DE4318466B4 - Verfahren zur Herstellung eines mikromechanischen Sensors - Google Patents

Verfahren zur Herstellung eines mikromechanischen Sensors Download PDF

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Publication number
DE4318466B4
DE4318466B4 DE4318466A DE4318466A DE4318466B4 DE 4318466 B4 DE4318466 B4 DE 4318466B4 DE 4318466 A DE4318466 A DE 4318466A DE 4318466 A DE4318466 A DE 4318466A DE 4318466 B4 DE4318466 B4 DE 4318466B4
Authority
DE
Germany
Prior art keywords
layer
silicon
silicon oxide
sensor
oxide layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4318466A
Other languages
German (de)
English (en)
Other versions
DE4318466A1 (de
Inventor
Joerg Dipl.-Ing. Muchow
Horst Dipl.-Phys. Dr. Muenzel
Michael Dr.-Ing. Dr. Offenberg
Winfried Dipl.-Phys. Dr. Waldvogel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6489558&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE4318466(B4) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE4318466A priority Critical patent/DE4318466B4/de
Priority to JP12131594A priority patent/JP3616659B2/ja
Priority to FR9406822A priority patent/FR2707043B1/fr
Publication of DE4318466A1 publication Critical patent/DE4318466A1/de
Priority to US08/470,373 priority patent/US5616514A/en
Priority to US08/791,106 priority patent/US6076404A/en
Priority to US09/585,141 priority patent/US6318175B1/en
Priority to JP2004260214A priority patent/JP3762928B2/ja
Publication of DE4318466B4 publication Critical patent/DE4318466B4/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
DE4318466A 1993-06-03 1993-06-03 Verfahren zur Herstellung eines mikromechanischen Sensors Expired - Lifetime DE4318466B4 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE4318466A DE4318466B4 (de) 1993-06-03 1993-06-03 Verfahren zur Herstellung eines mikromechanischen Sensors
JP12131594A JP3616659B2 (ja) 1993-06-03 1994-06-02 マイクロメカニックセンサおよびその製造方法
FR9406822A FR2707043B1 (enExample) 1993-06-03 1994-06-03
US08/470,373 US5616514A (en) 1993-06-03 1995-06-06 Method of fabricating a micromechanical sensor
US08/791,106 US6076404A (en) 1993-06-03 1997-01-29 Micromechanical sensor including a single-crystal silicon support
US09/585,141 US6318175B1 (en) 1993-06-03 2000-06-01 Micromechanical sensor and method for the manufacture thereof
JP2004260214A JP3762928B2 (ja) 1993-06-03 2004-09-07 マイクロメカニックセンサおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4318466A DE4318466B4 (de) 1993-06-03 1993-06-03 Verfahren zur Herstellung eines mikromechanischen Sensors

Publications (2)

Publication Number Publication Date
DE4318466A1 DE4318466A1 (de) 1994-12-08
DE4318466B4 true DE4318466B4 (de) 2004-12-09

Family

ID=6489558

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4318466A Expired - Lifetime DE4318466B4 (de) 1993-06-03 1993-06-03 Verfahren zur Herstellung eines mikromechanischen Sensors

Country Status (3)

Country Link
JP (2) JP3616659B2 (enExample)
DE (1) DE4318466B4 (enExample)
FR (1) FR2707043B1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530736B4 (de) * 1995-02-10 2007-02-08 Robert Bosch Gmbh Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
DE19526691A1 (de) * 1995-07-21 1997-01-23 Bosch Gmbh Robert Verfahren zur Herstellung von Beschleunigungssensoren
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE19632060B4 (de) * 1996-08-09 2012-05-03 Robert Bosch Gmbh Verfahren zur Herstellung eines Drehratensensors
DE19643893A1 (de) 1996-10-30 1998-05-07 Siemens Ag Ultraschallwandler in Oberflächen-Mikromechanik
DE69726718T2 (de) * 1997-07-31 2004-10-07 St Microelectronics Srl Verfahren zum Herstellen hochempfindlicher integrierter Beschleunigungs- und Gyroskopsensoren und Sensoren, die derartig hergestellt werden
DE59907268D1 (de) * 1998-08-11 2003-11-13 Infineon Technologies Ag Verfahren zur Herstellung eines Mikromechanischen Sensors
US6379989B1 (en) * 1998-12-23 2002-04-30 Xerox Corporation Process for manufacture of microoptomechanical structures
DE10017976A1 (de) 2000-04-11 2001-10-18 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US6506620B1 (en) 2000-11-27 2003-01-14 Microscan Systems Incorporated Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
US6479311B1 (en) 2000-11-27 2002-11-12 Microscan Systems, Inc. Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
US6479315B1 (en) 2000-11-27 2002-11-12 Microscan Systems, Inc. Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step
DE10114036A1 (de) * 2001-03-22 2002-10-02 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren
DE10122765A1 (de) * 2001-05-10 2002-12-05 Campus Micro Technologies Gmbh Elektroakustischer Wandler zur Erzeugung oder Erfassung von Ultraschall, Wandler-Array und Verfahren zur Herstellung der Wandler bzw. der Wandler-Arrays
US6939809B2 (en) * 2002-12-30 2005-09-06 Robert Bosch Gmbh Method for release of surface micromachined structures in an epitaxial reactor
US6928879B2 (en) * 2003-02-26 2005-08-16 Robert Bosch Gmbh Episeal pressure sensor and method for making an episeal pressure sensor
US7335971B2 (en) * 2003-03-31 2008-02-26 Robert Bosch Gmbh Method for protecting encapsulated sensor structures using stack packaging
JP4552883B2 (ja) * 2006-04-19 2010-09-29 株式会社デンソー 振動検出方法
DE102008044371B4 (de) 2008-12-05 2016-10-27 Robert Bosch Gmbh Verfahren zur Herstellung einer Sensoranordnung
JP5835285B2 (ja) * 2013-07-24 2015-12-24 横河電機株式会社 振動式トランスデューサおよびその製造方法
US11279614B2 (en) * 2019-06-28 2022-03-22 Analog Devices, Inc. Low-parasitic capacitance MEMS inertial sensors and related methods

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371421A (en) * 1981-04-16 1983-02-01 Massachusetts Institute Of Technology Lateral epitaxial growth by seeded solidification
US4893509A (en) * 1988-12-27 1990-01-16 General Motors Corporation Method and product for fabricating a resonant-bridge microaccelerometer
DE4000903C1 (enExample) * 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4003473A1 (de) * 1990-02-06 1991-08-08 Bosch Gmbh Robert Kristallorientierter bewegungssensor und verfahren zu dessen herstellung
WO1992003740A1 (en) * 1990-08-17 1992-03-05 Analog Devices, Inc. Monolithic accelerometer
US5095401A (en) * 1989-01-13 1992-03-10 Kopin Corporation SOI diaphragm sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712086B2 (ja) * 1984-01-27 1995-02-08 株式会社日立製作所 ダイヤフラムセンサの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371421A (en) * 1981-04-16 1983-02-01 Massachusetts Institute Of Technology Lateral epitaxial growth by seeded solidification
US4893509A (en) * 1988-12-27 1990-01-16 General Motors Corporation Method and product for fabricating a resonant-bridge microaccelerometer
US5095401A (en) * 1989-01-13 1992-03-10 Kopin Corporation SOI diaphragm sensor
DE4000903C1 (enExample) * 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4003473A1 (de) * 1990-02-06 1991-08-08 Bosch Gmbh Robert Kristallorientierter bewegungssensor und verfahren zu dessen herstellung
WO1992003740A1 (en) * 1990-08-17 1992-03-05 Analog Devices, Inc. Monolithic accelerometer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ORPANA, M. et. al.: Control of residual stress of polysilicon thin films by heavy doping in surface micromachining, in: Transducers 91, pp. 957-60 *

Also Published As

Publication number Publication date
JP2005062196A (ja) 2005-03-10
FR2707043A1 (enExample) 1994-12-30
JP3616659B2 (ja) 2005-02-02
FR2707043B1 (enExample) 1999-02-19
JP3762928B2 (ja) 2006-04-05
JPH0799326A (ja) 1995-04-11
DE4318466A1 (de) 1994-12-08

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8125 Change of the main classification

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