DE60019624D1 - Methode zur behandlung von gehärteten epoxydharzprodukten - Google Patents

Methode zur behandlung von gehärteten epoxydharzprodukten

Info

Publication number
DE60019624D1
DE60019624D1 DE60019624T DE60019624T DE60019624D1 DE 60019624 D1 DE60019624 D1 DE 60019624D1 DE 60019624 T DE60019624 T DE 60019624T DE 60019624 T DE60019624 T DE 60019624T DE 60019624 D1 DE60019624 D1 DE 60019624D1
Authority
DE
Germany
Prior art keywords
epoxy resin
cured product
inorganic matter
treatment
resin products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60019624T
Other languages
English (en)
Other versions
DE60019624T2 (de
Inventor
Katsuji Shibata
Hiroshi Shimizu
Ayako Matsuo
Takeshi Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE60019624D1 publication Critical patent/DE60019624D1/de
Publication of DE60019624T2 publication Critical patent/DE60019624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/10—Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation
    • C08J11/16—Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/10—Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing Of Solid Wastes (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
DE2000619624 1999-10-07 2000-10-05 Methode zur behandlung von gehärteten epoxydharzprodukten Expired - Lifetime DE60019624T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP28618799 1999-10-07
JP28618799 1999-10-07
JP28618899 1999-10-07
JP28618899 1999-10-07
PCT/JP2000/006951 WO2001025317A2 (en) 1999-10-07 2000-10-05 Method of treating epoxy resin-cured product

Publications (2)

Publication Number Publication Date
DE60019624D1 true DE60019624D1 (de) 2005-05-25
DE60019624T2 DE60019624T2 (de) 2006-03-09

Family

ID=26556200

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2000619624 Expired - Lifetime DE60019624T2 (de) 1999-10-07 2000-10-05 Methode zur behandlung von gehärteten epoxydharzprodukten

Country Status (9)

Country Link
US (1) US6962628B1 (de)
EP (1) EP1220876B1 (de)
KR (1) KR100468802B1 (de)
CN (1) CN1185286C (de)
AT (1) ATE293653T1 (de)
DE (1) DE60019624T2 (de)
ES (1) ES2239038T3 (de)
TW (1) TWI284572B (de)
WO (1) WO2001025317A2 (de)

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FR2849854B1 (fr) * 2003-01-09 2006-12-15 Electricite De France Procede de valorisation de dechets de materiaux a base de resine epoxyde.
KR20040098179A (ko) * 2003-05-14 2004-11-20 리퀴드테크놀로지(주) 감광성 내식각막의 잔사제거 조성물
US20050066995A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Non-hermetic encapsulant removal for module rework
JP4945347B2 (ja) * 2007-07-13 2012-06-06 株式会社日立産機システム 電気機器のリサイクル方法
CN101891902B (zh) * 2010-07-23 2012-05-23 浙江理工大学 一种废旧环氧树脂的回收方法
CN101928406B (zh) * 2010-09-02 2012-10-03 中国科学院宁波材料技术与工程研究所 一种催化分解碳纤维增强热固性环氧树脂复合材料的方法
CN102218439A (zh) * 2011-01-24 2011-10-19 同济大学 一种废弃印刷线路板基板热解分离有价组分的方法
US10752748B2 (en) * 2011-07-08 2020-08-25 Adesso Advanced Materials Wuhu Co., Ltd. Methods for recycling reinforced composites
CN102343355A (zh) * 2011-07-26 2012-02-08 广东联塑科技实业有限公司 一种涂塑、衬塑不良品处理的生产工艺
CN102391711B (zh) * 2011-09-13 2013-06-19 天津德高化成电子材料有限公司 一种环氧树脂和硅树脂固化涂层和封装的脱除剂
CN102617885B (zh) * 2012-03-28 2014-08-13 四川大学 用溶剂回收废旧热固性树脂及其复合材料的方法
CN102699011B (zh) * 2012-06-21 2014-10-01 上海大学 用二甲基亚砜处理废旧线路板的方法
CN103242509B (zh) * 2013-04-18 2015-06-10 艾达索高新材料无锡有限公司 可降解环缩醛、环缩酮二胺类环氧树脂固化剂及其应用
US9784072B2 (en) 2013-08-30 2017-10-10 Halliburton Energy Services, Inc. Removing cured resins from subterranean formations and completions
US9944890B2 (en) 2013-11-11 2018-04-17 Halliburton Energy Services, Inc. Removing resin coatings from wellbore surfaces
US20150321936A1 (en) * 2014-05-08 2015-11-12 Avantech, Inc. Method for resin, solids, and sludge solidification, stabilization, and reduction of disposal volume
US20170096540A1 (en) * 2015-10-06 2017-04-06 Korea Institute Of Science And Technology Method and composition for swelling pretreatment before decomposition of cured theremosetting resin materials
JP6687030B2 (ja) 2016-03-08 2020-04-22 日立化成株式会社 無機材料の分離方法、再生材料の製造方法、及び有機物の除去方法
CN108779284A (zh) * 2016-03-08 2018-11-09 日立化成株式会社 热固性树脂固化物的分解产物的回收方法以及再生材料的制造方法
US20190023868A1 (en) * 2016-03-08 2019-01-24 Hitachi Chemical Company, Ltd. Method of treating thermosetting resin cured product
KR102109653B1 (ko) * 2016-07-27 2020-05-13 한국기계연구원 섬유보강 복합재의 재활용을 위한 화학분해 가능한 열경화성 수지 조성물 및 이의 용해방법
CN109365487B (zh) * 2018-11-30 2020-07-07 清远市进田企业有限公司 一种废旧电路板中环氧涂层的高效节能清洗工艺
CN109852307A (zh) * 2018-12-19 2019-06-07 无锡嘉联电子材料有限公司 一种废环氧灌封料回收再利用的方法
TWI744750B (zh) 2019-12-23 2021-11-01 財團法人工業技術研究院 熱固型樹脂的降解方法、所使用的觸媒組合物及所得的樹脂組成物
CN111171373A (zh) * 2020-03-09 2020-05-19 艾达索高新材料芜湖有限公司 一种纤维增强复合材料的回收方法
CN114534734B (zh) * 2020-11-27 2024-02-27 万华化学集团股份有限公司 一种用于丙酮气相法合成3,5-二甲基苯酚的固体碱催化剂及制备方法和应用
CN113522885B (zh) * 2021-07-09 2023-05-09 东莞理工学院 一种近临界流体处理废弃印刷线路板的方法
CN114290472B (zh) * 2021-12-03 2023-02-03 西南林业大学 一种从木质人造板中回收脲胶树脂和原料的方法及应用
CN115232633B (zh) * 2022-08-18 2024-04-12 华北电力大学 一种废弃工程塑料热解联产酚类化学品和超级电容炭材料的方法

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US3551204A (en) * 1967-08-08 1970-12-29 Amicon Corp Process and composition for recovering electronic devices from encapsulation in potting compounds
US3625763A (en) * 1968-12-04 1971-12-07 Bunker Ramo Conformal coating stripping method and composition
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US3770528A (en) * 1971-09-29 1973-11-06 Martin Processing Co Inc Method for the surface treatment of polyimide materials
US4089704A (en) * 1976-12-27 1978-05-16 Bell Telephone Laboratories, Incorporated Removal of RTV silicon rubber encapsulants
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4316322A (en) * 1979-10-25 1982-02-23 Burroughs Corporation Method of fabricating electrical contacts in a printed circuit board
US4278557A (en) * 1980-04-15 1981-07-14 The United States Of America As Represented By The Secretary Of The Air Force Solvent mixture for dissolving and removing epoxy resinous compounds
US4428871A (en) * 1981-09-23 1984-01-31 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4741784A (en) * 1984-11-26 1988-05-03 Kote-Off, Inc. Composition and method for removing conformal coatings
US5536439A (en) * 1995-03-13 1996-07-16 Gage Products Company Non-abrasive line cleaning composition
JP3286115B2 (ja) * 1995-06-01 2002-05-27 日立化成工業株式会社 エポキシ樹脂硬化物のエッチング液
JP3286116B2 (ja) 1995-06-01 2002-05-27 日立化成工業株式会社 エポキシ樹脂硬化物のエッチング液
JPH08325439A (ja) 1995-06-01 1996-12-10 Nitto Boseki Co Ltd ガラス繊維強化エポキシ樹脂成形品製造用シランカッ プリング剤
JP3286117B2 (ja) 1995-06-01 2002-05-27 日立化成工業株式会社 エポキシ樹脂硬化物のエッチング液
JPH09316445A (ja) 1996-05-31 1997-12-09 Hitachi Chem Co Ltd エポキシ樹脂硬化物のエッチング液
JP4062554B2 (ja) 1996-10-18 2008-03-19 日立化成工業株式会社 エポキシ樹脂硬化物のエッチング液
JP3544834B2 (ja) 1997-03-17 2004-07-21 株式会社東芝 混合廃棄物の処理装置
JPH10314716A (ja) 1997-05-14 1998-12-02 Hakusui Sangyo:Kk 汚水浄化装置及び汚水浄化システム
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JP3994660B2 (ja) * 2000-12-22 2007-10-24 日立化成工業株式会社 不飽和ポリエステル樹脂硬化物用分解処理液、該処理液を用いた不飽和ポリエステル樹脂硬化物の処理方法及び複合材料の分離方法

Also Published As

Publication number Publication date
CN1434838A (zh) 2003-08-06
DE60019624T2 (de) 2006-03-09
US6962628B1 (en) 2005-11-08
KR20020085880A (ko) 2002-11-16
CN1185286C (zh) 2005-01-19
ATE293653T1 (de) 2005-05-15
TWI284572B (en) 2007-08-01
WO2001025317A3 (en) 2002-05-02
EP1220876B1 (de) 2005-04-20
ES2239038T3 (es) 2005-09-16
WO2001025317A2 (en) 2001-04-12
EP1220876A2 (de) 2002-07-10
KR100468802B1 (ko) 2005-02-02

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