TW244400B - - Google Patents

Info

Publication number
TW244400B
TW244400B TW082106730A TW82106730A TW244400B TW 244400 B TW244400 B TW 244400B TW 082106730 A TW082106730 A TW 082106730A TW 82106730 A TW82106730 A TW 82106730A TW 244400 B TW244400 B TW 244400B
Authority
TW
Taiwan
Application number
TW082106730A
Other languages
Chinese (zh)
Original Assignee
Toyoda Automatic Loom Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Automatic Loom Co Ltd filed Critical Toyoda Automatic Loom Co Ltd
Application granted granted Critical
Publication of TW244400B publication Critical patent/TW244400B/zh

Links

Classifications

    • H10W72/00—
    • H10W70/635—
    • H10W70/60—
    • H10W90/701—
    • H10W70/682—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—
TW082106730A 1992-08-20 1993-08-20 TW244400B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4221825A JP2988603B2 (ja) 1992-08-20 1992-08-20 半導体パッケージ

Publications (1)

Publication Number Publication Date
TW244400B true TW244400B (enExample) 1995-04-01

Family

ID=16772783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106730A TW244400B (enExample) 1992-08-20 1993-08-20

Country Status (5)

Country Link
US (1) US5442134A (enExample)
JP (1) JP2988603B2 (enExample)
KR (1) KR970005720B1 (enExample)
DE (1) DE4327950A1 (enExample)
TW (1) TW244400B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3050807B2 (ja) 1996-06-19 2000-06-12 イビデン株式会社 多層プリント配線板
JP3050812B2 (ja) * 1996-08-05 2000-06-12 イビデン株式会社 多層プリント配線板
TW357332B (en) * 1997-03-12 1999-05-01 Seiko Epson Corp Electronic parts module and the electronic machine
KR100410946B1 (ko) * 2001-05-16 2003-12-18 삼성전기주식회사 이미지 센서 모듈 및 그 제조 방법
US7974223B2 (en) * 2004-11-19 2011-07-05 Corrigent Systems Ltd. Virtual private LAN service over ring networks
KR100675007B1 (ko) * 2006-01-27 2007-01-29 삼성전자주식회사 소켓을 사용하지 않는 평판형 반도체 모듈

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549784A (en) * 1968-02-01 1970-12-22 American Lava Corp Ceramic-metallic composite substrate
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3846825A (en) * 1971-02-05 1974-11-05 Philips Corp Semiconductor device having conducting pins and cooling member
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
US4420877A (en) * 1981-03-19 1983-12-20 Mckenzie Jr Joseph A Self-masking socket pin carrier for printed circuit boards
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
JPS6223087A (ja) * 1985-07-23 1987-01-31 旭硝子株式会社 表示素子
DE3675321D1 (de) * 1985-08-16 1990-12-06 Dai Ichi Seiko Co Ltd Halbleiteranordnung mit packung vom steckerstifttyp.
JPH0793392B2 (ja) * 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63146973A (ja) * 1986-12-11 1988-06-18 Canon Inc 接着剤
DE3817600C2 (de) * 1987-05-26 1994-06-23 Matsushita Electric Works Ltd Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
JPH01273342A (ja) * 1988-04-25 1989-11-01 Hitachi Chem Co Ltd 半導体パッケージ
US4872844A (en) * 1988-07-08 1989-10-10 Amp Incorporated Component-carrying adapter for chip carrier socket
JPH02132960A (ja) * 1988-11-14 1990-05-22 Sony Corp ファクシミリ装置
JPH02164057A (ja) * 1988-12-19 1990-06-25 Nec Corp ピングリッドアレイ半導体パッケージ
JPH02224363A (ja) * 1989-02-27 1990-09-06 Nec Corp ピングリッドアレイ集積回路ケース
JP2717313B2 (ja) * 1989-09-07 1998-02-18 イビデン株式会社 電子部品搭載用基板の製造方法
US5285106A (en) * 1990-01-18 1994-02-08 Kabushiki Kaisha Toshiba Semiconductor device parts
JPH04164358A (ja) * 1990-10-29 1992-06-10 Nec Corp 入出力ピン付き厚膜印刷基板
JPH0555439A (ja) * 1991-08-28 1993-03-05 Mitsubishi Electric Corp 半導体集積回路装置
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method

Also Published As

Publication number Publication date
KR940004785A (ko) 1994-03-16
JP2988603B2 (ja) 1999-12-13
KR970005720B1 (ko) 1997-04-19
US5442134A (en) 1995-08-15
DE4327950A1 (de) 1994-03-03
JPH06216296A (ja) 1994-08-05

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