GB9610304D0 - Bonding material and bonding method for electric element - Google Patents

Bonding material and bonding method for electric element

Info

Publication number
GB9610304D0
GB9610304D0 GB9610304A GB9610304A GB9610304D0 GB 9610304 D0 GB9610304 D0 GB 9610304D0 GB 9610304 A GB9610304 A GB 9610304A GB 9610304 A GB9610304 A GB 9610304A GB 9610304 D0 GB9610304 D0 GB 9610304D0
Authority
GB
United Kingdom
Prior art keywords
bonding
electric element
bonding material
bonding method
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9610304A
Other versions
GB2300375A (en
GB2300375B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14017595A external-priority patent/JP3271475B2/en
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of GB9610304D0 publication Critical patent/GB9610304D0/en
Publication of GB2300375A publication Critical patent/GB2300375A/en
Application granted granted Critical
Publication of GB2300375B publication Critical patent/GB2300375B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
GB9610304A 1994-08-01 1995-07-31 Bonding method for electric element Expired - Lifetime GB2300375B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP17993594 1994-08-01
JP26471994 1994-10-28
JP14017595A JP3271475B2 (en) 1994-08-01 1995-06-07 Electrical element joining material and joining method
GB9515696A GB2291886B (en) 1994-08-01 1995-07-31 Bonding material for electric element.

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GB9610304D0 true GB9610304D0 (en) 1996-07-24
GB2300375A GB2300375A (en) 1996-11-06
GB2300375B GB2300375B (en) 1998-02-25

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN110352502A (en) * 2017-03-01 2019-10-18 欧司朗光电半导体有限公司 Method and electronic device for being fixed on semiconductor chip on lead frame
CN114284857A (en) * 2021-11-25 2022-04-05 佛山华智新材料有限公司 Secondary heat sink and liquid cooling heat sink integration method, integrated heat sink and application

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JP4104032B2 (en) * 1999-03-19 2008-06-18 富士フイルム株式会社 Semiconductor light emitting device and manufacturing method thereof
DE602004010061T2 (en) 2004-03-09 2008-09-11 Infineon Technologies Ag High reliability, low cost and thermally enhanced semiconductor chip mounting technology with AuSn
US7126079B2 (en) * 2004-11-05 2006-10-24 General Electric Company Method for repairing a hole in a metallic workpiece
DE102008021167B3 (en) 2008-04-28 2010-01-21 Siemens Aktiengesellschaft Method for producing a hermetically sealed, electrical feedthrough by means of exothermic nanofoil and device produced therewith
EP2372755B1 (en) * 2010-03-31 2013-03-20 EV Group E. Thallner GmbH Method for permanently connecting two metal surfaces
KR102544296B1 (en) * 2018-09-13 2023-06-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 A VERTICAL-CAVITY SURFACE-EMITTING LASER DEVICE and APPARATUS HAVING THE SAME

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Publication number Priority date Publication date Assignee Title
DE2032872B2 (en) * 1970-07-02 1975-03-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the production of soft solderable contacts for the installation of semiconductor components in housings
DE2514922C2 (en) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor component resistant to alternating thermal loads
GB2049522B (en) * 1979-04-04 1983-04-27 Elliott Brothers London Ltd Process for bonding germanium to metal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110352502A (en) * 2017-03-01 2019-10-18 欧司朗光电半导体有限公司 Method and electronic device for being fixed on semiconductor chip on lead frame
CN110352502B (en) * 2017-03-01 2022-11-25 欧司朗光电半导体有限公司 Method for fixing semiconductor chip on lead frame and electronic device
CN114284857A (en) * 2021-11-25 2022-04-05 佛山华智新材料有限公司 Secondary heat sink and liquid cooling heat sink integration method, integrated heat sink and application
CN114284857B (en) * 2021-11-25 2023-11-17 佛山华智新材料有限公司 Method for integrating secondary heat sink and liquid cooling heat sink, integrated heat sink and application

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