DE60017040D1 - Sn-Ag-Cu Lot und dessen Anwendung zur Oberfläschebehandlung und Bestückung von Bauteilen - Google Patents

Sn-Ag-Cu Lot und dessen Anwendung zur Oberfläschebehandlung und Bestückung von Bauteilen

Info

Publication number
DE60017040D1
DE60017040D1 DE60017040T DE60017040T DE60017040D1 DE 60017040 D1 DE60017040 D1 DE 60017040D1 DE 60017040 T DE60017040 T DE 60017040T DE 60017040 T DE60017040 T DE 60017040T DE 60017040 D1 DE60017040 D1 DE 60017040D1
Authority
DE
Germany
Prior art keywords
solder
assembly
components
application
surface treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60017040T
Other languages
English (en)
Other versions
DE60017040T2 (de
Inventor
Toshihide Ito
Shiro Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Circuit Solutions Inc
Solder Coat Co Ltd
Original Assignee
Solder Coat Co Ltd
NEC Toppan Circuit Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solder Coat Co Ltd, NEC Toppan Circuit Solutions Inc filed Critical Solder Coat Co Ltd
Application granted granted Critical
Publication of DE60017040D1 publication Critical patent/DE60017040D1/de
Publication of DE60017040T2 publication Critical patent/DE60017040T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
DE60017040T 1999-09-29 2000-09-29 Sn-Ag-Cu Lot und dessen Anwendung zur Oberfläschebehandlung und Bestückung von Bauteilen Expired - Lifetime DE60017040T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27579799A JP3544904B2 (ja) 1999-09-29 1999-09-29 はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP27579799 1999-09-29

Publications (2)

Publication Number Publication Date
DE60017040D1 true DE60017040D1 (de) 2005-02-03
DE60017040T2 DE60017040T2 (de) 2005-12-22

Family

ID=17560557

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60017040T Expired - Lifetime DE60017040T2 (de) 1999-09-29 2000-09-29 Sn-Ag-Cu Lot und dessen Anwendung zur Oberfläschebehandlung und Bestückung von Bauteilen

Country Status (5)

Country Link
US (1) US20020159913A1 (de)
EP (1) EP1088615B1 (de)
JP (1) JP3544904B2 (de)
DE (1) DE60017040T2 (de)
TW (1) TW476792B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3786251B2 (ja) * 2000-06-30 2006-06-14 日本アルミット株式会社 無鉛半田合金
JP4673552B2 (ja) * 2001-08-30 2011-04-20 スミダコーポレーション株式会社 コイル部品
US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
JP4143478B2 (ja) * 2002-10-02 2008-09-03 アルプス電気株式会社 はんだ接続構造および電子部品のはんだ接続方法
JP5182258B2 (ja) * 2003-12-01 2013-04-17 千住金属工業株式会社 はんだ合金と電子機器用モジュール部品
CN100500360C (zh) * 2004-08-10 2009-06-17 旭硝子株式会社 车辆用窗玻璃
KR20050030237A (ko) * 2004-11-13 2005-03-29 삼성전자주식회사 무연 솔더 합금
US20070018308A1 (en) * 2005-04-27 2007-01-25 Albert Schott Electronic component and electronic configuration
FR2888253B1 (fr) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa Alliage d'assemblage sans plomb, a base d'etain et dont l'oxydation a l'air est retardee et utilisation d'un tel alliage.
US20070023910A1 (en) * 2005-07-29 2007-02-01 Texas Instruments Incorporated Dual BGA alloy structure for improved board-level reliability performance
US8641964B2 (en) 2005-08-24 2014-02-04 Fry's Metals, Inc. Solder alloy
EP1924394A2 (de) * 2005-08-24 2008-05-28 FRY'S METALS, INC. d/b/a ALPHA METALS, INC. Lötlegierung
US20070117475A1 (en) * 2005-11-23 2007-05-24 Regents Of The University Of California Prevention of Sn whisker growth for high reliability electronic devices
WO2007081775A2 (en) * 2006-01-10 2007-07-19 Illinois Tool Works Inc. Lead-free solder with low copper dissolution
WO2007081006A1 (ja) * 2006-01-16 2007-07-19 Hitachi Metals, Ltd. はんだ合金、はんだボールおよびそれを用いたはんだ接合部
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
US8562906B2 (en) 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
WO2007102589A1 (ja) * 2006-03-09 2007-09-13 Nippon Steel Materials Co., Ltd. 鉛フリーハンダ合金、ハンダボール及び電子部材と、自動車搭載電子部材用鉛フリーハンダ合金、ハンダボール及び電子部材
JP5030442B2 (ja) * 2006-03-09 2012-09-19 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
CA2666363C (en) * 2006-10-17 2018-04-24 Fry's Metals, Inc. Materials for use with interconnects of electrical devices and related methods
JP4683015B2 (ja) * 2007-07-04 2011-05-11 セイコーエプソン株式会社 鉛フリーはんだ合金
US8975757B2 (en) * 2008-03-05 2015-03-10 Senju Metal Industry Co., Ltd. Lead-free solder connection structure and solder ball
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
WO2012131861A1 (ja) 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
KR20130124516A (ko) 2012-04-09 2013-11-14 센주긴조쿠고교 가부시키가이샤 땜납 합금
BR112014032941A2 (pt) * 2012-06-30 2017-06-27 Senju Metal Industry Co bola de solda sem chumbo
CN102974954B (zh) * 2012-12-17 2015-03-11 南京航空航天大学 含Fe和Pr的Sn-Cu-Ni无铅钎料
CN105290637A (zh) * 2015-11-30 2016-02-03 苏州龙腾万里化工科技有限公司 一种加银焊锡条

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234295A (ja) * 1988-07-19 1990-02-05 Jw Harris Co Inc ソルダーコンポジション及びその使用方法
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
JPH08215880A (ja) * 1995-02-14 1996-08-27 Ishikawa Kinzoku Kk 無鉛はんだ
WO1997012719A1 (fr) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Soudure sans plomb
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3296289B2 (ja) * 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JP3575311B2 (ja) * 1998-01-28 2004-10-13 株式会社村田製作所 Ｐｂフリー半田および半田付け物品
JP3684811B2 (ja) * 1998-01-28 2005-08-17 株式会社村田製作所 半田および半田付け物品
MY116246A (en) * 1999-01-28 2003-12-31 Murata Manufacturing Co Lead-free solder and soldered article
US6505763B2 (en) * 2000-08-02 2003-01-14 Meliga Habillement Horloger Sa Circumferentially continuous arrangement which is to be worn preferably on the wrist and has a hinged closure

Also Published As

Publication number Publication date
TW476792B (en) 2002-02-21
EP1088615A3 (de) 2002-05-02
EP1088615A2 (de) 2001-04-04
US20020159913A1 (en) 2002-10-31
JP2001096394A (ja) 2001-04-10
DE60017040T2 (de) 2005-12-22
JP3544904B2 (ja) 2004-07-21
EP1088615B1 (de) 2004-12-29

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