DE3853869T2 - Vorrichtung und Verfahren für den Siebdruck auf Platten. - Google Patents

Vorrichtung und Verfahren für den Siebdruck auf Platten.

Info

Publication number
DE3853869T2
DE3853869T2 DE3853869T DE3853869T DE3853869T2 DE 3853869 T2 DE3853869 T2 DE 3853869T2 DE 3853869 T DE3853869 T DE 3853869T DE 3853869 T DE3853869 T DE 3853869T DE 3853869 T2 DE3853869 T2 DE 3853869T2
Authority
DE
Germany
Prior art keywords
plates
screen printing
printing
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3853869T
Other languages
English (en)
Other versions
DE3853869D1 (de
Inventor
Shiro Ichinose
Kazuo Segawa
Kunio Katsuuma
Hideo Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshin Kogyo Co Ltd
Satosen Co Ltd
Original Assignee
Toshin Kogyo Co Ltd
Satosen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29384187A external-priority patent/JPH01134992A/ja
Priority claimed from JP29384087A external-priority patent/JPH01134991A/ja
Priority claimed from JP29383987A external-priority patent/JPH01134990A/ja
Priority claimed from JP29383887A external-priority patent/JPH01134989A/ja
Priority claimed from JP29384287A external-priority patent/JPH01134993A/ja
Priority claimed from JP30052887A external-priority patent/JPH0242791A/ja
Priority claimed from JP1987181743U external-priority patent/JPH0184466U/ja
Priority claimed from JP30052987A external-priority patent/JPH01140794A/ja
Priority claimed from JP18484787U external-priority patent/JPH0189129U/ja
Application filed by Toshin Kogyo Co Ltd, Satosen Co Ltd filed Critical Toshin Kogyo Co Ltd
Publication of DE3853869D1 publication Critical patent/DE3853869D1/de
Publication of DE3853869T2 publication Critical patent/DE3853869T2/de
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE3853869T 1987-11-19 1988-11-18 Vorrichtung und Verfahren für den Siebdruck auf Platten. Expired - Fee Related DE3853869T2 (de)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP29384287A JPH01134993A (ja) 1987-11-19 1987-11-19 プリント配線用基板の印刷法
JP29384187A JPH01134992A (ja) 1987-11-19 1987-11-19 プリント配線用基板の印刷法
JP29383887A JPH01134989A (ja) 1987-11-19 1987-11-19 プリント配線用基板の印刷法
JP29383987A JPH01134990A (ja) 1987-11-19 1987-11-19 プリント配線用基板の印刷法
JP29384087A JPH01134991A (ja) 1987-11-19 1987-11-19 プリント配線用基板の印刷法
JP30052887A JPH0242791A (ja) 1987-11-27 1987-11-27 プリント配線用基板のスクリーン印刷機
JP1987181743U JPH0184466U (de) 1987-11-27 1987-11-27
JP30052987A JPH01140794A (ja) 1987-11-27 1987-11-27 プリント配線用基板のスクリーン印刷機
JP18484787U JPH0189129U (de) 1987-12-03 1987-12-03

Publications (2)

Publication Number Publication Date
DE3853869D1 DE3853869D1 (de) 1995-06-29
DE3853869T2 true DE3853869T2 (de) 1995-09-21

Family

ID=27577548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3853869T Expired - Fee Related DE3853869T2 (de) 1987-11-19 1988-11-18 Vorrichtung und Verfahren für den Siebdruck auf Platten.

Country Status (3)

Country Link
US (1) US4937097A (de)
EP (1) EP0316947B1 (de)
DE (1) DE3853869T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8911670U1 (de) * 1989-09-30 1990-03-29 Messerschmitt, Elmar, Dr., 8000 München Beschichtungsmaschine für Siebdruckgewebe
JPH0769614B2 (ja) * 1989-11-13 1995-07-31 東海商事株式会社 スクリーン印刷用乳剤塗布、乳剤フィルム貼付両用機
US5070782A (en) * 1990-06-07 1991-12-10 Tokai Shoji Co., Ltd. Screen printer
DE4020215A1 (de) * 1990-06-25 1992-01-09 Alt Peter Einrichtung zum bedrucken von plattenfoermigen gegenstaenden
US5265531A (en) * 1991-08-27 1993-11-30 John Cronin Reciprocally shuttled double sided screener with tiltable print squeegee
US5611274A (en) * 1993-05-19 1997-03-18 Tani Denkikogyo Co., Ltd. Apparatus for screen printing of viscous materials
CH686499A5 (de) * 1994-04-25 1996-04-15 Sutter Apparatebau Ag Siebdruckverfahren, sowie Flach-Siebdruckmaschine zur Ausuebung des Verfahrens.
JPH0852856A (ja) * 1994-08-10 1996-02-27 Kengo Hiruta スクリーン印刷装置
JPH08323980A (ja) * 1995-05-30 1996-12-10 Oki Data:Kk インクジェットプリンタにおける印字ヘッドの製造方法
GB2304630B (en) * 1995-08-31 1998-05-20 Tani Denki Kogyo Kk Squeegee arrangement for screen printing
US5845572A (en) * 1995-11-06 1998-12-08 Circuit Automation, Inc. Circuit board screener spot suppressor
JP2896343B2 (ja) * 1996-05-14 1999-05-31 谷電機工業株式会社 印刷用スキージー装置
JP3558463B2 (ja) * 1996-09-06 2004-08-25 松下電器産業株式会社 印刷方法及び印刷機
US6395335B2 (en) * 1996-12-10 2002-05-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for printing solder paste
IT1296096B1 (it) * 1997-11-11 1999-06-09 Pri Te Ma S R L Dispositivo per il sostegno di una piastra di supporto per circuiti stampati durante la fase di stampa serigrafica
JP2000263752A (ja) * 1999-01-11 2000-09-26 Micro Tekku Kk スクリーン印刷機及びスクリーン印刷方法
US6234077B1 (en) 1999-02-26 2001-05-22 Micron Technology, Inc. Method and apparatus for screen printing
US7614341B1 (en) * 2004-03-12 2009-11-10 General Dynamics Advanced Information Systems, Inc. Apparatus and method for a segmented squeegee for stenciling
US20050268799A1 (en) * 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
US20120216691A1 (en) * 2009-09-03 2012-08-30 Applied Materials, Inc. Blade for silk-screen printing on a print support
ITVI20110122A1 (it) * 2011-05-13 2012-11-14 St Microelectronics Srl Metodo e apparato per la fabbricazione di lead frames

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1299660B (de) * 1968-02-20 1969-07-24 Siemens Ag Verfahren zur Herstellung von doppelseitigem Siebdruck und Vorrichtung hierfuer
US3943849A (en) * 1973-09-13 1976-03-16 Michael Vasilantone Squeegee with sweep-movement capability
US4275655A (en) * 1979-01-23 1981-06-30 The Arnold Engineering Company Method and apparatus for screen printing registered images on opposite sides of a web
JPS5646755A (en) * 1979-09-26 1981-04-28 Suzuki Kiichi Method to obtain novel thick plastic printing layer
JPS6048044A (ja) * 1983-08-27 1985-03-15 Tokai Shoji Kk スクリ−ン印版への乳剤の塗布方法及びその塗布装置
JPS61209158A (ja) * 1985-03-13 1986-09-17 Rohm Co Ltd スクリ−ン印刷方法及びスクリ−ン印刷装置
JPS61283543A (ja) * 1985-06-10 1986-12-13 Hajime Watanabe スクリ−ン立刷り印刷法およびその印刷装置
JPS6359534A (ja) * 1986-08-29 1988-03-15 Matsushita Electric Ind Co Ltd スクリ−ン印刷装置のクリ−ニングロ−ラ
JPS63125335A (ja) * 1986-11-14 1988-05-28 Nitsuko Corp 印刷方法
JPS63270146A (ja) * 1987-04-30 1988-11-08 Toshin Kogyo Kk プリント方法及び装置

Also Published As

Publication number Publication date
US4937097A (en) 1990-06-26
DE3853869D1 (de) 1995-06-29
EP0316947A2 (de) 1989-05-24
EP0316947B1 (de) 1995-05-24
EP0316947A3 (en) 1990-07-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee