GB2300375B - Bonding method for electric element - Google Patents

Bonding method for electric element

Info

Publication number
GB2300375B
GB2300375B GB9610304A GB9610304A GB2300375B GB 2300375 B GB2300375 B GB 2300375B GB 9610304 A GB9610304 A GB 9610304A GB 9610304 A GB9610304 A GB 9610304A GB 2300375 B GB2300375 B GB 2300375B
Authority
GB
United Kingdom
Prior art keywords
bonding method
electric element
electric
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9610304A
Other versions
GB2300375A (en
GB9610304D0 (en
Inventor
Yuji Kimura
Kinya Atsumi
Katsunori Abe
Noriyuki Matsushita
Michiyo Mizutani
Tetsuo Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14017595A external-priority patent/JP3271475B2/en
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of GB9610304D0 publication Critical patent/GB9610304D0/en
Publication of GB2300375A publication Critical patent/GB2300375A/en
Application granted granted Critical
Publication of GB2300375B publication Critical patent/GB2300375B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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GB9610304A 1994-08-01 1995-07-31 Bonding method for electric element Expired - Lifetime GB2300375B (en)

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Application Number Priority Date Filing Date Title
JP17993594 1994-08-01
JP26471994 1994-10-28
JP14017595A JP3271475B2 (en) 1994-08-01 1995-06-07 Electrical element joining material and joining method
GB9515696A GB2291886B (en) 1994-08-01 1995-07-31 Bonding material for electric element.

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GB2300375B true GB2300375B (en) 1998-02-25

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JP4104032B2 (en) * 1999-03-19 2008-06-18 富士フイルム株式会社 Semiconductor light emitting device and manufacturing method thereof
DE602004010061T2 (en) * 2004-03-09 2008-09-11 Infineon Technologies Ag High reliability, low cost and thermally enhanced semiconductor chip mounting technology with AuSn
US7126079B2 (en) * 2004-11-05 2006-10-24 General Electric Company Method for repairing a hole in a metallic workpiece
DE102008021167B3 (en) 2008-04-28 2010-01-21 Siemens Aktiengesellschaft Method for producing a hermetically sealed, electrical feedthrough by means of exothermic nanofoil and device produced therewith
EP2654075B1 (en) * 2010-03-31 2016-09-28 EV Group E. Thallner GmbH Method for permanently connecting two metal surfaces
DE102017104276B4 (en) * 2017-03-01 2020-01-16 Osram Opto Semiconductors Gmbh Method for fastening a semiconductor chip on a lead frame and electronic component
KR102544296B1 (en) * 2018-09-13 2023-06-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 A VERTICAL-CAVITY SURFACE-EMITTING LASER DEVICE and APPARATUS HAVING THE SAME
CN114284857B (en) * 2021-11-25 2023-11-17 佛山华智新材料有限公司 Method for integrating secondary heat sink and liquid cooling heat sink, integrated heat sink and application

Citations (3)

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Publication number Priority date Publication date Assignee Title
GB1297467A (en) * 1970-07-02 1972-11-22
GB1548755A (en) * 1975-04-05 1979-07-18 Semikron Gleichrichterbau Semicondutor device
GB2049522A (en) * 1979-04-04 1980-12-31 Elliott Brothers London Ltd Process for bonding germanium to metal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1297467A (en) * 1970-07-02 1972-11-22
GB1548755A (en) * 1975-04-05 1979-07-18 Semikron Gleichrichterbau Semicondutor device
GB2049522A (en) * 1979-04-04 1980-12-31 Elliott Brothers London Ltd Process for bonding germanium to metal

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