DE4327950A1 - Leitungsstruktur eines Halbleiter-Bauteil - Google Patents

Leitungsstruktur eines Halbleiter-Bauteil

Info

Publication number
DE4327950A1
DE4327950A1 DE4327950A DE4327950A DE4327950A1 DE 4327950 A1 DE4327950 A1 DE 4327950A1 DE 4327950 A DE4327950 A DE 4327950A DE 4327950 A DE4327950 A DE 4327950A DE 4327950 A1 DE4327950 A1 DE 4327950A1
Authority
DE
Germany
Prior art keywords
line
housing
semiconductor
guide hole
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4327950A
Other languages
German (de)
English (en)
Inventor
Yukiyasu Miyazaki
Nobuyoshi Sugitani
Yoshiaki Shimojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Toyoda Jidoshokki Seisakusho KK
Toyoda Automatic Loom Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp, Toyoda Jidoshokki Seisakusho KK, Toyoda Automatic Loom Works Ltd filed Critical Toyota Motor Corp
Publication of DE4327950A1 publication Critical patent/DE4327950A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE4327950A 1992-08-20 1993-08-19 Leitungsstruktur eines Halbleiter-Bauteil Withdrawn DE4327950A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4221825A JP2988603B2 (ja) 1992-08-20 1992-08-20 半導体パッケージ

Publications (1)

Publication Number Publication Date
DE4327950A1 true DE4327950A1 (de) 1994-03-03

Family

ID=16772783

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4327950A Withdrawn DE4327950A1 (de) 1992-08-20 1993-08-19 Leitungsstruktur eines Halbleiter-Bauteil

Country Status (5)

Country Link
US (1) US5442134A (enExample)
JP (1) JP2988603B2 (enExample)
KR (1) KR970005720B1 (enExample)
DE (1) DE4327950A1 (enExample)
TW (1) TW244400B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0814643A3 (en) * 1996-06-19 1999-04-14 Ibiden Co, Ltd. Multilayer printed circuit board
EP0823833A3 (en) * 1996-08-05 1999-04-14 Ibiden Co, Ltd. Multilayer printed circuit boards

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW357332B (en) * 1997-03-12 1999-05-01 Seiko Epson Corp Electronic parts module and the electronic machine
KR100410946B1 (ko) * 2001-05-16 2003-12-18 삼성전기주식회사 이미지 센서 모듈 및 그 제조 방법
US7974223B2 (en) * 2004-11-19 2011-07-05 Corrigent Systems Ltd. Virtual private LAN service over ring networks
KR100675007B1 (ko) * 2006-01-27 2007-01-29 삼성전자주식회사 소켓을 사용하지 않는 평판형 반도체 모듈

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2244656B2 (de) * 1972-09-12 1977-05-18 Fischer, Artur, Dr.h.c, 7244 Waldachtal Kontaktbuchse fuer die bestueckung von schaltplatten, elektronikbausteinen und dergleichen fuer versuchs- und experimentierschaltungen
US4420877A (en) * 1981-03-19 1983-12-20 Mckenzie Jr Joseph A Self-masking socket pin carrier for printed circuit boards
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549784A (en) * 1968-02-01 1970-12-22 American Lava Corp Ceramic-metallic composite substrate
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3846825A (en) * 1971-02-05 1974-11-05 Philips Corp Semiconductor device having conducting pins and cooling member
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
JPS6223087A (ja) * 1985-07-23 1987-01-31 旭硝子株式会社 表示素子
EP0218796B1 (en) * 1985-08-16 1990-10-31 Dai-Ichi Seiko Co. Ltd. Semiconductor device comprising a plug-in-type package
JPH0793392B2 (ja) * 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63146973A (ja) * 1986-12-11 1988-06-18 Canon Inc 接着剤
DE3817600C2 (de) * 1987-05-26 1994-06-23 Matsushita Electric Works Ltd Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
JPH01273342A (ja) * 1988-04-25 1989-11-01 Hitachi Chem Co Ltd 半導体パッケージ
US4872844A (en) * 1988-07-08 1989-10-10 Amp Incorporated Component-carrying adapter for chip carrier socket
JPH02132960A (ja) * 1988-11-14 1990-05-22 Sony Corp ファクシミリ装置
JPH02164057A (ja) * 1988-12-19 1990-06-25 Nec Corp ピングリッドアレイ半導体パッケージ
JPH02224363A (ja) * 1989-02-27 1990-09-06 Nec Corp ピングリッドアレイ集積回路ケース
JP2717313B2 (ja) * 1989-09-07 1998-02-18 イビデン株式会社 電子部品搭載用基板の製造方法
US5285106A (en) * 1990-01-18 1994-02-08 Kabushiki Kaisha Toshiba Semiconductor device parts
JPH04164358A (ja) * 1990-10-29 1992-06-10 Nec Corp 入出力ピン付き厚膜印刷基板
JPH0555439A (ja) * 1991-08-28 1993-03-05 Mitsubishi Electric Corp 半導体集積回路装置
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2244656B2 (de) * 1972-09-12 1977-05-18 Fischer, Artur, Dr.h.c, 7244 Waldachtal Kontaktbuchse fuer die bestueckung von schaltplatten, elektronikbausteinen und dergleichen fuer versuchs- und experimentierschaltungen
US4420877A (en) * 1981-03-19 1983-12-20 Mckenzie Jr Joseph A Self-masking socket pin carrier for printed circuit boards
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
1-273342 A.,E-879 ,Jan. 25,1990,Vol.14,No. 41 *
2-224363 A.,E-1005,Nov. 22,1990,Vol.14,No.533 *
3-95962 A.,E-1090,July 16,1991,Vol.15,No.280 *
4-164358 A.,E-1270,Sept. 28,1992,Vol.16,No.465 *
5-55439 A.,E-1394,July 6,1993,Vol.17,No.356 *
JP Patents Abstracts of Japan: 2-164057 A.,E-977 ,Sept. 13,1990,Vol.14,No.425 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0814643A3 (en) * 1996-06-19 1999-04-14 Ibiden Co, Ltd. Multilayer printed circuit board
US6831234B1 (en) 1996-06-19 2004-12-14 Ibiden Co., Ltd. Multilayer printed circuit board
EP0823833A3 (en) * 1996-08-05 1999-04-14 Ibiden Co, Ltd. Multilayer printed circuit boards
US6525275B1 (en) 1996-08-05 2003-02-25 Ibiden Co., Ltd. Multilayer printed circuit boards

Also Published As

Publication number Publication date
KR940004785A (ko) 1994-03-16
US5442134A (en) 1995-08-15
JP2988603B2 (ja) 1999-12-13
TW244400B (enExample) 1995-04-01
JPH06216296A (ja) 1994-08-05
KR970005720B1 (ko) 1997-04-19

Similar Documents

Publication Publication Date Title
EP0297236A2 (de) Leiterplatte
DE10301268A1 (de) Kondensatormodul
CH667562A5 (de) Verfahren zum aendern einer elektrischen flachbaugruppe.
DE3437526A1 (de) Steckverbinder fuer oberflaechenmontage
DE3854437T2 (de) Chipkondensator.
DE60128537T2 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
DE602004001163T2 (de) Steckkontakt
DE4425803A1 (de) Leiterplatte
DE69515460T2 (de) Oberflächenmontierter prüfpunkt zum freihändigen prüfen von schaltungen
DE69730174T2 (de) Montagestruktur zur Befestigung eines elektrischen Modules auf einer Platte
DE69532050T2 (de) Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte
DE3710394C3 (de) Elektrische Anschlußklemme für Leiterplatten
EP0878868B1 (de) Anschlussklemme
DE4327950A1 (de) Leitungsstruktur eines Halbleiter-Bauteil
DE102004052495B4 (de) Leiterplatte zum Aufbau beliebiger Schaltungen mit SMD Bauelementen
DE19924198B4 (de) Tochterplatine zum Einsetzen in eine Mutterplatine
DE102016101757A1 (de) Schaltungsmodul mit oberflächenmontierbaren unterlagsblöcken zum anschliessen einer leiterplatte
DE10342047A1 (de) Elektrisches Verbindungselement
DE2854916C2 (de) Anschlußflächen für Lötkämme auf Schichtschaltungen
DE202007008700U1 (de) Leiterplattenklemme
DE19500685C2 (de) Leiterplatte mit einer Anschlußklemme
DE112017007766T5 (de) Halbleitereinrichtung
DE8613378U1 (de) Steckverbinder
DE3149626C2 (enExample)
EP2207406A2 (de) Elektrische Schaltung, elektrisches Kleingerät, insbesondere ein Hörgerät, mit der elektrischen Schaltung und Verwendung der elektrischen Schaltung zur Herstellung des elektrischen Kleingeräts

Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee