JP3762928B2 - マイクロメカニックセンサおよびその製造方法 - Google Patents
マイクロメカニックセンサおよびその製造方法 Download PDFInfo
- Publication number
- JP3762928B2 JP3762928B2 JP2004260214A JP2004260214A JP3762928B2 JP 3762928 B2 JP3762928 B2 JP 3762928B2 JP 2004260214 A JP2004260214 A JP 2004260214A JP 2004260214 A JP2004260214 A JP 2004260214A JP 3762928 B2 JP3762928 B2 JP 3762928B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silicon
- sensor
- silicon oxide
- silicon substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pressure Sensors (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Description
Claims (8)
- シリコン基板(1)を有するマイクロメカニックセンサ(16)の製造方法において、シリコン基板(1)に酸化珪素層(2)または他の非結晶質層を被覆し、その際シリコン基板(1)に酸化珪素層(2)または他の非結晶質層の周囲にシリコン基板(1)に対する接触窓開口(3,4)を製造し、エピタキシー工程によりシリコン層(5)をシリコン基板(1)および酸化珪素層(2)または他の非結晶質層に被覆し、このシリコン層(5)を酸化珪素層(2)または他の非結晶質層上に間接的にまたは直接的に多結晶で成長させるとともに(領域8)、接触窓開口(3,4)の領域ではシリコン基板(1)への直接的連結部分として単結晶で(領域6,7)成長させ、酸化珪素層(2)または他の非結晶質層のエッチングによりマイクロメカニック変位部分を多結晶シリコン層(8)から開放することを特徴とするマイクロメカニックセンサ(16)の製造方法。
- 多結晶シリコン層(8)を酸化珪素層(2)に被覆する前に少なくとも1つのほかの層(10)を被覆することにより間接的被覆を行う請求項1記載の方法。
- 1つのほかの層(10)としてポリスタート層(10)を被覆する請求項2記載の方法。
- 変位部分の複数の位置を互いに重なって配置された多結晶シリコン層(8)から開放する請求項1記載の方法。
- 方法を幾重にも重ねて使用する請求項1記載の方法。
- 構造化のためにプラズマエッチング工程を使用する請求項1記載の方法。
- 基板(1)の上および/または中に少なくとも1個の電気回路(17)および/または電子回路(17)、特にセンサ(16)の変位を評価する手段を形成する請求項1記載の方法。
- 請求項1から7までのいずれか1項記載の方法により製造されたマイクロメカニックセンサ(16)。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4318466A DE4318466B4 (de) | 1993-06-03 | 1993-06-03 | Verfahren zur Herstellung eines mikromechanischen Sensors |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12131594A Division JP3616659B2 (ja) | 1993-06-03 | 1994-06-02 | マイクロメカニックセンサおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005062196A JP2005062196A (ja) | 2005-03-10 |
JP3762928B2 true JP3762928B2 (ja) | 2006-04-05 |
Family
ID=6489558
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12131594A Expired - Lifetime JP3616659B2 (ja) | 1993-06-03 | 1994-06-02 | マイクロメカニックセンサおよびその製造方法 |
JP2004260214A Expired - Lifetime JP3762928B2 (ja) | 1993-06-03 | 2004-09-07 | マイクロメカニックセンサおよびその製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12131594A Expired - Lifetime JP3616659B2 (ja) | 1993-06-03 | 1994-06-02 | マイクロメカニックセンサおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP3616659B2 (ja) |
DE (1) | DE4318466B4 (ja) |
FR (1) | FR2707043B1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19530736B4 (de) * | 1995-02-10 | 2007-02-08 | Robert Bosch Gmbh | Beschleunigungssensor und Verfahren zur Herstellung eines Beschleunigungssensors |
FR2732467B1 (fr) * | 1995-02-10 | 1999-09-17 | Bosch Gmbh Robert | Capteur d'acceleration et procede de fabrication d'un tel capteur |
DE19526691A1 (de) * | 1995-07-21 | 1997-01-23 | Bosch Gmbh Robert | Verfahren zur Herstellung von Beschleunigungssensoren |
DE19537814B4 (de) * | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
DE19632060B4 (de) * | 1996-08-09 | 2012-05-03 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Drehratensensors |
DE19643893A1 (de) * | 1996-10-30 | 1998-05-07 | Siemens Ag | Ultraschallwandler in Oberflächen-Mikromechanik |
DE69726718T2 (de) | 1997-07-31 | 2004-10-07 | St Microelectronics Srl | Verfahren zum Herstellen hochempfindlicher integrierter Beschleunigungs- und Gyroskopsensoren und Sensoren, die derartig hergestellt werden |
DE59907268D1 (de) | 1998-08-11 | 2003-11-13 | Infineon Technologies Ag | Verfahren zur Herstellung eines Mikromechanischen Sensors |
US6379989B1 (en) * | 1998-12-23 | 2002-04-30 | Xerox Corporation | Process for manufacture of microoptomechanical structures |
DE10017976A1 (de) | 2000-04-11 | 2001-10-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
US6506620B1 (en) | 2000-11-27 | 2003-01-14 | Microscan Systems Incorporated | Process for manufacturing micromechanical and microoptomechanical structures with backside metalization |
US6479315B1 (en) | 2000-11-27 | 2002-11-12 | Microscan Systems, Inc. | Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step |
US6479311B1 (en) | 2000-11-27 | 2002-11-12 | Microscan Systems, Inc. | Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning |
DE10114036A1 (de) * | 2001-03-22 | 2002-10-02 | Bosch Gmbh Robert | Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren |
DE10122765A1 (de) * | 2001-05-10 | 2002-12-05 | Campus Micro Technologies Gmbh | Elektroakustischer Wandler zur Erzeugung oder Erfassung von Ultraschall, Wandler-Array und Verfahren zur Herstellung der Wandler bzw. der Wandler-Arrays |
US6939809B2 (en) * | 2002-12-30 | 2005-09-06 | Robert Bosch Gmbh | Method for release of surface micromachined structures in an epitaxial reactor |
US6928879B2 (en) * | 2003-02-26 | 2005-08-16 | Robert Bosch Gmbh | Episeal pressure sensor and method for making an episeal pressure sensor |
US7335971B2 (en) * | 2003-03-31 | 2008-02-26 | Robert Bosch Gmbh | Method for protecting encapsulated sensor structures using stack packaging |
JP4552883B2 (ja) * | 2006-04-19 | 2010-09-29 | 株式会社デンソー | 振動検出方法 |
DE102008044371B4 (de) | 2008-12-05 | 2016-10-27 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Sensoranordnung |
JP5835285B2 (ja) * | 2013-07-24 | 2015-12-24 | 横河電機株式会社 | 振動式トランスデューサおよびその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4371421A (en) * | 1981-04-16 | 1983-02-01 | Massachusetts Institute Of Technology | Lateral epitaxial growth by seeded solidification |
JPH0712086B2 (ja) * | 1984-01-27 | 1995-02-08 | 株式会社日立製作所 | ダイヤフラムセンサの製造方法 |
US4893509A (en) * | 1988-12-27 | 1990-01-16 | General Motors Corporation | Method and product for fabricating a resonant-bridge microaccelerometer |
US5095401A (en) * | 1989-01-13 | 1992-03-10 | Kopin Corporation | SOI diaphragm sensor |
DE4000903C1 (ja) * | 1990-01-15 | 1990-08-09 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
DE4003473A1 (de) * | 1990-02-06 | 1991-08-08 | Bosch Gmbh Robert | Kristallorientierter bewegungssensor und verfahren zu dessen herstellung |
JPH0644008B2 (ja) * | 1990-08-17 | 1994-06-08 | アナログ・ディバイセス・インコーポレーテッド | モノリシック加速度計 |
-
1993
- 1993-06-03 DE DE4318466A patent/DE4318466B4/de not_active Expired - Lifetime
-
1994
- 1994-06-02 JP JP12131594A patent/JP3616659B2/ja not_active Expired - Lifetime
- 1994-06-03 FR FR9406822A patent/FR2707043B1/fr not_active Expired - Lifetime
-
2004
- 2004-09-07 JP JP2004260214A patent/JP3762928B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3616659B2 (ja) | 2005-02-02 |
FR2707043A1 (ja) | 1994-12-30 |
JP2005062196A (ja) | 2005-03-10 |
DE4318466A1 (de) | 1994-12-08 |
DE4318466B4 (de) | 2004-12-09 |
FR2707043B1 (ja) | 1999-02-19 |
JPH0799326A (ja) | 1995-04-11 |
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