DE3942640C2 - MOS-Halbleitervorrichtung - Google Patents

MOS-Halbleitervorrichtung

Info

Publication number
DE3942640C2
DE3942640C2 DE3942640A DE3942640A DE3942640C2 DE 3942640 C2 DE3942640 C2 DE 3942640C2 DE 3942640 A DE3942640 A DE 3942640A DE 3942640 A DE3942640 A DE 3942640A DE 3942640 C2 DE3942640 C2 DE 3942640C2
Authority
DE
Germany
Prior art keywords
layer
region
area
semiconductor device
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3942640A
Other languages
German (de)
English (en)
Other versions
DE3942640A1 (de
Inventor
Takeyoshi Nishimura
Masaharu Nishiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE3942640A1 publication Critical patent/DE3942640A1/de
Application granted granted Critical
Publication of DE3942640C2 publication Critical patent/DE3942640C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/141—VDMOS having built-in components
    • H10D84/148—VDMOS having built-in components the built-in components being breakdown diodes, e.g. Zener diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE3942640A 1988-12-29 1989-12-22 MOS-Halbleitervorrichtung Expired - Fee Related DE3942640C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33282688 1988-12-29
JP1318471A JPH02275675A (ja) 1988-12-29 1989-12-07 Ｍｏｓ型半導体装置

Publications (2)

Publication Number Publication Date
DE3942640A1 DE3942640A1 (de) 1990-08-02
DE3942640C2 true DE3942640C2 (de) 1997-05-15

Family

ID=26569380

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3942640A Expired - Fee Related DE3942640C2 (de) 1988-12-29 1989-12-22 MOS-Halbleitervorrichtung

Country Status (3)

Country Link
JP (1) JPH02275675A (enExample)
DE (1) DE3942640C2 (enExample)
FR (1) FR2641417A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19750992A1 (de) * 1997-11-18 1999-06-02 Bosch Gmbh Robert Halbleiterbauelement

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3156300B2 (ja) * 1991-10-07 2001-04-16 株式会社デンソー 縦型半導体装置
FR2705173B1 (fr) * 1993-05-10 1995-07-28 Sgs Thomson Microelectronics Composant limiteur de courant serie.
EP0865085A1 (en) * 1997-03-11 1998-09-16 STMicroelectronics S.r.l. Insulated gate bipolar transistor with high dynamic ruggedness
US7728402B2 (en) 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
CN101501859B (zh) 2006-08-17 2011-05-25 克里公司 高功率绝缘栅双极晶体管
US8835987B2 (en) 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
US7687825B2 (en) * 2007-09-18 2010-03-30 Cree, Inc. Insulated gate bipolar conduction transistors (IBCTS) and related methods of fabrication
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
US8629509B2 (en) 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8541787B2 (en) 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
JP2014531752A (ja) 2011-09-11 2014-11-27 クリー インコーポレイテッドＣｒｅｅ Ｉｎｃ． 改善したレイアウトを有するトランジスタを備える高電流密度電力モジュール
CN119730331A (zh) * 2025-02-25 2025-03-28 山东大学 提升高频性能的碳化硅mosfet版图结构及制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3103444A1 (de) * 1981-02-02 1982-10-21 Siemens AG, 1000 Berlin und 8000 München Vertikal-mis-feldeffekttransistor mit kleinem durchlasswiderstand
JPS57206073A (en) * 1981-06-12 1982-12-17 Hitachi Ltd Mis semiconductor device
DE3224642A1 (de) * 1982-07-01 1984-01-05 Siemens AG, 1000 Berlin und 8000 München Igfet mit injektorzone
US4779123A (en) * 1985-12-13 1988-10-18 Siliconix Incorporated Insulated gate transistor array
JPS63164473A (ja) * 1986-12-26 1988-07-07 Fujitsu Ltd 半導体装置
EP0279403A3 (en) * 1987-02-16 1988-12-07 Nec Corporation Vertical mos field effect transistor having a high withstand voltage and a high switching speed

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19750992A1 (de) * 1997-11-18 1999-06-02 Bosch Gmbh Robert Halbleiterbauelement

Also Published As

Publication number Publication date
DE3942640A1 (de) 1990-08-02
FR2641417B1 (enExample) 1995-03-24
JPH02275675A (ja) 1990-11-09
FR2641417A1 (fr) 1990-07-06

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8180 Miscellaneous part 1

Free format text: DIE 2. PRIORITAET IST NACHZUTRAGEN: 07.12.89 JP 1-318471

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee