DE3888797D1 - Verfahren zur Herstellung eines Quarzglasgefässes für Halbleiter-Einkristallzüchtung. - Google Patents
Verfahren zur Herstellung eines Quarzglasgefässes für Halbleiter-Einkristallzüchtung.Info
- Publication number
- DE3888797D1 DE3888797D1 DE88120166T DE3888797T DE3888797D1 DE 3888797 D1 DE3888797 D1 DE 3888797D1 DE 88120166 T DE88120166 T DE 88120166T DE 3888797 T DE3888797 T DE 3888797T DE 3888797 D1 DE3888797 D1 DE 3888797D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- single crystal
- quartz glass
- crystal growth
- semiconductor single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/90—Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1317—Multilayer [continuous layer]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
- Y10T428/24998—Composite has more than two layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/249988—Of about the same composition as, and adjacent to, the void-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
- Y10T428/315—Surface modified glass [e.g., tempered, strengthened, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Glass Melting And Manufacturing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30462687A JPH01148783A (ja) | 1987-12-03 | 1987-12-03 | 単結晶引き上げ用石英ルツボ |
JP62304625A JPH0729871B2 (ja) | 1987-12-03 | 1987-12-03 | 単結晶引き上げ用石英るつぼ |
JP30462487A JPH01148718A (ja) | 1987-12-03 | 1987-12-03 | 石英るつぼの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3888797D1 true DE3888797D1 (de) | 1994-05-05 |
DE3888797T2 DE3888797T2 (de) | 1994-07-28 |
Family
ID=27338695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3888797T Expired - Lifetime DE3888797T2 (de) | 1987-12-03 | 1988-12-02 | Verfahren zur Herstellung eines Quarzglasgefässes für Halbleiter-Einkristallzüchtung. |
Country Status (3)
Country | Link |
---|---|
US (2) | US4935046A (de) |
EP (1) | EP0319031B1 (de) |
DE (1) | DE3888797T2 (de) |
Families Citing this family (97)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2714860B2 (ja) * | 1989-07-28 | 1998-02-16 | 東芝セラミックス株式会社 | 半導体巣結晶引上げ用石英ガラスルツボ |
JP2933404B2 (ja) * | 1990-06-25 | 1999-08-16 | 信越石英 株式会社 | シリコン単結晶引き上げ用石英ガラスルツボとその製造方法 |
JPH0585879A (ja) * | 1991-09-04 | 1993-04-06 | Mitsubishi Materials Corp | 単結晶引上装置 |
US5312471A (en) * | 1991-12-02 | 1994-05-17 | Lothar Jung | Method and apparatus for the manufacture of large optical grade SiO2 glass preforms |
US5306473A (en) * | 1992-01-31 | 1994-04-26 | Toshiba Ceramics Co., Ltd. | Quartz glass crucible for pulling a single crystal |
DE4338807C1 (de) * | 1993-11-12 | 1995-01-26 | Heraeus Quarzglas | Formkörper mit hohem Gehalt an Siliziumdioxid und Verfahren zur Herstellung solcher Formkörper |
JP2830987B2 (ja) * | 1994-07-19 | 1998-12-02 | 信越石英株式会社 | 石英ガラスルツボ及びその製造方法 |
DE69502268T2 (de) * | 1995-02-22 | 1999-01-07 | Heraeus Quarzglas | Opakes Quarzglas und Verfahren zu dessen Herstellung |
EP0757665B1 (de) * | 1995-02-28 | 1998-10-14 | Heraeus Quarzglas GmbH | Verfahren zur herstellung eines cristobalit enthaltenden quarzglases |
US5976247A (en) * | 1995-06-14 | 1999-11-02 | Memc Electronic Materials, Inc. | Surface-treated crucibles for improved zero dislocation performance |
US5980629A (en) * | 1995-06-14 | 1999-11-09 | Memc Electronic Materials, Inc. | Methods for improving zero dislocation yield of single crystals |
JP3850880B2 (ja) * | 1995-09-12 | 2006-11-29 | コーニング インコーポレイテッド | 溶融シリカガラス製造用閉じ込め容器 |
EP0850202B1 (de) * | 1995-09-12 | 2005-04-27 | Corning Incorporated | Boule-oscillationsmustern für die herstellung von geschmolzenem quarzglas |
EP0850199B1 (de) * | 1995-09-12 | 2005-12-28 | Corning Incorporated | Verfahren und Ofen zur Herstellung von Quarzglas mit reduziertem Gehalt an Schlieren |
JP3598634B2 (ja) * | 1996-01-30 | 2004-12-08 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
JP3533416B2 (ja) * | 1996-02-06 | 2004-05-31 | 三菱住友シリコン株式会社 | 単結晶引上装置 |
JP4285788B2 (ja) * | 1996-03-14 | 2009-06-24 | 信越石英株式会社 | 単結晶引き上げ用大口径石英るつぼの製造方法 |
JP3764776B2 (ja) * | 1996-03-18 | 2006-04-12 | 信越石英株式会社 | 単結晶引き上げ用石英ガラスるつぼ及びその製造方法 |
DE19719133C2 (de) | 1997-05-07 | 1999-09-02 | Heraeus Quarzglas | Glocke aus Quarzglas und Verfahren für ihre Herstellung |
EP0911429A1 (de) * | 1997-09-30 | 1999-04-28 | Heraeus Quarzglas GmbH | Quarzglastiegel zum Herstellen Siliciumeinkristall sowie Verfahren zu seiner Herstellung |
US6405563B1 (en) | 1997-10-16 | 2002-06-18 | Tosoh Corporation | Opaque silica glass article having transparent portion and process for producing same |
DE69803643T3 (de) * | 1997-10-16 | 2006-11-30 | Tosoh Corp., Shinnanyo | Undurchsichtiger Silikatglasgegenstand mit durchsichtigem Bereich und Verfahren zu dessen Herstellung |
GB9722020D0 (en) * | 1997-10-17 | 1997-12-17 | Tsl Group Plc | Production of quartz glass articles having high surface purity |
US6379785B1 (en) * | 1997-12-31 | 2002-04-30 | Tyco Electronic Corp | Glass-coated substrates for high frequency applications |
US5913975A (en) * | 1998-02-03 | 1999-06-22 | Memc Electronic Materials, Inc. | Crucible and method of preparation thereof |
JP4398527B2 (ja) * | 1998-05-25 | 2010-01-13 | 信越石英株式会社 | シリコン単結晶引き上げ用石英ガラスるつぼ |
US6182237B1 (en) | 1998-08-31 | 2001-01-30 | International Business Machines Corporation | System and method for detecting phase errors in asics with multiple clock frequencies |
US6143073A (en) * | 1998-11-19 | 2000-11-07 | Heraeus Shin-Etsu America | Methods and apparatus for minimizing white point defects in quartz glass crucibles |
JP4454059B2 (ja) * | 1999-01-29 | 2010-04-21 | 信越石英株式会社 | シリコン単結晶引き上げ用大口径石英ガラスるつぼ |
US6553787B1 (en) | 1999-04-06 | 2003-04-29 | Nanwa Quartz, Inc. | Method for manufacturing quartz glass crucible |
US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
US6228165B1 (en) | 1999-07-28 | 2001-05-08 | Seh America, Inc. | Method of manufacturing crystal of silicon using an electric potential |
DE19962452B4 (de) * | 1999-12-22 | 2004-03-18 | Heraeus Quarzglas Gmbh & Co. Kg | Verfahren für die Herstellung von opakem Quarzglas |
DE19962449C2 (de) * | 1999-12-22 | 2003-09-25 | Heraeus Quarzglas | Quarzglastiegel und Verfahren für seine Herstellung |
JP4592037B2 (ja) * | 2000-05-31 | 2010-12-01 | 信越石英株式会社 | 石英ガラスルツボの製造方法 |
EP1167309B1 (de) * | 2000-06-28 | 2006-10-18 | Japan Super Quartz Corporation | Synthetisches Quarzpulver, Verfahren zur Herstellung und synthetischer Quarztiegel |
DE10033632C1 (de) * | 2000-07-11 | 2002-01-03 | Heraeus Quarzglas | Vorrichtung zur Herstellung rotationssymmetrischer Quarzglastiegel |
AUPR054000A0 (en) * | 2000-10-04 | 2000-10-26 | Austai Motors Designing Pty Ltd | A planetary gear apparatus |
US6546754B1 (en) * | 2000-10-27 | 2003-04-15 | General Electric Company | Apparatus for silica crucible manufacture |
US6502422B1 (en) * | 2000-10-27 | 2003-01-07 | General Electric Company | Method for quartz crucible fabrication |
AU2001288566A1 (en) | 2000-11-15 | 2002-05-27 | Gt Equipment Technologies Inc. | A protective layer for quartz crucibles used for silicon crystallization |
US6510707B2 (en) | 2001-03-15 | 2003-01-28 | Heraeus Shin-Etsu America, Inc. | Methods for making silica crucibles |
US6447601B1 (en) | 2001-03-19 | 2002-09-10 | Memc Electronic Materials, Inc. | Crystal puller and method for growing monocrystalline silicon ingots |
US6641663B2 (en) | 2001-12-12 | 2003-11-04 | Heracus Shin-Estu America | Silica crucible with inner layer crystallizer and method |
US7118789B2 (en) * | 2001-07-16 | 2006-10-10 | Heraeus Shin-Etsu America | Silica glass crucible |
US20030024467A1 (en) * | 2001-08-02 | 2003-02-06 | Memc Electronic Materials, Inc. | Method of eliminating near-surface bubbles in quartz crucibles |
JP4117641B2 (ja) * | 2001-11-26 | 2008-07-16 | ジャパンスーパークォーツ株式会社 | 合成石英粉の処理方法およびその石英ガラス製品 |
DE10158521B4 (de) * | 2001-11-29 | 2005-06-02 | Wacker-Chemie Gmbh | In Teilbereichen oder vollständig verglaster SiO2-Formkörper und Verfahren zu seiner Herstellung |
JP4300333B2 (ja) * | 2002-03-14 | 2009-07-22 | ジャパンスーパークォーツ株式会社 | リング状アークによる石英ガラスルツボの製造方法と装置およびその石英ガラスルツボ |
JP4300334B2 (ja) * | 2002-08-15 | 2009-07-22 | ジャパンスーパークォーツ株式会社 | 石英ガラスルツボの再生方法 |
US20050120945A1 (en) * | 2003-12-03 | 2005-06-09 | General Electric Company | Quartz crucibles having reduced bubble content and method of making thereof |
JPWO2005073439A1 (ja) * | 2004-02-02 | 2007-09-13 | 信越半導体株式会社 | シリコン単結晶及びシリコンウェーハ及びそれらの製造装置並びに製造方法 |
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US3927697A (en) * | 1968-02-22 | 1975-12-23 | Heraeus Schott Quarzschmelze | Quartz glass elements |
US3776809A (en) * | 1968-02-22 | 1973-12-04 | Heraeus Schott Quarzschmelze | Quartz glass elements |
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DE2038564C3 (de) * | 1970-08-04 | 1973-09-13 | Heraeus Schott Quarzschmelze Gmbh, 6450 Hanau | Quarzglasgeräteteil, insbesondere Quarzglasrohr, mit in seiner Außenoberflächenschicht enthaltenen, Kristallbildung fördernden Keimen zur Verwendung bei hohen Temperaturen, insbesondere für die Durchführung halbleitertechnologischer Verfahren |
DE2206493C3 (de) * | 1972-02-11 | 1975-01-30 | Heraeus-Schott Quarzschmelze Gmbh, 6450 Hanau | Mehrschichtiger Quarzglaskörper für die Verwendung in der Festkörpertechnologie |
DE2928089C3 (de) * | 1979-07-12 | 1982-03-04 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Verbundtiegel für halbleitertechnologische Zwecke und Verfahren zur Herstellung |
DE3014311C2 (de) * | 1980-04-15 | 1982-06-16 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Verfahren zur Herstellung von Quarzglastiegeln und Vorrichtung zur Durchführung dieses Verfahrens |
DE3128698C2 (de) * | 1981-07-21 | 1984-01-19 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Quarzglashüllrohr |
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DE3521623A1 (de) * | 1985-06-15 | 1986-12-18 | Heraeus Quarzschmelze Gmbh, 6450 Hanau | Verfahren zum kontinuierlichen aufbau eines im innern traegerfreien, hohlzylindrischen sootkoerpers |
US4632686A (en) * | 1986-02-24 | 1986-12-30 | Gte Products Corporation | Method of manufacturing quartz glass crucibles with low bubble content |
US4713104A (en) * | 1986-03-31 | 1987-12-15 | Gte Products Corporation | Quartz glass crucibles |
-
1988
- 1988-12-01 US US07/278,591 patent/US4935046A/en not_active Expired - Lifetime
- 1988-12-02 DE DE3888797T patent/DE3888797T2/de not_active Expired - Lifetime
- 1988-12-02 EP EP19880120166 patent/EP0319031B1/de not_active Expired - Lifetime
-
1989
- 1989-07-06 US US07/376,136 patent/US4956208A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4956208A (en) | 1990-09-11 |
EP0319031A2 (de) | 1989-06-07 |
EP0319031A3 (en) | 1990-08-01 |
DE3888797T2 (de) | 1994-07-28 |
EP0319031B1 (de) | 1994-03-30 |
US4935046A (en) | 1990-06-19 |
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