DE60027113T2 - Optische Prüfvorrichtung - Google Patents

Optische Prüfvorrichtung Download PDF

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Publication number
DE60027113T2
DE60027113T2 DE60027113T DE60027113T DE60027113T2 DE 60027113 T2 DE60027113 T2 DE 60027113T2 DE 60027113 T DE60027113 T DE 60027113T DE 60027113 T DE60027113 T DE 60027113T DE 60027113 T2 DE60027113 T2 DE 60027113T2
Authority
DE
Germany
Prior art keywords
images
image
wavelength
monochrome
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60027113T
Other languages
German (de)
English (en)
Other versions
DE60027113D1 (de
Inventor
Eiji Okazaki-shi Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidek Co Ltd
Original Assignee
Nidek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidek Co Ltd filed Critical Nidek Co Ltd
Publication of DE60027113D1 publication Critical patent/DE60027113D1/de
Application granted granted Critical
Publication of DE60027113T2 publication Critical patent/DE60027113T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8809—Adjustment for highlighting flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE60027113T 1999-11-30 2000-11-29 Optische Prüfvorrichtung Expired - Fee Related DE60027113T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34024199 1999-11-30
JP34024199A JP2001153621A (ja) 1999-11-30 1999-11-30 外観検査装置

Publications (2)

Publication Number Publication Date
DE60027113D1 DE60027113D1 (de) 2006-05-18
DE60027113T2 true DE60027113T2 (de) 2006-09-07

Family

ID=18335057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027113T Expired - Fee Related DE60027113T2 (de) 1999-11-30 2000-11-29 Optische Prüfvorrichtung

Country Status (4)

Country Link
US (1) US6801651B2 (https=)
EP (1) EP1107012B1 (https=)
JP (1) JP2001153621A (https=)
DE (1) DE60027113T2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10157244B4 (de) * 2001-11-22 2006-05-04 Leica Microsystems Semiconductor Gmbh Verfahren und Vorrichtung zur Defektanalyse von Wafern
DE10330003B4 (de) * 2003-07-03 2007-03-08 Leica Microsystems Semiconductor Gmbh Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion
ATE407369T1 (de) * 2004-12-29 2008-09-15 Emedstream S R L Verfahren und system zur verarbeitung digitaler ultraschall-bildsequenzen
US8180148B2 (en) 2005-01-26 2012-05-15 Vu Medisch Centrum Imaging apparatus and method of forming composite image from a plurality of source images
JP4984953B2 (ja) * 2007-02-22 2012-07-25 株式会社明電舎 画像処理装置
KR100902170B1 (ko) * 2008-05-19 2009-06-10 (주)펨트론 표면형상 측정장치
KR101531709B1 (ko) 2008-10-17 2015-07-06 삼성전자 주식회사 고감도 컬러 영상을 제공하기 위한 영상 처리 장치 및 방법
JP2011226947A (ja) * 2010-04-21 2011-11-10 Graduate School For The Creation Of New Photonics Industries 分光イメージング装置及び分光イメージング方法
CN102566327B (zh) * 2010-12-08 2016-06-08 无锡华润上华科技有限公司 显影均匀性调试方法
US9939386B2 (en) * 2012-04-12 2018-04-10 KLA—Tencor Corporation Systems and methods for sample inspection and review
CN103900973B (zh) * 2014-04-24 2017-01-04 黄晓鹏 危险品检测方法
US10533952B2 (en) * 2014-12-08 2020-01-14 Koh Young Technology Inc. Method of inspecting a terminal of a component mounted on a substrate and substrate inspection apparatus
JP6834174B2 (ja) * 2016-05-13 2021-02-24 株式会社ジェイテクト 外観検査方法および外観検査装置
JP6859627B2 (ja) * 2016-08-09 2021-04-14 株式会社ジェイテクト 外観検査装置
JP6859628B2 (ja) 2016-08-10 2021-04-14 株式会社ジェイテクト 外観検査方法および外観検査装置
WO2018047239A1 (ja) * 2016-09-06 2018-03-15 オリンパス株式会社 観察装置
CN107340294A (zh) * 2016-12-24 2017-11-10 重庆都英科技有限公司 一种电机换向器自动化视觉检测系统
JP7005392B2 (ja) * 2017-03-14 2022-01-21 株式会社トプコン 涙液層厚み測定装置及び方法
JP7068869B2 (ja) * 2017-03-14 2022-05-17 株式会社トプコン 涙液層厚み測定装置及び方法
US11475636B2 (en) * 2017-10-31 2022-10-18 Vmware, Inc. Augmented reality and virtual reality engine for virtual desktop infrastucture
US10621768B2 (en) 2018-01-09 2020-04-14 Vmware, Inc. Augmented reality and virtual reality engine at the object level for virtual desktop infrastucture
JP7132046B2 (ja) * 2018-09-13 2022-09-06 株式会社東芝 検索装置、検索方法及びプログラム
JP7315282B2 (ja) * 2019-07-02 2023-07-26 第一実業ビスウィル株式会社 外観検査装置
US12051188B2 (en) * 2019-07-26 2024-07-30 Fuji Corporation Substrate work system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071776B2 (ja) * 1983-11-25 1995-01-11 株式会社日立製作所 パターン検査装置
JPS6244609A (ja) * 1985-08-23 1987-02-26 Hitachi Ltd 検査方法
DE3751233T2 (de) * 1986-10-31 1995-08-24 Seiko Epson Corp Anzeigevorrichtung vom Projektionstyp.
JPH0499346A (ja) * 1990-08-17 1992-03-31 Nec Corp ウェーハ外観検査装置
JPH06167460A (ja) * 1992-05-29 1994-06-14 Omron Corp 検査装置
US5923430A (en) * 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
WO1995020811A1 (en) * 1994-01-31 1995-08-03 Sdl, Inc. Laser illuminated display system
JPH08102957A (ja) * 1994-09-30 1996-04-16 Hitachi Denshi Ltd 電子内視鏡装置
US5726443A (en) * 1996-01-18 1998-03-10 Chapman Glenn H Vision system and proximity detector
JP3657345B2 (ja) * 1996-04-25 2005-06-08 オリンパス株式会社 膜厚検査装置
JPH1183455A (ja) 1997-09-04 1999-03-26 Dainippon Printing Co Ltd 外観検査装置
EP0930498A3 (en) * 1997-12-26 1999-11-17 Nidek Co., Ltd. Inspection apparatus and method for detecting defects
JP2001343336A (ja) * 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置

Also Published As

Publication number Publication date
US20010012393A1 (en) 2001-08-09
EP1107012A1 (en) 2001-06-13
US6801651B2 (en) 2004-10-05
DE60027113D1 (de) 2006-05-18
JP2001153621A (ja) 2001-06-08
EP1107012B1 (en) 2006-04-05

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee