DE60012764D1 - Polyamidsäureester - Google Patents

Polyamidsäureester

Info

Publication number
DE60012764D1
DE60012764D1 DE60012764T DE60012764T DE60012764D1 DE 60012764 D1 DE60012764 D1 DE 60012764D1 DE 60012764 T DE60012764 T DE 60012764T DE 60012764 T DE60012764 T DE 60012764T DE 60012764 D1 DE60012764 D1 DE 60012764D1
Authority
DE
Germany
Prior art keywords
polyamidsäureester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60012764T
Other languages
English (en)
Other versions
DE60012764T2 (de
Inventor
Keiko Hata
Yoko Tanizaki
Yoshio Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Chemicals Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Kasei Chemicals Corp
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp, Asahi Chemical Industry Co Ltd filed Critical Asahi Kasei Chemicals Corp
Publication of DE60012764D1 publication Critical patent/DE60012764D1/de
Application granted granted Critical
Publication of DE60012764T2 publication Critical patent/DE60012764T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
DE60012764T 1999-01-21 2000-01-21 Polyamidsäureester Expired - Lifetime DE60012764T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1341999 1999-01-21
JP1341999 1999-01-21
PCT/JP2000/000302 WO2000043439A1 (fr) 1999-01-21 2000-01-21 Ester d'acide polyamique

Publications (2)

Publication Number Publication Date
DE60012764D1 true DE60012764D1 (de) 2004-09-09
DE60012764T2 DE60012764T2 (de) 2005-08-25

Family

ID=11832623

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012764T Expired - Lifetime DE60012764T2 (de) 1999-01-21 2000-01-21 Polyamidsäureester

Country Status (6)

Country Link
US (1) US6610815B1 (de)
EP (1) EP1219662B1 (de)
JP (1) JP3526829B2 (de)
KR (1) KR100427832B1 (de)
DE (1) DE60012764T2 (de)
WO (1) WO2000043439A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940522B2 (ja) * 2001-09-10 2012-05-30 住友化学株式会社 全芳香族ポリイミドエステル及びその製造方法
KR100552990B1 (ko) * 2004-02-12 2006-02-17 한국화학연구원 전유기 박막트랜지스터 절연체용 저온경화형 감광성폴리이미드 수지
US20050275701A1 (en) * 2004-06-14 2005-12-15 Brother Kogyo Kabushiki Kaisha Water base ink for ink-jet recording
TWI322928B (en) * 2006-10-30 2010-04-01 Eternal Chemical Co Ltd Negative photosensitive polyimide polymer and uses thereof
WO2008123583A1 (ja) * 2007-04-04 2008-10-16 Asahi Kasei Emd Corporation 感光性ポリアミド酸エステル組成物
TWI477894B (zh) * 2007-04-24 2015-03-21 Mitsui Chemicals Inc 感光性樹脂組成物、乾膜、以及其加工品
KR101128207B1 (ko) * 2007-04-24 2012-03-23 미쓰이 가가쿠 가부시키가이샤 감광성 수지 조성물, 드라이 필름 및 그것을 이용한 가공품
JP5424234B2 (ja) * 2008-12-02 2014-02-26 日立金属株式会社 絶縁電線
JP2010189510A (ja) * 2009-02-17 2010-09-02 Hitachi Cable Ltd 絶縁塗料及び絶縁電線
JP5871775B2 (ja) * 2011-11-30 2016-03-01 キヤノン株式会社 電子写真感光体、プロセスカートリッジおよび電子写真装置
KR102174075B1 (ko) * 2012-12-21 2020-11-04 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체 수지 조성물
KR102214856B1 (ko) 2012-12-21 2021-02-09 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치
JP6164070B2 (ja) * 2013-12-04 2017-07-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
JP2015156460A (ja) * 2014-02-21 2015-08-27 東京エレクトロン株式会社 重合膜の成膜方法および成膜装置
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
CN104592756B (zh) * 2015-02-10 2017-03-01 中国电子科技集团公司第四十九研究所 一种聚酰亚胺湿敏材料及其制备方法
CN108369324B (zh) * 2015-12-01 2021-06-18 古河电气工业株式会社 光纤带芯线和光纤线缆
TWI634135B (zh) * 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件
CN107850844B (zh) 2016-03-31 2021-09-07 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
JP7366521B2 (ja) 2017-03-22 2023-10-23 旭化成株式会社 半導体装置、及びその製造方法
KR102399855B1 (ko) 2017-06-23 2022-05-19 삼성전자주식회사 폴리이미드 또는 폴리(이미드-아미드) 코폴리머 제조용 조성물, 폴리이미드 또는 폴리(이미드-아미드) 코폴리머, 폴리이미드 또는 폴리(이미드-아미드) 코폴리머를 포함하는 성형품, 상기 성형품을 포함하는 표시 장치
JP7156786B2 (ja) * 2017-10-04 2022-10-19 旭化成株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JPWO2022162895A1 (de) * 2021-01-29 2022-08-04

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
US4590258A (en) 1983-12-30 1986-05-20 International Business Machines Corporation Polyamic acid copolymer system for improved semiconductor manufacturing
US4551522A (en) 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
NL8601041A (nl) 1986-04-23 1987-11-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd met de werkwijze.
JPH0646302B2 (ja) 1987-06-22 1994-06-15 株式会社日立製作所 耐熱感光性重合体組成物
US4954578A (en) 1988-10-25 1990-09-04 International Business Machines Corporation Fine domain composite films of polyimide mixtures
US5310862A (en) * 1991-08-20 1994-05-10 Toray Industries, Inc. Photosensitive polyimide precursor compositions and process for preparing same
US5472823A (en) * 1992-01-20 1995-12-05 Hitachi Chemical Co., Ltd. Photosensitive resin composition
EP0718696B1 (de) * 1992-07-22 2002-01-16 Asahi Kasei Kabushiki Kaisha Photoempfindliche Polyimidvorlaüferzusammensetzung
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
JP3509612B2 (ja) * 1998-05-29 2004-03-22 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品

Also Published As

Publication number Publication date
EP1219662B1 (de) 2004-08-04
KR20010101365A (ko) 2001-11-14
KR100427832B1 (ko) 2004-04-28
DE60012764T2 (de) 2005-08-25
JP3526829B2 (ja) 2004-05-17
WO2000043439A1 (fr) 2000-07-27
US6610815B1 (en) 2003-08-26
EP1219662A1 (de) 2002-07-03
EP1219662A4 (de) 2002-09-18

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