25 1980-02-22 Thomson Csf Systeme de soudure d'un laser a semiconducteur sur un socle metallique
JPS5628039A (en) 1979-08-10 1981-03-19 Kubota Ltd Brake of vehicle
US5225711A (en) * 1988-12-23 1993-07-06 International Business Machines Corporation Palladium enhanced soldering and bonding of semiconductor device contacts
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
GB2300375B (en) * 1994-08-01 1998-02-25 Nippon Denso Co Bonding method for electric element
US5661081A (en) * 1994-09-30 1997-08-26 United Microelectronics Corporation Method of bonding an aluminum wire to an intergrated circuit bond pad
JP3318811B2 (ja) * 1994-12-29 2002-08-26 ソニー株式会社 半導体発光素子のパッケージ及びその製造方法
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
EP0907304B1 (de) * 1996-05-29 2002-11-06 Idemitsu Kosan Company Limited Organische elektrolumineszente vorrichtung
US5981310A (en) * 1998-01-22 1999-11-09 International Business Machines Corporation Multi-chip heat-sink cap assembly

Also Published As

Publication number Publication date
EP1039596B1 (de) 2006-05-31
JP2000269583A (ja) 2000-09-29
JP4104032B2 (ja) 2008-06-18
EP1039596A2 (de) 2000-09-27
DE60028275T2 (de) 2006-11-02
EP1039596A3 (de) 2004-02-18
US6621159B1 (en) 2003-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJIFILM CORP., TOKIO/TOKYO, JP

R082 Change of representative

Ref document number: 1039596

Country of ref document: EP

Representative=s name: KLUNKER, SCHMITT-NILSON, HIRSCH, 80796 MUENCHEN, D