DE4223326A1 - Traeger oder behaelter fuer wafer oder aehnliche halbleiterplaettchen - Google Patents
Traeger oder behaelter fuer wafer oder aehnliche halbleiterplaettchenInfo
- Publication number
- DE4223326A1 DE4223326A1 DE4223326A DE4223326A DE4223326A1 DE 4223326 A1 DE4223326 A1 DE 4223326A1 DE 4223326 A DE4223326 A DE 4223326A DE 4223326 A DE4223326 A DE 4223326A DE 4223326 A1 DE4223326 A1 DE 4223326A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- diamond
- wafers
- carrier according
- substructure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000010432 diamond Substances 0.000 claims abstract description 40
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 34
- 239000000126 substance Substances 0.000 claims abstract description 22
- -1 polymeric Substances 0.000 claims abstract description 15
- 239000010959 steel Substances 0.000 claims abstract description 5
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 4
- 239000012634 fragment Substances 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- 229920001652 poly(etherketoneketone) Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000012876 carrier material Substances 0.000 claims description 2
- 239000003610 charcoal Substances 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 239000004416 thermosoftening plastic Substances 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 1
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920002530 polyetherether ketone Polymers 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 12
- 229920003023 plastic Polymers 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 abstract description 6
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 abstract 2
- 238000012993 chemical processing Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000000969 carrier Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 5
- 229920006260 polyaryletherketone Polymers 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 229920002313 fluoropolymer Polymers 0.000 description 3
- 239000004811 fluoropolymer Substances 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73479491A | 1991-07-23 | 1991-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4223326A1 true DE4223326A1 (de) | 1993-01-28 |
Family
ID=24953096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4223326A Withdrawn DE4223326A1 (de) | 1991-07-23 | 1992-07-16 | Traeger oder behaelter fuer wafer oder aehnliche halbleiterplaettchen |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH05198664A (it) |
| KR (1) | KR930003300A (it) |
| DE (1) | DE4223326A1 (it) |
| FR (1) | FR2679524A1 (it) |
| GB (1) | GB2257986A (it) |
| IT (1) | IT1257386B (it) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4300205A1 (de) * | 1993-01-07 | 1994-07-14 | Deutsche Bundespost Telekom | Probenhalterung in Kassettenform |
| EP0969497A2 (en) * | 1998-06-02 | 2000-01-05 | Shin-Etsu Polymer Co., Ltd. | Precision product container |
| DE10149037A1 (de) * | 2001-10-05 | 2003-04-24 | Infineon Technologies Ag | Waferhorde und Verfahren |
| DE10215283A1 (de) * | 2002-04-05 | 2003-10-30 | Astec Halbleitertechnologie Gm | Vorrichtung zur Aufnahme von Substraten |
| EP3929969A1 (de) * | 2020-06-22 | 2021-12-29 | Siltronic AG | Verfahren zum herstellen eines prozessbehälters für halbleiterwerkstücke und prozessbehälter |
| EP4068343A1 (de) | 2021-04-01 | 2022-10-05 | Siltronic AG | Vorrichtung zum transport von halbleiterscheiben |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
| JP2002046793A (ja) * | 2000-04-26 | 2002-02-12 | Asahi Glass Co Ltd | 光学部材用収納ケース |
| JP4616086B2 (ja) * | 2005-06-14 | 2011-01-19 | 東芝物流株式会社 | パネル状物品の収納トレイ |
| DE102010041230A1 (de) * | 2010-09-23 | 2012-03-29 | Evonik Degussa Gmbh | Verwendung von Diamond Like Carbon Schichten bei der Aufbringung metallionenfreier Halbleitertinten |
| CN111270218B (zh) * | 2020-01-23 | 2021-07-06 | 电子科技大学 | 化学气相沉积碳修饰片状FeSiAl合金的制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2514743B1 (fr) * | 1981-10-21 | 1986-05-09 | Rca Corp | Pellicule amorphe a base de carbone, du type diamant, et son procede de fabrication |
| US4872554A (en) * | 1987-07-02 | 1989-10-10 | Fluoroware, Inc. | Reinforced carrier with embedded rigid insert |
| JPH01201095A (ja) * | 1988-02-04 | 1989-08-14 | Idemitsu Petrochem Co Ltd | ダイヤモンド状炭素膜とその製造方法 |
| JPH01259172A (ja) * | 1988-04-09 | 1989-10-16 | Idemitsu Petrochem Co Ltd | 粉砕機 |
| JPH02186656A (ja) * | 1989-01-13 | 1990-07-20 | Hitachi Ltd | 低発塵装置 |
| JP2816864B2 (ja) * | 1989-07-07 | 1998-10-27 | 大塚化学株式会社 | 搬送用ウエーハバスケット及び収納ケース |
-
1992
- 1992-07-09 KR KR1019920012200A patent/KR930003300A/ko not_active Application Discontinuation
- 1992-07-10 GB GB9214697A patent/GB2257986A/en not_active Withdrawn
- 1992-07-16 DE DE4223326A patent/DE4223326A1/de not_active Withdrawn
- 1992-07-17 IT ITTO920613A patent/IT1257386B/it active IP Right Grant
- 1992-07-22 JP JP21642692A patent/JPH05198664A/ja active Pending
- 1992-07-22 FR FR9209037A patent/FR2679524A1/fr active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4300205A1 (de) * | 1993-01-07 | 1994-07-14 | Deutsche Bundespost Telekom | Probenhalterung in Kassettenform |
| EP0969497A2 (en) * | 1998-06-02 | 2000-01-05 | Shin-Etsu Polymer Co., Ltd. | Precision product container |
| EP0969497A3 (en) * | 1998-06-02 | 2003-11-05 | Shin-Etsu Polymer Co., Ltd. | Precision product container |
| DE10149037A1 (de) * | 2001-10-05 | 2003-04-24 | Infineon Technologies Ag | Waferhorde und Verfahren |
| DE10215283A1 (de) * | 2002-04-05 | 2003-10-30 | Astec Halbleitertechnologie Gm | Vorrichtung zur Aufnahme von Substraten |
| DE10215283B4 (de) * | 2002-04-05 | 2004-06-03 | Astec Halbleitertechnologie Gmbh | Vorrichtung zur Aufnahme von Substraten |
| EP3929969A1 (de) * | 2020-06-22 | 2021-12-29 | Siltronic AG | Verfahren zum herstellen eines prozessbehälters für halbleiterwerkstücke und prozessbehälter |
| EP4068343A1 (de) | 2021-04-01 | 2022-10-05 | Siltronic AG | Vorrichtung zum transport von halbleiterscheiben |
| WO2022207419A1 (de) | 2021-04-01 | 2022-10-06 | Siltronic Ag | Vorrichtung zum transport von halbleiterscheiben |
| TWI835102B (zh) * | 2021-04-01 | 2024-03-11 | 德商世創電子材料公司 | 晶圓輸送設備及輸送半導體晶圓的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9214697D0 (en) | 1992-08-19 |
| FR2679524A1 (fr) | 1993-01-29 |
| ITTO920613A1 (it) | 1994-01-17 |
| ITTO920613A0 (it) | 1992-07-17 |
| IT1257386B (it) | 1996-01-15 |
| GB2257986A (en) | 1993-01-27 |
| KR930003300A (ko) | 1993-02-24 |
| JPH05198664A (ja) | 1993-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE4223326A1 (de) | Traeger oder behaelter fuer wafer oder aehnliche halbleiterplaettchen | |
| EP0325319B1 (de) | Verfahren zum Erzeugen eines mit dem Dampf eines wenig flüchtigen Stoffes angereicherten Gasstroms | |
| EP1692718B1 (de) | Träger zur aufnahme eines gegenstandes sowie verfahren zur herstellung eines trägers | |
| DE60038412T2 (de) | Inert-Barriere für Hochreinheit-Epitaxialabscheidungssysteme | |
| EP2144296B2 (de) | Verfahren zum Herstellen einer Halbleiterschicht | |
| DE629818C (de) | Vorrichtung zum ununterbrochenen Schmelzen von Glas | |
| DE69007779T2 (de) | Trocknungsverfahren und vorrichtung dazu. | |
| DE4439920A1 (de) | Umweltschonende Verfahren und umweltschonende Vorrichtung zur Abscheidung und/oder Rückgewinnung von Metall oder Halbleitermetall unter Verwendung der Sublimation | |
| EP0090191B1 (de) | Thermische Isolierung | |
| DE60201125T2 (de) | Antistatischer Behälter | |
| EP1973634B1 (de) | Kopfplatte | |
| EP1277237A2 (de) | Vorrichtung und verfahren zum temperieren mindestens eines prozessierguts | |
| WO2017108637A2 (de) | Wabenkörper und deren verwendung | |
| DE69800040T2 (de) | Gasdichter Körper und Verfahren zu dessen Herstellung | |
| DE2943634C2 (de) | Epitaxiereaktor | |
| DE3634130A1 (de) | Vorrichtung und verfahren fuer die chemische dampfabscheidung | |
| DE3345141A1 (de) | Thermische isolierung | |
| DE69221212T2 (de) | Verfahren zur behälterlosen Behandlung von sich in einem Zustand von kompensierter Schwerkraft befindlichen Materialien und Vorrichtung dafür | |
| WO1997017722A1 (de) | Anlage zur behandlung von gegenständen in einem prozesstank | |
| DE102010011156B4 (de) | Vorrichtung zur thermischen Behandlung von Halbleitersubstraten | |
| DE69512880T2 (de) | Verdichtung poröser Gegenstände mittels plasmaverstärkter chemischer Dampfinfiltration | |
| DE1471178B2 (de) | Verfahren zur herstellung von flaechengebilden aus pyrolyti schem graphit | |
| DE3876352T2 (de) | Gefaess zum aufbewahren von fluessigem helium. | |
| EP0628758A1 (de) | Auftriebskörper für Rohrleitungen | |
| DE68908908T2 (de) | Vorrichtung zum Trennen von Uranisotopen. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8130 | Withdrawal |