DE4191065T - - Google Patents

Info

Publication number
DE4191065T
DE4191065T DE19914191065 DE4191065T DE4191065T DE 4191065 T DE4191065 T DE 4191065T DE 19914191065 DE19914191065 DE 19914191065 DE 4191065 T DE4191065 T DE 4191065T DE 4191065 T DE4191065 T DE 4191065T
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19914191065
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE4191065T publication Critical patent/DE4191065T/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07235—Applying EM radiation, e.g. induction heating or using a laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19914191065 1990-05-24 1991-05-22 Ceased DE4191065T (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2134783A JPH0429338A (ja) 1990-05-24 1990-05-24 Ｉｃの搭載用回路基板及びその搭載方法

Publications (1)

Publication Number Publication Date
DE4191065T true DE4191065T (enExample) 1992-06-25

Family

ID=15136451

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19914191065 Ceased DE4191065T (enExample) 1990-05-24 1991-05-22

Country Status (4)

Country Link
US (1) US5250469A (enExample)
JP (1) JPH0429338A (enExample)
DE (1) DE4191065T (enExample)
WO (1) WO1991018415A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2762792B2 (ja) * 1991-08-30 1998-06-04 日本電気株式会社 光半導体装置
WO1993019487A1 (en) * 1992-03-24 1993-09-30 Unisys Corporation Integrated circuit module having microscopic self-alignment features
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
US5451274A (en) * 1994-01-31 1995-09-19 Motorola, Inc. Reflow of multi-layer metal bumps
US5766972A (en) * 1994-06-02 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Method of making resin encapsulated semiconductor device with bump electrodes
US5904499A (en) * 1994-12-22 1999-05-18 Pace; Benedict G Package for power semiconductor chips
US6614110B1 (en) 1994-12-22 2003-09-02 Benedict G Pace Module with bumps for connection and support
JP2001523390A (ja) * 1994-12-22 2001-11-20 ベネディクト・ジー・ペース 反転型のチップが接合された高い実装効率を有するモジュール
US5608260A (en) * 1994-12-30 1997-03-04 International Business Machines Corporation Leadframe having contact pads defined by a polymer insulating film
DE19549635B4 (de) 1995-02-15 2004-12-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
TW520816U (en) * 1995-04-24 2003-02-11 Matsushita Electric Industrial Co Ltd Semiconductor device
JP3015712B2 (ja) * 1995-06-30 2000-03-06 日東電工株式会社 フィルムキャリアおよびそれを用いてなる半導体装置
US5776824A (en) * 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications
JP3385872B2 (ja) * 1995-12-25 2003-03-10 三菱電機株式会社 はんだ供給法およびはんだ供給装置
KR100433857B1 (ko) * 1996-09-17 2004-06-04 마츠시타 덴끼 산교 가부시키가이샤 아이씨칩의 조립 방법, 조립장치 및 그에 사용하는 테이프형 지지체
JP3663786B2 (ja) * 1996-10-14 2005-06-22 ヤマハ株式会社 半導体チップの実装方法と実装構造
IT1291779B1 (it) 1997-02-17 1999-01-21 Magnetek Spa Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
FI970822A7 (fi) * 1997-02-27 1998-08-28 Nokia Corp Menetelmä ja järjestely komponentin liittämiseksi
US6730541B2 (en) * 1997-11-20 2004-05-04 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
JP3942738B2 (ja) * 1998-07-17 2007-07-11 松下電器産業株式会社 バンプ接合装置及び方法、並びに半導体部品製造装置
JP4338834B2 (ja) * 1999-08-06 2009-10-07 日本テキサス・インスツルメンツ株式会社 超音波振動を用いた半導体チップの実装方法
EP1264520A4 (en) * 2000-03-10 2007-02-28 Chippac Inc PACKAGING STRUCTURE AND METHOD
WO2001068311A1 (en) * 2000-03-10 2001-09-20 Chippac, Inc. Flip chip interconnection structure
US10388626B2 (en) * 2000-03-10 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming flipchip interconnect structure
US6940178B2 (en) * 2001-02-27 2005-09-06 Chippac, Inc. Self-coplanarity bumping shape for flip chip
US6780682B2 (en) * 2001-02-27 2004-08-24 Chippac, Inc. Process for precise encapsulation of flip chip interconnects
US6737295B2 (en) 2001-02-27 2004-05-18 Chippac, Inc. Chip scale package with flip chip interconnect
DE10202788A1 (de) * 2002-01-25 2003-07-31 Rieter Ag Maschf Texturieranlage und Texturierdüse hierfür
DE10249005A1 (de) * 2002-10-21 2004-05-06 Siemens Ag Verfahren zur Herstellung einer Schaltungsanordnung
JP3870915B2 (ja) * 2003-03-05 2007-01-24 セイコーエプソン株式会社 光通信モジュール、光通信装置、及びその製造方法
DE10361521A1 (de) 2003-12-03 2005-07-07 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
WO2005055288A2 (de) 2003-12-03 2005-06-16 Pac Tech - Packaging Technologies Gmbh Verfahren und vorrichtung zur wechselseitigen kontaktierung von zwei wafern
DE102004030813B4 (de) * 2004-06-25 2007-03-29 Infineon Technologies Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
JP4700060B2 (ja) * 2006-05-09 2011-06-15 パナソニック株式会社 電子部品装着ヘッド、電子部品装着装置および電子部品装着方法
JP2009544354A (ja) * 2006-07-20 2009-12-17 ダブリューエムエス・ゲイミング・インコーポレーテッド 受動的ゲームプレイに基づく特別イベント資格機能（ｆｅａｔｕｒｅ）を有する賭け事ゲーム
DE102006060719A1 (de) * 2006-12-21 2008-06-26 Infineon Technologies Ag Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls
WO2009054236A1 (ja) * 2007-10-26 2009-04-30 Toray Industries, Inc. 平面アンテナおよびその製造方法
US20090155958A1 (en) * 2007-12-13 2009-06-18 Boris Kolodin Robust die bonding process for led dies
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
US12601621B2 (en) 2022-03-30 2026-04-14 Applied Materials, Inc. Methods of manufacturing plasma generating cells for a plasma source
DE102023110696A1 (de) * 2023-04-26 2024-10-31 Pac Tech - Packaging Technologies Gmbh Bondkopf und Bondvorrichtung

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Publication number Priority date Publication date Assignee Title
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3717743A (en) * 1970-12-07 1973-02-20 Argus Eng Co Method and apparatus for heat-bonding in a local area using combined heating techniques
DE2330161A1 (de) * 1973-06-08 1974-12-19 Minnesota Mining & Mfg Verbesserte schaltkreise und verfahren zu deren herstellung
DE2343235B2 (de) * 1973-08-28 1978-09-28 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Befestigung und Kontaktierung von elektrischen Subminiatur-Bauelementen auf gedruckten Schaltungen
GB1583192A (en) * 1978-04-26 1981-01-21 Atomic Energy Authority Uk Processing of printed circuit boards
DE3701013C2 (enExample) * 1987-01-15 1989-02-16 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE3839396A1 (de) * 1988-11-22 1990-05-23 Nixdorf Computer Ag Verfahren und einrichtung zum verloeten von auf einer leiterplatte aufliegenden elektrischen bauelementen mit der leiterplatte

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JPS5190568A (en) * 1975-02-07 1976-08-09 Handotaisochino seizohoho
JPS5925378B2 (ja) * 1980-05-23 1984-06-16 松下電器産業株式会社 電子部品の実装方法
JPS57106141A (en) * 1980-12-24 1982-07-01 Fujitsu Ltd Connecting method for hybrid integrated circuit substrate to semiconductor pellet
JPS62194652A (ja) * 1986-02-21 1987-08-27 Hitachi Ltd 半導体装置
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JP2545899B2 (ja) * 1987-12-17 1996-10-23 ソニー株式会社 固体撮像装置とその製造方法
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
US5071787A (en) * 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
JP2933672B2 (ja) * 1990-04-09 1999-08-16 沖電気工業株式会社 半導体装置のバンプ高さ修正方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
US3717743A (en) * 1970-12-07 1973-02-20 Argus Eng Co Method and apparatus for heat-bonding in a local area using combined heating techniques
DE2330161A1 (de) * 1973-06-08 1974-12-19 Minnesota Mining & Mfg Verbesserte schaltkreise und verfahren zu deren herstellung
DE2343235B2 (de) * 1973-08-28 1978-09-28 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Befestigung und Kontaktierung von elektrischen Subminiatur-Bauelementen auf gedruckten Schaltungen
GB1583192A (en) * 1978-04-26 1981-01-21 Atomic Energy Authority Uk Processing of printed circuit boards
DE3701013C2 (enExample) * 1987-01-15 1989-02-16 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE3839396A1 (de) * 1988-11-22 1990-05-23 Nixdorf Computer Ag Verfahren und einrichtung zum verloeten von auf einer leiterplatte aufliegenden elektrischen bauelementen mit der leiterplatte

Also Published As

Publication number Publication date
WO1991018415A1 (fr) 1991-11-28
US5250469A (en) 1993-10-05
JPH0429338A (ja) 1992-01-31

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OP8 Request for examination as to paragraph 44 patent law
8131 Rejection